GB791491A - Improvements relating to semi-conductor rectifiers - Google Patents

Improvements relating to semi-conductor rectifiers

Info

Publication number
GB791491A
GB791491A GB21049/56A GB2104956A GB791491A GB 791491 A GB791491 A GB 791491A GB 21049/56 A GB21049/56 A GB 21049/56A GB 2104956 A GB2104956 A GB 2104956A GB 791491 A GB791491 A GB 791491A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor rectifiers
july
contact
masses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21049/56A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Compagnie Francaise Thomson Houston SA
Original Assignee
Compagnie Francaise Thomson Houston SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Compagnie Francaise Thomson Houston SA filed Critical Compagnie Francaise Thomson Houston SA
Publication of GB791491A publication Critical patent/GB791491A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/117—Stacked arrangements of devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB21049/56A 1955-07-06 1956-07-06 Improvements relating to semi-conductor rectifiers Expired GB791491A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1188729X 1955-07-06

Publications (1)

Publication Number Publication Date
GB791491A true GB791491A (en) 1958-03-05

Family

ID=9665441

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21049/56A Expired GB791491A (en) 1955-07-06 1956-07-06 Improvements relating to semi-conductor rectifiers

Country Status (5)

Country Link
BE (1) BE549283A (fr)
DE (1) DE1188729B (fr)
FR (1) FR1137395A (fr)
GB (1) GB791491A (fr)
NL (2) NL208738A (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1106423B (de) * 1959-06-23 1961-05-10 Licentia Gmbh Kuehlkoerper fuer Halbleitergleichrichter
DE1277446B (de) * 1966-08-26 1968-09-12 Siemens Ag Verfahren zum Herstellen von Halbleiterbauelementen mit vollstaendig gekapseltem Halbleiterelement
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3942586A (en) * 1973-08-14 1976-03-09 Siemens Aktiengesellschaft Cooling arrangement for flat semiconductor components
US3989099A (en) * 1974-03-16 1976-11-02 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for semiconductor device
US4020399A (en) * 1974-03-15 1977-04-26 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for dissipating heat of semiconductor elements
US4023616A (en) * 1974-04-08 1977-05-17 Siemens Aktiengesellschaft Thyristor cooling arrangement
US4044396A (en) * 1975-08-14 1977-08-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe cooling of airborne phased array radar

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1346157A (en) * 1971-02-13 1974-02-06 Bbc Brown Boveri & Cie Cooling apparatus for a thyristor
DE3040869A1 (de) * 1980-10-30 1982-06-16 Robert Bosch Gmbh, 7000 Stuttgart Scheinwerfer fuer fahrzeuge, insbesondere kraftfahrzeug-scheinwerfer

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE891425C (de) * 1938-09-28 1953-09-28 Aeg Einrichtung zum Betrieb von Trockengleichrichtern
NL180221B (nl) * 1952-07-29 Charbonnages Ste Chimique Werkwijze ter bereiding van een polyaminoamidehardingsmiddel voor epoxyharsen; werkwijze ter bereiding van een in water verdeeld hardingsmiddel; werkwijze ter bereiding van een epoxyharssamenstelling die een dergelijk hardingsmiddel bevat alsmede voorwerp voorzien van een bekledingslaag verkregen uit een dergelijke epoxyharssamenstelling.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1106423B (de) * 1959-06-23 1961-05-10 Licentia Gmbh Kuehlkoerper fuer Halbleitergleichrichter
DE1277446B (de) * 1966-08-26 1968-09-12 Siemens Ag Verfahren zum Herstellen von Halbleiterbauelementen mit vollstaendig gekapseltem Halbleiterelement
US3651865A (en) * 1970-08-21 1972-03-28 Us Air Force Cooled electronic equipment mounting plate
US3942586A (en) * 1973-08-14 1976-03-09 Siemens Aktiengesellschaft Cooling arrangement for flat semiconductor components
US4020399A (en) * 1974-03-15 1977-04-26 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for dissipating heat of semiconductor elements
US3989099A (en) * 1974-03-16 1976-11-02 Mitsubishi Denki Kabushiki Kaisha Vapor cooling device for semiconductor device
US4023616A (en) * 1974-04-08 1977-05-17 Siemens Aktiengesellschaft Thyristor cooling arrangement
US4044396A (en) * 1975-08-14 1977-08-23 The United States Of America As Represented By The Secretary Of The Air Force Heat pipe cooling of airborne phased array radar

Also Published As

Publication number Publication date
BE549283A (fr)
DE1188729B (de) 1965-03-11
FR1137395A (fr) 1957-05-28
NL96632C (fr)
NL208738A (fr)

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