GB785467A - Improvements in or relating to the manufacture of semi-conductor devices - Google Patents

Improvements in or relating to the manufacture of semi-conductor devices

Info

Publication number
GB785467A
GB785467A GB37200/54A GB3720054A GB785467A GB 785467 A GB785467 A GB 785467A GB 37200/54 A GB37200/54 A GB 37200/54A GB 3720054 A GB3720054 A GB 3720054A GB 785467 A GB785467 A GB 785467A
Authority
GB
United Kingdom
Prior art keywords
germanium
indium
punch
plate
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37200/54A
Other languages
English (en)
Inventor
Ian Douglas Colson
Ralph David Knott
Michael Rupert Platten Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB37200/54A priority Critical patent/GB785467A/en
Priority to US554010A priority patent/US2830920A/en
Priority to FR1140519D priority patent/FR1140519A/fr
Priority to CH338906D priority patent/CH338906A/de
Publication of GB785467A publication Critical patent/GB785467A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Joining Of Glass To Other Materials (AREA)
GB37200/54A 1954-12-23 1954-12-23 Improvements in or relating to the manufacture of semi-conductor devices Expired GB785467A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB37200/54A GB785467A (en) 1954-12-23 1954-12-23 Improvements in or relating to the manufacture of semi-conductor devices
US554010A US2830920A (en) 1954-12-23 1955-12-19 Manufacture of semi-conductor devices
FR1140519D FR1140519A (fr) 1954-12-23 1955-12-20 Fabrication de semi-conducteurs
CH338906D CH338906A (de) 1954-12-23 1955-12-23 Verfahren zur Herstellung einer Halbleitervorrichtung und gemäss diesem Verfahren hergestellte Halbleitervorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB37200/54A GB785467A (en) 1954-12-23 1954-12-23 Improvements in or relating to the manufacture of semi-conductor devices

Publications (1)

Publication Number Publication Date
GB785467A true GB785467A (en) 1957-10-30

Family

ID=10394592

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37200/54A Expired GB785467A (en) 1954-12-23 1954-12-23 Improvements in or relating to the manufacture of semi-conductor devices

Country Status (4)

Country Link
US (1) US2830920A (de)
CH (1) CH338906A (de)
FR (1) FR1140519A (de)
GB (1) GB785467A (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1098102B (de) * 1951-06-08 1961-01-26 Standard Elektrik Lorenz Ag Verfahren zur Herstellung einer elektrischen Halbleitervorrichtung
CN115655832A (zh) * 2022-12-09 2023-01-31 华芯半导体研究院(北京)有限公司 一种化合物半导体外延片霍尔样品制备装置

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1446221A1 (de) * 1951-01-28 1969-09-25 Philips Patentverwaltung Verfahren zum Benetzen und Verbinden von Halbleitern und Metallen mit Halbleitern und Metallen
BE557039A (de) * 1956-04-27
US2914716A (en) * 1956-05-25 1959-11-24 Gen Electric Semiconductor mounting
US2943005A (en) * 1957-01-17 1960-06-28 Rca Corp Method of alloying semiconductor material
US2981875A (en) * 1957-10-07 1961-04-25 Motorola Inc Semiconductor device and method of making the same
US3090116A (en) * 1957-11-04 1963-05-21 Gen Electric Co Ltd Method of cold bonding metallic parts
US2947925A (en) * 1958-02-21 1960-08-02 Motorola Inc Transistor and method of making the same
US3080510A (en) * 1959-01-19 1963-03-05 Rauland Corp Semi-conductor mounting apparatus
NL252974A (de) * 1959-07-24
GB928110A (en) * 1960-01-06 1963-06-06 Pacific Semiconductors Inc Semiconductor devices and methods for assembling them
US3186065A (en) * 1960-06-10 1965-06-01 Sylvania Electric Prod Semiconductor device and method of manufacture
US3030561A (en) * 1960-07-01 1962-04-17 Sprague Electric Co Transistors and method of making
US3217213A (en) * 1961-06-02 1965-11-09 Slater Electric Inc Semiconductor diode construction with heat dissipating housing
US3134699A (en) * 1961-07-25 1964-05-26 Nippon Electric Co Method of manufacturing semiconductor devices
US3363308A (en) * 1962-07-30 1968-01-16 Texas Instruments Inc Diode contact arrangement
US3358364A (en) * 1963-04-25 1967-12-19 Talon Inc Method of making electrical contacts by cold welding soldering and coining

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2697269A (en) * 1950-07-24 1954-12-21 Bell Telephone Labor Inc Method of making semiconductor translating devices
US2731704A (en) * 1952-12-27 1956-01-24 Raytheon Mfg Co Method of making transistors

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1098102B (de) * 1951-06-08 1961-01-26 Standard Elektrik Lorenz Ag Verfahren zur Herstellung einer elektrischen Halbleitervorrichtung
CN115655832A (zh) * 2022-12-09 2023-01-31 华芯半导体研究院(北京)有限公司 一种化合物半导体外延片霍尔样品制备装置

Also Published As

Publication number Publication date
CH338906A (de) 1959-06-15
US2830920A (en) 1958-04-15
FR1140519A (fr) 1957-07-24

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