GB637525A - Method of producing conducting circuits - Google Patents

Method of producing conducting circuits

Info

Publication number
GB637525A
GB637525A GB14697/47A GB1469747A GB637525A GB 637525 A GB637525 A GB 637525A GB 14697/47 A GB14697/47 A GB 14697/47A GB 1469747 A GB1469747 A GB 1469747A GB 637525 A GB637525 A GB 637525A
Authority
GB
United Kingdom
Prior art keywords
sensitive layer
light
portions
resist
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB14697/47A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bendix Aviation Corp
Original Assignee
Bendix Aviation Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bendix Aviation Corp filed Critical Bendix Aviation Corp
Publication of GB637525A publication Critical patent/GB637525A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/08—Electrodes intimately associated with a screen on or from which an image or pattern is formed, picked-up, converted or stored, e.g. backing-plates for storage tubes or collecting secondary electrons
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

637,525. Printed circuits. BENDIX AVIATION CORPORATION. June 3, 1947, No. 14607. Convention date, June 8, 1946. [Class 36] [Also in Group XXXVII] Electrical circuits are made by depositing a thin layer of conducting material on the surface of an insulating body, applying a light-sensitive layer thereon, impressing an image of the desired circuit on to the sensitive layer, removing those parts of the sensitive layer which are not covered by the image, removing the thus exposed conductive portions by abrasion and finally removing the remaining parts of the light-sensitive layer, leaving the desired conductive pattern on the insulating block. A resist coating such as asphalt paint may be applied to the conductive surface prior to the application of the sensitive layer. This resist acts as a cushion during the abrading action and later facilitates the removal of these areas of the light-sensitive layer which overlie the electric conductor pattern. The surface of an insulating block 13, Fig. 4, is covered with a thin conductive layer 15 over which is applied a resist layer 16 and a light-sensitive layer 17. This material may be either of the type that softens on exposure to light, or of the type that hardens on exposure to light. A photographically positive or negative image of the circuit is then laid over the sensitive layer, according to whether it is of the former or the latter type and an exposure made. The soft portions 18 are then removed by washing, leaving the hard portions 19 in position (Fig. 5). The surface is then subjected to an abrasive blast which removes the unprotected portions of the resist and metal layers 16, 15, Fig. 6. The remaining portions of the light-sensitive layer 17 (hard portions) and resist 16 are then removed by a suitable solvent which does not affect the conductive pattern, and leaves it in the desired position 10 on the block 13, Fig. 7. The surface 11 of the block may finally be treated to remove any irregularities thereon. Terminals may be provided which extend through the block 13 and contact at desired points with the circuit pattern. Specification 573,771, [Group XX], is referred to.
GB14697/47A 1946-06-08 1947-06-03 Method of producing conducting circuits Expired GB637525A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US637525XA 1946-06-08 1946-06-08

Publications (1)

Publication Number Publication Date
GB637525A true GB637525A (en) 1950-05-24

Family

ID=22051257

Family Applications (1)

Application Number Title Priority Date Filing Date
GB14697/47A Expired GB637525A (en) 1946-06-08 1947-06-03 Method of producing conducting circuits

Country Status (1)

Country Link
GB (1) GB637525A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0198928A1 (en) * 1982-03-05 1986-10-29 E.I. Du Pont De Nemours And Company Fabrication of a printed circuit board with metal-filled channels
EP0471386A2 (en) * 1984-11-02 1992-02-19 Amp-Akzo Corporation Process for the preparation of conductive patterns on thermoplastic polymer base substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0198928A1 (en) * 1982-03-05 1986-10-29 E.I. Du Pont De Nemours And Company Fabrication of a printed circuit board with metal-filled channels
EP0471386A2 (en) * 1984-11-02 1992-02-19 Amp-Akzo Corporation Process for the preparation of conductive patterns on thermoplastic polymer base substrates
EP0471386A3 (en) * 1984-11-02 1993-04-21 Amp-Akzo Corporation Process for the preparation of conductive patterns on thermoplastic polymer base substrates

Similar Documents

Publication Publication Date Title
US2443119A (en) Process of producing predetermined metallic patterns
US3075866A (en) Method of making printed circuits
ES483987A1 (en) Fabrication of integrated circuits utilizing thick high-resolution patterns
ES209005A1 (en) Method of soldering printed circuits
US4232059A (en) Process of defining film patterns on microelectronic substrates by air abrading
US3745094A (en) Two resist method for printed circuit structure
GB637525A (en) Method of producing conducting circuits
DE3377454D1 (en) Method and apparatus for the selective and self-adjusting deposition of metal layers and application of this method
GB2040101A (en) Method of fabricating printed ciurcuits
US4172757A (en) Process for making electrode with integral dielectric layer
SU375821A1 (en)
GB1187916A (en) Multilayer Printed Circuit Board and Method for Manufacturing Same.
JPH02290095A (en) Manufacture of multilayer interconnection board
JP2000228572A (en) Formation of terminals of flexible circuit board
JPS5820157B2 (en) How to form a circuit board
JPS5671974A (en) Insulating gate type electric field effect transistor
ES349275A1 (en) Method of making conductive circuit patterns by intaglio process
GB794020A (en) Improvements relating to printed electrical circuits
JP2661231B2 (en) Manufacturing method of printed wiring board
JPS5831529A (en) Substrate holder for electron beam exposure device
US3482974A (en) Method of plating gold films onto oxide-free silicon substrates
GB829354A (en) Improvements in or relating to electrical circuits
JPS5527639A (en) Photo-resist pattern forming method
GB794971A (en) Improvements relating to the manufacture of printed electrical circuits
JPS56135944A (en) Manufacture of semiconductor device