GB428752A - Improvements relating to machines for cutting waffles or wafers and the like - Google Patents

Abstract

428,752. Cutting waffles &c. GOHRING, E., and GOHRING & HEBENSTREIT, 62, Stosch Sarrassanistrasse, Radebeul, Dresden, Germany. Sept. 10, 1934, No. 25961. [Class 87 (ii)] In machines for cutting plastic material into waffles, wafers, or the like, comprising two tables 2, 3 arranged at right-angles, the tables having slidable push-bars 17 and transverse frames 5, 6 for spaced cutting wires 7, the frames 5, 6 have a number of vertically extending wires 7 each rendered independently adjustable by being passed round guide-pins 9 and having its ends connected to tensioning- screws 8 on the frame. The pins and screws may be mounted in slots so as to be adjustable longitudinally. The push-bars 17 may have slots therein corresponding to the spacing of the wires 7 and may be fixed each to a slidable bracket 15 as by a dovetail joint. A guideledge 18 may be fixed to the push-bar or the bracket. Holding-strips 10 are mounted on rotatable rods 11 vertically adjustable on the brackets 15. In use, the material is placed on the table 2, the strips 10 are moved down as by a handle 12, and mechanism is operated from an electric motor 4 to reciprocate the push-bar 17 and force material through the frame 6 on to the table 3. The holding-strips of that table are moved down and the corresponding push-bar operated to force the cut material through the frame 5 where it is cut again in a direction at right-angles to the previous out.