GB2580827B - Heterojunction Diode having a narrow bandgap semiconductor - Google Patents
Heterojunction Diode having a narrow bandgap semiconductor Download PDFInfo
- Publication number
- GB2580827B GB2580827B GB2004615.7A GB202004615A GB2580827B GB 2580827 B GB2580827 B GB 2580827B GB 202004615 A GB202004615 A GB 202004615A GB 2580827 B GB2580827 B GB 2580827B
- Authority
- GB
- United Kingdom
- Prior art keywords
- bandgap semiconductor
- narrow bandgap
- heterojunction diode
- heterojunction
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/045—Manufacture or treatment of PN junction diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/16—Photovoltaic cells having only PN heterojunction potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/222—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN heterojunction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2907—Materials being Group IIIA-VA materials
- H10P14/2912—Antimonides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
- H10P14/3202—Materials thereof
- H10P14/3238—Materials thereof being insulating materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3422—Antimonides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3424—Deposited materials, e.g. layers characterised by the chemical composition being Group IIB-VIA materials
- H10P14/3426—Oxides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H10P14/6339—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69391—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing aluminium, e.g. Al2O3
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/784,384 US10158039B1 (en) | 2017-10-16 | 2017-10-16 | Heterojunction diode having a narrow bandgap semiconductor |
| PCT/IB2018/057288 WO2019077424A1 (en) | 2017-10-16 | 2018-09-21 | HETEROJUNCTION DIODE HAVING A NARROW PROHIBITED BAND SEMICONDUCTOR |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB202004615D0 GB202004615D0 (en) | 2020-05-13 |
| GB2580827A GB2580827A (en) | 2020-07-29 |
| GB2580827B true GB2580827B (en) | 2022-02-23 |
Family
ID=64604839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2004615.7A Active GB2580827B (en) | 2017-10-16 | 2018-09-21 | Heterojunction Diode having a narrow bandgap semiconductor |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10158039B1 (https=) |
| JP (1) | JP7212437B2 (https=) |
| CN (1) | CN111213246B (https=) |
| DE (1) | DE112018004549T5 (https=) |
| GB (1) | GB2580827B (https=) |
| WO (1) | WO2019077424A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111952385B (zh) * | 2020-08-21 | 2022-08-02 | 中国科学院长春光学精密机械与物理研究所 | 一种二维材料极化激元与异质结结合的红外光探测器 |
| WO2024004520A1 (ja) | 2022-06-30 | 2024-01-04 | パナソニックIpマネジメント株式会社 | 二次電池用負極材料、および、二次電池 |
| CN116344659A (zh) * | 2023-01-09 | 2023-06-27 | 中国科学院半导体研究所 | 红外光电器件及其制备方法与硅基光电集成芯片 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222991A (ja) * | 2001-01-25 | 2002-08-09 | National Institute Of Advanced Industrial & Technology | 半導体発光素子 |
| CN101866999A (zh) * | 2010-05-19 | 2010-10-20 | 中国科学院半导体研究所 | 制作ZnO基异质结发光二极管的方法 |
| CN102394263A (zh) * | 2011-11-22 | 2012-03-28 | 中国科学院半导体研究所 | 增强n-ZnO/AlN/p-GaN发光二极管的电致发光性能的方法 |
| US20160093701A1 (en) * | 2014-09-30 | 2016-03-31 | International Business Machines Corporation | Doped zinc oxide as n+ layer for semiconductor devices |
| US20160240610A1 (en) * | 2015-02-12 | 2016-08-18 | International Business Machines Corporation | Junction interlayer dielectric for reducing leakage current in semiconductor devices |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2115782A1 (en) | 2007-01-30 | 2009-11-11 | Solasta, Inc. | Photovoltaic cell and method of making thereof |
| US20100116329A1 (en) | 2008-06-09 | 2010-05-13 | Fitzgerald Eugene A | Methods of forming high-efficiency solar cell structures |
| US8293628B2 (en) | 2009-05-28 | 2012-10-23 | Technion Research & Development Foundation Ltd. | Strain-controlled atomic layer epitaxy, quantum wells and superlattices prepared thereby and uses thereof |
| US7928389B1 (en) | 2009-08-20 | 2011-04-19 | Hrl Laboratories, Llc | Wide bandwidth infrared detector and imager |
| JP5392414B2 (ja) * | 2010-09-13 | 2014-01-22 | 株式会社村田製作所 | フォトダイオード、及び紫外線センサ |
| FR2982079A1 (fr) | 2011-10-28 | 2013-05-03 | Commissariat Energie Atomique | Imageur cmos utbb |
| JP2013102093A (ja) * | 2011-11-09 | 2013-05-23 | Stanley Electric Co Ltd | 半導体素子の製造方法及び半導体素子 |
| EA201201245A1 (ru) | 2012-09-14 | 2013-07-30 | Ооо "Лед Микросенсор Нт" | Способ изготовления гетероструктур (варианты) для среднего ик-диапазона, гетероструктура (варианты) и светодиод и фотодиод на основе этой гетероструктуры |
| JP6177515B2 (ja) * | 2012-10-31 | 2017-08-09 | 富士フイルム株式会社 | 半導体膜、半導体膜の製造方法、太陽電池、発光ダイオード、薄膜トランジスタ、および、電子デバイス |
| JP2014225597A (ja) * | 2013-05-17 | 2014-12-04 | 日本碍子株式会社 | 光起電力素子 |
| US9673252B1 (en) | 2014-08-13 | 2017-06-06 | Lockheed Martin Corporation | Field-assisted infrared detector with unipolar barrier |
| US9581760B2 (en) * | 2015-01-26 | 2017-02-28 | Advalue Photonics, Inc. | Rare-earth doped gain fibers |
| US9748412B2 (en) * | 2015-06-01 | 2017-08-29 | International Business Machines Corporation | Highly responsive III-V photodetectors using ZnO:Al as N-type emitter |
| US10439106B2 (en) * | 2015-06-30 | 2019-10-08 | International Business Machines Corporation | Light emitting diode with ZnO emitter |
-
2017
- 2017-10-16 US US15/784,384 patent/US10158039B1/en not_active Expired - Fee Related
-
2018
- 2018-09-21 GB GB2004615.7A patent/GB2580827B/en active Active
- 2018-09-21 JP JP2020518622A patent/JP7212437B2/ja active Active
- 2018-09-21 DE DE112018004549.8T patent/DE112018004549T5/de active Pending
- 2018-09-21 WO PCT/IB2018/057288 patent/WO2019077424A1/en not_active Ceased
- 2018-09-21 CN CN201880067071.XA patent/CN111213246B/zh not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002222991A (ja) * | 2001-01-25 | 2002-08-09 | National Institute Of Advanced Industrial & Technology | 半導体発光素子 |
| CN101866999A (zh) * | 2010-05-19 | 2010-10-20 | 中国科学院半导体研究所 | 制作ZnO基异质结发光二极管的方法 |
| CN102394263A (zh) * | 2011-11-22 | 2012-03-28 | 中国科学院半导体研究所 | 增强n-ZnO/AlN/p-GaN发光二极管的电致发光性能的方法 |
| US20160093701A1 (en) * | 2014-09-30 | 2016-03-31 | International Business Machines Corporation | Doped zinc oxide as n+ layer for semiconductor devices |
| US20160240610A1 (en) * | 2015-02-12 | 2016-08-18 | International Business Machines Corporation | Junction interlayer dielectric for reducing leakage current in semiconductor devices |
Also Published As
| Publication number | Publication date |
|---|---|
| GB202004615D0 (en) | 2020-05-13 |
| GB2580827A (en) | 2020-07-29 |
| WO2019077424A1 (en) | 2019-04-25 |
| CN111213246B (zh) | 2023-10-31 |
| CN111213246A (zh) | 2020-05-29 |
| JP7212437B2 (ja) | 2023-01-25 |
| DE112018004549T5 (de) | 2020-05-28 |
| US10158039B1 (en) | 2018-12-18 |
| JP2020537335A (ja) | 2020-12-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 746 | Register noted 'licences of right' (sect. 46/1977) |
Effective date: 20220314 |