GB2515750B - Supressing Leakage Currents in a Multi - TFT Device - Google Patents

Supressing Leakage Currents in a Multi - TFT Device

Info

Publication number
GB2515750B
GB2515750B GB1311772.6A GB201311772A GB2515750B GB 2515750 B GB2515750 B GB 2515750B GB 201311772 A GB201311772 A GB 201311772A GB 2515750 B GB2515750 B GB 2515750B
Authority
GB
United Kingdom
Prior art keywords
supressing
leakage currents
tft device
tft
currents
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1311772.6A
Other languages
English (en)
Other versions
GB201311772D0 (en
GB2515750A (en
Inventor
Riedel Stefan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FlexEnable Ltd
Original Assignee
FlexEnable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FlexEnable Ltd filed Critical FlexEnable Ltd
Priority to GB1311772.6A priority Critical patent/GB2515750B/en
Publication of GB201311772D0 publication Critical patent/GB201311772D0/en
Priority to US14/901,758 priority patent/US9748278B2/en
Priority to PCT/EP2014/063937 priority patent/WO2015000884A1/en
Priority to RU2016102696A priority patent/RU2665331C2/ru
Priority to DE112014003128.3T priority patent/DE112014003128T5/de
Priority to CN201480037535.4A priority patent/CN105393355B/zh
Publication of GB2515750A publication Critical patent/GB2515750A/en
Application granted granted Critical
Publication of GB2515750B publication Critical patent/GB2515750B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/124Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222Capacitive arrangements or effects of, or between wiring layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144Devices controlled by radiation
    • H01L27/146Imager structures
    • H01L27/14601Structural or functional details thereof
    • H01L27/14603Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78609Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device for preventing leakage current
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K17/00Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/16Modifications for eliminating interference voltages or currents
    • H03K17/161Modifications for eliminating interference voltages or currents in field-effect transistor switches
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03KPULSE TECHNIQUE
    • H03K2217/00Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/0036Means reducing energy consumption

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thin Film Transistor (AREA)
  • Ceramic Engineering (AREA)
  • Liquid Crystal (AREA)
  • Electromagnetism (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
GB1311772.6A 2013-07-01 2013-07-01 Supressing Leakage Currents in a Multi - TFT Device Active GB2515750B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB1311772.6A GB2515750B (en) 2013-07-01 2013-07-01 Supressing Leakage Currents in a Multi - TFT Device
DE112014003128.3T DE112014003128T5 (de) 2013-07-01 2014-07-01 Unterdrückung von Leckströmen in einer Mehrfach-TFT-Vorrichtung
PCT/EP2014/063937 WO2015000884A1 (en) 2013-07-01 2014-07-01 Supressing leakage currents in a multi-tft device
RU2016102696A RU2665331C2 (ru) 2013-07-01 2014-07-01 Подавление токов утечки в устройстве на тонкопленочных транзисторах
US14/901,758 US9748278B2 (en) 2013-07-01 2014-07-01 Suppressing leakage currents in a multi-TFT device
CN201480037535.4A CN105393355B (zh) 2013-07-01 2014-07-01 一种抑制多tft器件中的泄漏电流的方法和器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1311772.6A GB2515750B (en) 2013-07-01 2013-07-01 Supressing Leakage Currents in a Multi - TFT Device

Publications (3)

Publication Number Publication Date
GB201311772D0 GB201311772D0 (en) 2013-08-14
GB2515750A GB2515750A (en) 2015-01-07
GB2515750B true GB2515750B (en) 2017-11-15

Family

ID=48999330

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1311772.6A Active GB2515750B (en) 2013-07-01 2013-07-01 Supressing Leakage Currents in a Multi - TFT Device

Country Status (6)

Country Link
US (1) US9748278B2 (zh)
CN (1) CN105393355B (zh)
DE (1) DE112014003128T5 (zh)
GB (1) GB2515750B (zh)
RU (1) RU2665331C2 (zh)
WO (1) WO2015000884A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2526316B (en) * 2014-05-20 2018-10-31 Flexenable Ltd Production of transistor arrays
WO2017159613A1 (ja) * 2016-03-15 2017-09-21 シャープ株式会社 アクティブマトリクス基板

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672888A (en) * 1995-12-08 1997-09-30 Nec Corporation Thin-film transistor and thin-film transistor array
US5955765A (en) * 1996-03-15 1999-09-21 Semiconductor Energy Laboratory Co., Ltd. Thin-film dual gate, common channel semiconductor device having a single first gate and a multi-gate second gate structure
US20030148567A1 (en) * 2000-09-15 2003-08-07 Joo Seung Ki Poly-silicon thin film transistor having back bias effects and fabrication method thereof
JP2005079283A (ja) * 2003-08-29 2005-03-24 Seiko Epson Corp 薄膜半導体装置及びその製造方法、電気光学装置、並びに電子機器
JP2005136028A (ja) * 2003-10-29 2005-05-26 Casio Comput Co Ltd 静電気保護回路およびそれを備えた電子回路
KR20060118063A (ko) * 2005-05-16 2006-11-23 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이 기판 및 그 제조 방법
EP2455974A1 (en) * 2009-09-01 2012-05-23 Sharp Kabushiki Kaisha Semiconductor device, active matrix substrate, and display device

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
JPH0620140B2 (ja) * 1986-06-11 1994-03-16 株式会社日立製作所 薄膜トランジスタ
CN1115233A (zh) * 1994-07-22 1996-01-24 河南师范大学 5,5′-偶氮二水杨酸锌治疗肠炎和溃疡性结肠炎
EP1129484A1 (en) * 1999-08-24 2001-09-05 Koninklijke Philips Electronics N.V. Display device
JP4700160B2 (ja) * 2000-03-13 2011-06-15 株式会社半導体エネルギー研究所 半導体装置
US20020060321A1 (en) * 2000-07-14 2002-05-23 Kazlas Peter T. Minimally- patterned, thin-film semiconductor devices for display applications
WO2002015277A2 (en) * 2000-08-14 2002-02-21 Matrix Semiconductor, Inc. Dense arrays and charge storage devices, and methods for making same
US7230592B2 (en) * 2002-03-04 2007-06-12 Hitachi, Ltd. Organic electroluminescent light emitting display device
KR100670255B1 (ko) 2004-12-23 2007-01-16 삼성에스디아이 주식회사 박막 트랜지스터, 이를 구비한 평판표시장치, 상기 박막트랜지스터의 제조방법, 및 상기 평판 표시장치의 제조방법
US20080023703A1 (en) 2006-07-31 2008-01-31 Randy Hoffman System and method for manufacturing a thin-film device
GB0709093D0 (en) * 2007-05-11 2007-06-20 Plastic Logic Ltd Electronic device incorporating parylene within a dielectric bilayer
JP5176414B2 (ja) * 2007-07-11 2013-04-03 株式会社リコー 有機トランジスタアレイ及び表示装置
KR101567976B1 (ko) * 2009-07-23 2015-11-11 삼성전자주식회사 반도체 소자
CN102024410B (zh) * 2009-09-16 2014-10-22 株式会社半导体能源研究所 半导体装置及电子设备
JP6120530B2 (ja) * 2012-11-12 2017-04-26 キヤノン株式会社 撮像装置、および撮像システム。

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672888A (en) * 1995-12-08 1997-09-30 Nec Corporation Thin-film transistor and thin-film transistor array
US5955765A (en) * 1996-03-15 1999-09-21 Semiconductor Energy Laboratory Co., Ltd. Thin-film dual gate, common channel semiconductor device having a single first gate and a multi-gate second gate structure
US20030148567A1 (en) * 2000-09-15 2003-08-07 Joo Seung Ki Poly-silicon thin film transistor having back bias effects and fabrication method thereof
JP2005079283A (ja) * 2003-08-29 2005-03-24 Seiko Epson Corp 薄膜半導体装置及びその製造方法、電気光学装置、並びに電子機器
JP2005136028A (ja) * 2003-10-29 2005-05-26 Casio Comput Co Ltd 静電気保護回路およびそれを備えた電子回路
KR20060118063A (ko) * 2005-05-16 2006-11-23 엘지.필립스 엘시디 주식회사 액정표시장치용 어레이 기판 및 그 제조 방법
EP2455974A1 (en) * 2009-09-01 2012-05-23 Sharp Kabushiki Kaisha Semiconductor device, active matrix substrate, and display device

Also Published As

Publication number Publication date
US20160372488A1 (en) 2016-12-22
WO2015000884A1 (en) 2015-01-08
GB201311772D0 (en) 2013-08-14
RU2665331C2 (ru) 2018-08-29
CN105393355A (zh) 2016-03-09
US9748278B2 (en) 2017-08-29
CN105393355B (zh) 2019-08-06
RU2016102696A (ru) 2017-08-07
DE112014003128T5 (de) 2016-03-31
GB2515750A (en) 2015-01-07

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