GB2467776A8 - - Google Patents

Info

Publication number
GB2467776A8
GB2467776A8 GB0902479A GB0902479A GB2467776A8 GB 2467776 A8 GB2467776 A8 GB 2467776A8 GB 0902479 A GB0902479 A GB 0902479A GB 0902479 A GB0902479 A GB 0902479A GB 2467776 A8 GB2467776 A8 GB 2467776A8
Authority
GB
United Kingdom
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0902479A
Other languages
English (en)
Other versions
GB0902479D0 (en
GB2467776A (en
Inventor
Anthony Traynor
Neil Sinclair Rankin
Colin Roberts Jenkins
Tsjerk Hoekstra
Richard Laming
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cirrus Logic International UK Ltd
Original Assignee
Wolfson Microelectronics PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wolfson Microelectronics PLC filed Critical Wolfson Microelectronics PLC
Priority to GB0902479A priority Critical patent/GB2467776A/en
Publication of GB0902479D0 publication Critical patent/GB0902479D0/en
Priority to PCT/GB2010/050233 priority patent/WO2010092399A2/fr
Publication of GB2467776A publication Critical patent/GB2467776A/en
Publication of GB2467776A8 publication Critical patent/GB2467776A8/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
GB0902479A 2009-02-13 2009-02-13 Integrated MEMS transducer and circuitry Withdrawn GB2467776A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB0902479A GB2467776A (en) 2009-02-13 2009-02-13 Integrated MEMS transducer and circuitry
PCT/GB2010/050233 WO2010092399A2 (fr) 2009-02-13 2010-02-12 Transducteur mems intégré et circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0902479A GB2467776A (en) 2009-02-13 2009-02-13 Integrated MEMS transducer and circuitry

Publications (3)

Publication Number Publication Date
GB0902479D0 GB0902479D0 (en) 2009-04-01
GB2467776A GB2467776A (en) 2010-08-18
GB2467776A8 true GB2467776A8 (fr) 2010-09-01

Family

ID=40548201

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0902479A Withdrawn GB2467776A (en) 2009-02-13 2009-02-13 Integrated MEMS transducer and circuitry

Country Status (2)

Country Link
GB (1) GB2467776A (fr)
WO (1) WO2010092399A2 (fr)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102086019B (zh) * 2010-11-02 2013-04-17 中国电子科技集团公司第二十四研究所 多晶硅悬梁结构的单片制造方法
US9540232B2 (en) 2010-11-12 2017-01-10 MCube Inc. Method and structure of MEMS WLCSP fabrication
US9276080B2 (en) * 2012-03-09 2016-03-01 Mcube, Inc. Methods and structures of integrated MEMS-CMOS devices
US9181087B2 (en) 2011-03-02 2015-11-10 Epcos Ag Flat back plate
JP6245989B2 (ja) * 2011-03-04 2017-12-13 Tdk株式会社 マイクロフォン及び２つのバックプレート間で膜を位置決めする方法
US9148726B2 (en) 2011-09-12 2015-09-29 Infineon Technologies Ag Micro electrical mechanical system with bending deflection of backplate structure
FR2983189B1 (fr) * 2011-11-30 2014-02-07 Commissariat Energie Atomique Procede de realisation d'une structure comportant au moins une partie active presentant des zones d'epaisseurs differentes
US9249012B2 (en) 2013-01-25 2016-02-02 Mcube, Inc. Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures
US10036635B2 (en) 2013-01-25 2018-07-31 MCube Inc. Multi-axis MEMS rate sensor device
US10132630B2 (en) 2013-01-25 2018-11-20 MCube Inc. Multi-axis integrated MEMS inertial sensing device on single packaged chip
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
US10913653B2 (en) 2013-03-07 2021-02-09 MCube Inc. Method of fabricating MEMS devices using plasma etching and device therefor
US10046964B2 (en) 2013-03-07 2018-08-14 MCube Inc. MEMS structure with improved shielding and method
US9079761B2 (en) * 2013-03-14 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. Stacked semiconductor device and method of forming the same related cases
EP2969914B1 (fr) 2013-03-15 2020-01-01 Butterfly Network Inc. Transducteurs ultrasonores à semi-conducteur complémentaire à l'oxyde de métal (cmos) et leurs procédés de formation
WO2014193954A1 (fr) * 2013-05-28 2014-12-04 Robert Bosch Gmbh Plaque arrière composite multicouche pour microphone micromécanique
US9510103B2 (en) 2013-09-09 2016-11-29 Audio Pixels Ltd. Microelectromechanical apparatus for generating a physical effect
AU2015247484B2 (en) 2014-04-18 2020-05-14 Butterfly Network, Inc. Ultrasonic transducers in complementary metal oxide semiconductor (CMOS) wafers and related apparatus and methods
DE102014106220B4 (de) * 2014-05-05 2020-06-18 Tdk Corporation Sensorbauelement mit zwei Sensorfunktionen
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
GB2528872B (en) 2014-07-31 2018-10-31 Cirrus Logic Int Semiconductor Ltd Integrated MEMS transducer and circuitry
GB2549876A (en) * 2014-12-23 2017-11-01 Cirrus Logic Int Semiconductor Ltd Mems transducer package
US9862600B2 (en) 2015-05-21 2018-01-09 Ams International Ag Chip structure
CN107852555B (zh) 2015-07-22 2020-03-13 音频像素有限公司 Dsr扬声器元件及制造dsr扬声器元件的方法
US10567883B2 (en) 2015-07-22 2020-02-18 Audio Pixels Ltd. Piezo-electric actuators
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
GB2547729B (en) * 2016-02-29 2020-01-22 Cirrus Logic Int Semiconductor Ltd Integrated MEMS transducer and circuitry
US10358340B2 (en) * 2016-04-28 2019-07-23 Globalfoundries Singapore Pte. Ltd. Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices
DE102016123130B4 (de) 2016-11-30 2020-12-10 Infineon Technologies Austria Ag MEMS-Vorrichtung und Verfahren zum Herstellen einer MEMS-Vorrichtung
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
GB2561403A (en) 2017-04-13 2018-10-17 Cirrus Logic Int Semiconductor Ltd MEMS Device
AU2018289454A1 (en) 2017-06-21 2019-12-05 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
CN108666412A (zh) * 2018-05-31 2018-10-16 歌尔股份有限公司 一种mems麦克风和气压传感器集成结构及其制作方法
CN110248288A (zh) * 2019-06-11 2019-09-17 东莞泉声电子有限公司 复合喇叭膜片及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5717631A (en) 1995-07-21 1998-02-10 Carnegie Mellon University Microelectromechanical structure and process of making same
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
DE19648424C1 (de) * 1996-11-22 1998-06-25 Siemens Ag Mikromechanischer Sensor
JP2002522248A (ja) * 1998-08-11 2002-07-23 インフィネオン テクノロジース アクチエンゲゼルシャフト マイクロメカニックセンサ及びそれを製作する方法
US6829131B1 (en) 1999-09-13 2004-12-07 Carnegie Mellon University MEMS digital-to-acoustic transducer with error cancellation
US6987859B2 (en) * 2001-07-20 2006-01-17 Knowles Electronics, Llc. Raised microstructure of silicon based device
JP2002131161A (ja) * 2000-10-27 2002-05-09 Denso Corp 半導体圧力センサ
US6472243B2 (en) * 2000-12-11 2002-10-29 Motorola, Inc. Method of forming an integrated CMOS capacitive pressure sensor
GB0107404D0 (en) * 2001-03-23 2001-05-16 Koninkl Philips Electronics Nv Display substrate and display device
US20030210799A1 (en) * 2002-05-10 2003-11-13 Gabriel Kaigham J. Multiple membrane structure and method of manufacture
JP4724488B2 (ja) * 2005-02-25 2011-07-13 日立オートモティブシステムズ株式会社 集積化マイクロエレクトロメカニカルシステム
GB2435544B (en) 2006-02-24 2008-11-19 Oligon Ltd Mems device
GB0605576D0 (en) 2006-03-20 2006-04-26 Oligon Ltd MEMS device
DE102006022378A1 (de) * 2006-05-12 2007-11-22 Robert Bosch Gmbh Verfahren zur Herstellung eines mikromechanischen Bauelements und mikromechanisches Bauelement

Also Published As

Publication number Publication date
GB0902479D0 (en) 2009-04-01
GB2467776A (en) 2010-08-18
WO2010092399A2 (fr) 2010-08-19
WO2010092399A3 (fr) 2011-05-05

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)