GB0902479D0 - Integrated Mems transducer and circuitry - Google Patents
Integrated Mems transducer and circuitryInfo
- Publication number
- GB0902479D0 GB0902479D0 GBGB0902479.5A GB0902479A GB0902479D0 GB 0902479 D0 GB0902479 D0 GB 0902479D0 GB 0902479 A GB0902479 A GB 0902479A GB 0902479 D0 GB0902479 D0 GB 0902479D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuitry
- mems transducer
- integrated mems
- integrated
- transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0257—Microphones or microspeakers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/006—Interconnection of transducer parts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0902479A GB2467776A (en) | 2009-02-13 | 2009-02-13 | Integrated MEMS transducer and circuitry |
PCT/GB2010/050233 WO2010092399A2 (en) | 2009-02-13 | 2010-02-12 | Integrated mems transducer and circuitry |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0902479A GB2467776A (en) | 2009-02-13 | 2009-02-13 | Integrated MEMS transducer and circuitry |
Publications (3)
Publication Number | Publication Date |
---|---|
GB0902479D0 true GB0902479D0 (en) | 2009-04-01 |
GB2467776A GB2467776A (en) | 2010-08-18 |
GB2467776A8 GB2467776A8 (en) | 2010-09-01 |
Family
ID=40548201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB0902479A Withdrawn GB2467776A (en) | 2009-02-13 | 2009-02-13 | Integrated MEMS transducer and circuitry |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB2467776A (en) |
WO (1) | WO2010092399A2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105247890B (en) * | 2013-05-28 | 2019-03-29 | 罗伯特·博世有限公司 | Multi-layer combined backboard for micromachined microphones |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102086019B (en) * | 2010-11-02 | 2013-04-17 | 中国电子科技集团公司第二十四研究所 | Method for manufacturing monolithic polysilicon cantilever structure |
US9540232B2 (en) | 2010-11-12 | 2017-01-10 | MCube Inc. | Method and structure of MEMS WLCSP fabrication |
US9276080B2 (en) | 2012-03-09 | 2016-03-01 | Mcube, Inc. | Methods and structures of integrated MEMS-CMOS devices |
US9181087B2 (en) | 2011-03-02 | 2015-11-10 | Epcos Ag | Flat back plate |
CN106231519B (en) * | 2011-03-04 | 2019-09-03 | Tdk株式会社 | Microphone |
US9148726B2 (en) | 2011-09-12 | 2015-09-29 | Infineon Technologies Ag | Micro electrical mechanical system with bending deflection of backplate structure |
FR2983189B1 (en) | 2011-11-30 | 2014-02-07 | Commissariat Energie Atomique | METHOD FOR PRODUCING A STRUCTURE COMPRISING AT LEAST ONE ACTIVE PART HAVING DIFFERENT THICKNESS AREAS |
US9249012B2 (en) | 2013-01-25 | 2016-02-02 | Mcube, Inc. | Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures |
US10036635B2 (en) | 2013-01-25 | 2018-07-31 | MCube Inc. | Multi-axis MEMS rate sensor device |
US10132630B2 (en) | 2013-01-25 | 2018-11-20 | MCube Inc. | Multi-axis integrated MEMS inertial sensing device on single packaged chip |
US9499392B2 (en) | 2013-02-05 | 2016-11-22 | Butterfly Network, Inc. | CMOS ultrasonic transducers and related apparatus and methods |
US10913653B2 (en) | 2013-03-07 | 2021-02-09 | MCube Inc. | Method of fabricating MEMS devices using plasma etching and device therefor |
US10046964B2 (en) | 2013-03-07 | 2018-08-14 | MCube Inc. | MEMS structure with improved shielding and method |
US9079761B2 (en) * | 2013-03-14 | 2015-07-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked semiconductor device and method of forming the same related cases |
AU2014234071B2 (en) | 2013-03-15 | 2018-05-17 | Butterfly Network, Inc. | Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same |
US9510103B2 (en) | 2013-09-09 | 2016-11-29 | Audio Pixels Ltd. | Microelectromechanical apparatus for generating a physical effect |
EP3132470B1 (en) * | 2014-04-18 | 2019-02-06 | Butterfly Network Inc. | Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods |
DE102014106220B4 (en) * | 2014-05-05 | 2020-06-18 | Tdk Corporation | Sensor component with two sensor functions |
US9067779B1 (en) * | 2014-07-14 | 2015-06-30 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
GB2528872B (en) * | 2014-07-31 | 2018-10-31 | Cirrus Logic Int Semiconductor Ltd | Integrated MEMS transducer and circuitry |
WO2016102922A1 (en) * | 2014-12-23 | 2016-06-30 | Cirrus Logic International Semiconductor Limited | Mems transducer package |
US9862600B2 (en) | 2015-05-21 | 2018-01-09 | Ams International Ag | Chip structure |
WO2017013665A1 (en) * | 2015-07-22 | 2017-01-26 | Audio Pixels Ltd. | Dsr speaker elements and methods of manufacturing thereof |
US10567883B2 (en) | 2015-07-22 | 2020-02-18 | Audio Pixels Ltd. | Piezo-electric actuators |
US9987661B2 (en) | 2015-12-02 | 2018-06-05 | Butterfly Network, Inc. | Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods |
GB2547729B (en) * | 2016-02-29 | 2020-01-22 | Cirrus Logic Int Semiconductor Ltd | Integrated MEMS transducer and circuitry |
US10358340B2 (en) | 2016-04-28 | 2019-07-23 | Globalfoundries Singapore Pte. Ltd. | Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices |
DE102016123130B4 (en) * | 2016-11-30 | 2020-12-10 | Infineon Technologies Austria Ag | MEMS device and method of making a MEMS device |
US10196261B2 (en) | 2017-03-08 | 2019-02-05 | Butterfly Network, Inc. | Microfabricated ultrasonic transducers and related apparatus and methods |
GB2561403A (en) | 2017-04-13 | 2018-10-17 | Cirrus Logic Int Semiconductor Ltd | MEMS Device |
US10512936B2 (en) | 2017-06-21 | 2019-12-24 | Butterfly Network, Inc. | Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections |
CN108666412A (en) * | 2018-05-31 | 2018-10-16 | 歌尔股份有限公司 | A kind of MEMS microphone and baroceptor integrated morphology and preparation method thereof |
CN110248288A (en) * | 2019-06-11 | 2019-09-17 | 东莞泉声电子有限公司 | Compound horn diaphragm and preparation method thereof |
CN213280087U (en) * | 2019-12-10 | 2021-05-25 | 楼氏电子(苏州)有限公司 | Force feedback actuator and mems capacitive transducer |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5717631A (en) | 1995-07-21 | 1998-02-10 | Carnegie Mellon University | Microelectromechanical structure and process of making same |
US6012336A (en) * | 1995-09-06 | 2000-01-11 | Sandia Corporation | Capacitance pressure sensor |
DE19648424C1 (en) * | 1996-11-22 | 1998-06-25 | Siemens Ag | Micromechanical sensor |
EP1105344B1 (en) * | 1998-08-11 | 2012-04-25 | Infineon Technologies AG | Micromechanical sensor and corresponding production method |
US6829131B1 (en) | 1999-09-13 | 2004-12-07 | Carnegie Mellon University | MEMS digital-to-acoustic transducer with error cancellation |
US6987859B2 (en) * | 2001-07-20 | 2006-01-17 | Knowles Electronics, Llc. | Raised microstructure of silicon based device |
JP2002131161A (en) * | 2000-10-27 | 2002-05-09 | Denso Corp | Semiconductor pressure sensor |
US6472243B2 (en) * | 2000-12-11 | 2002-10-29 | Motorola, Inc. | Method of forming an integrated CMOS capacitive pressure sensor |
GB0107404D0 (en) * | 2001-03-23 | 2001-05-16 | Koninkl Philips Electronics Nv | Display substrate and display device |
US20030210799A1 (en) * | 2002-05-10 | 2003-11-13 | Gabriel Kaigham J. | Multiple membrane structure and method of manufacture |
JP4724488B2 (en) * | 2005-02-25 | 2011-07-13 | 日立オートモティブシステムズ株式会社 | Integrated microelectromechanical system |
GB2443756B (en) | 2006-02-24 | 2010-03-17 | Wolfson Microelectronics Plc | MEMS device |
GB0605576D0 (en) | 2006-03-20 | 2006-04-26 | Oligon Ltd | MEMS device |
DE102006022378A1 (en) * | 2006-05-12 | 2007-11-22 | Robert Bosch Gmbh | Method for producing a micromechanical component and micromechanical component |
-
2009
- 2009-02-13 GB GB0902479A patent/GB2467776A/en not_active Withdrawn
-
2010
- 2010-02-12 WO PCT/GB2010/050233 patent/WO2010092399A2/en active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105247890B (en) * | 2013-05-28 | 2019-03-29 | 罗伯特·博世有限公司 | Multi-layer combined backboard for micromachined microphones |
Also Published As
Publication number | Publication date |
---|---|
GB2467776A8 (en) | 2010-09-01 |
WO2010092399A2 (en) | 2010-08-19 |
WO2010092399A3 (en) | 2011-05-05 |
GB2467776A (en) | 2010-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |