GB2340313B - High-Frequency electronic package with arbitrarily-shaped interconnects and integral shielding - Google Patents

High-Frequency electronic package with arbitrarily-shaped interconnects and integral shielding

Info

Publication number
GB2340313B
GB2340313B GB9917830A GB9917830A GB2340313B GB 2340313 B GB2340313 B GB 2340313B GB 9917830 A GB9917830 A GB 9917830A GB 9917830 A GB9917830 A GB 9917830A GB 2340313 B GB2340313 B GB 2340313B
Authority
GB
United Kingdom
Prior art keywords
arbitrarily
electronic package
frequency electronic
integral shielding
shaped interconnects
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9917830A
Other languages
English (en)
Other versions
GB9917830D0 (en
GB2340313A (en
Inventor
Matthew K Schwiebert
Brian R Hutchison
Geary L Chew
Ron Barnett
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc, Hewlett Packard Co filed Critical Agilent Technologies Inc
Publication of GB9917830D0 publication Critical patent/GB9917830D0/en
Publication of GB2340313A publication Critical patent/GB2340313A/en
Application granted granted Critical
Publication of GB2340313B publication Critical patent/GB2340313B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/263—Shielding bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
GB9917830A 1998-07-31 1999-07-29 High-Frequency electronic package with arbitrarily-shaped interconnects and integral shielding Expired - Fee Related GB2340313B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/127,531 US6137693A (en) 1998-07-31 1998-07-31 High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding

Publications (3)

Publication Number Publication Date
GB9917830D0 GB9917830D0 (en) 1999-09-29
GB2340313A GB2340313A (en) 2000-02-16
GB2340313B true GB2340313B (en) 2003-07-23

Family

ID=22430599

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9917830A Expired - Fee Related GB2340313B (en) 1998-07-31 1999-07-29 High-Frequency electronic package with arbitrarily-shaped interconnects and integral shielding

Country Status (4)

Country Link
US (1) US6137693A (https=)
JP (1) JP2000058997A (https=)
DE (1) DE19924934A1 (https=)
GB (1) GB2340313B (https=)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6847529B2 (en) 1999-07-15 2005-01-25 Incep Technologies, Inc. Ultra-low impedance power interconnection system for electronic packages
US20030214800A1 (en) 1999-07-15 2003-11-20 Dibene Joseph Ted System and method for processor power delivery and thermal management
US6452113B2 (en) * 1999-07-15 2002-09-17 Incep Technologies, Inc. Apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6947293B2 (en) * 1999-07-15 2005-09-20 Incep Technologies Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management
US6801431B2 (en) * 1999-07-15 2004-10-05 Incep Technologies, Inc. Integrated power delivery and cooling system for high power microprocessors
US6623279B2 (en) 1999-07-15 2003-09-23 Incep Technologies, Inc. Separable power delivery connector
US6297551B1 (en) * 1999-09-22 2001-10-02 Agere Systems Guardian Corp. Integrated circuit packages with improved EMI characteristics
FI19992852L (fi) * 1999-12-31 2001-07-01 Nokia Mobile Phones Ltd Menetelmä ja sovitelma elektronisen laitteen EMC-suojauksen toteuttamiseksi sekä elektronisen laitteen piirilevy
US6708863B2 (en) * 2000-12-21 2004-03-23 Shibaura Mechatronics Corporation Heat bonding method and heat bonding device
US7167379B2 (en) 2001-02-16 2007-01-23 Dibene Ii Joseph T Micro-spring interconnect systems for low impedance high power applications
US6377475B1 (en) 2001-02-26 2002-04-23 Gore Enterprise Holdings, Inc. Removable electromagnetic interference shield
US6727777B2 (en) 2001-04-16 2004-04-27 Vitesse Semiconductor Corporation Apparatus and method for angled coaxial to planar structure broadband transition
US6844236B2 (en) * 2001-07-23 2005-01-18 Agere Systems Inc. Method and structure for DC and RF shielding of integrated circuits
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US7134486B2 (en) 2001-09-28 2006-11-14 The Board Of Trustees Of The Leeland Stanford Junior University Control of electrolysis gases in electroosmotic pump systems
US6803252B2 (en) 2001-11-21 2004-10-12 Sierra Monolithics, Inc. Single and multiple layer packaging of high-speed/high-density ICs
US20030095014A1 (en) * 2001-11-21 2003-05-22 Lao Binneg Y. Connection package for high-speed integrated circuit
WO2003049149A2 (en) 2001-11-30 2003-06-12 Vitesse Semiconductor Corporation Apparatus and method for inter-chip or chip-to-substrate connection with a sub-carrier
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US6845013B2 (en) 2002-03-04 2005-01-18 Incep Technologies, Inc. Right-angle power interconnect electronic packaging assembly
US6744640B2 (en) 2002-04-10 2004-06-01 Gore Enterprise Holdings, Inc. Board-level EMI shield with enhanced thermal dissipation
JP2004022587A (ja) * 2002-06-12 2004-01-22 Denso Corp 筐体
US7049570B2 (en) * 2002-09-16 2006-05-23 Avago Technologies, Ltd. Optical chip coupling system utilizing micromachine adjustable optical elements and a feedback circuit providing the micromachine with a feedback signal correlated to an optical signal parameter
JP3093800U (ja) * 2002-11-01 2003-05-16 アルプス電気株式会社 電子ユニット
US20040134680A1 (en) * 2003-01-09 2004-07-15 Xiang Dai Use of perimeter stops to support solder interconnects between integrated circuit assembly components
ATE376763T1 (de) * 2003-02-07 2007-11-15 Sony Ericsson Mobile Comm Ab Abschirmdeckel zur abschirmung von elektronischen bauteilen auf einer leiterplatte
JP3858854B2 (ja) * 2003-06-24 2006-12-20 富士通株式会社 積層型半導体装置
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
JP2005183410A (ja) * 2003-12-15 2005-07-07 Nec Saitama Ltd 無線回路モジュールおよび無線回路基板
US20080112151A1 (en) * 2004-03-04 2008-05-15 Skyworks Solutions, Inc. Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
US8399972B2 (en) * 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
US7282906B2 (en) * 2005-04-21 2007-10-16 Stmicroelectronics S.A. Electronic circuit protection device
US20070023203A1 (en) * 2005-07-26 2007-02-01 Leizerovich Gustavo D Method and system for customized radio frequency shielding using solder bumps
US8434220B2 (en) * 2007-06-27 2013-05-07 Rf Micro Devices, Inc. Heat sink formed with conformal shield
US8062930B1 (en) 2005-08-08 2011-11-22 Rf Micro Devices, Inc. Sub-module conformal electromagnetic interference shield
US8053872B1 (en) 2007-06-25 2011-11-08 Rf Micro Devices, Inc. Integrated shield for a no-lead semiconductor device package
US8959762B2 (en) 2005-08-08 2015-02-24 Rf Micro Devices, Inc. Method of manufacturing an electronic module
US7982684B2 (en) * 2006-12-06 2011-07-19 The Boeing Company Method and structure for RF antenna module
US7444737B2 (en) * 2006-12-07 2008-11-04 The Boeing Company Method for manufacturing an antenna
JP4468464B2 (ja) * 2008-03-28 2010-05-26 株式会社東芝 フレキシブルプリント配線板および電子機器
JP4555369B2 (ja) * 2008-08-13 2010-09-29 富士通メディアデバイス株式会社 電子部品モジュール及びその製造方法
US20110084406A1 (en) * 2009-10-13 2011-04-14 Sony Corporation Device and interconnect in flip chip architecture
US8837159B1 (en) * 2009-10-28 2014-09-16 Amazon Technologies, Inc. Low-profile circuit board assembly
US9137934B2 (en) 2010-08-18 2015-09-15 Rf Micro Devices, Inc. Compartmentalized shielding of selected components
TW201225752A (en) * 2010-12-10 2012-06-16 Askey Computer Corp Printed circuit board grounding structure for use with communication apparatus
US8835226B2 (en) 2011-02-25 2014-09-16 Rf Micro Devices, Inc. Connection using conductive vias
US9627230B2 (en) 2011-02-28 2017-04-18 Qorvo Us, Inc. Methods of forming a microshield on standard QFN package
US9693492B2 (en) 2011-04-14 2017-06-27 Mitsubishi Electric Corporation High-frequency package
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
US8948712B2 (en) 2012-05-31 2015-02-03 Skyworks Solutions, Inc. Via density and placement in radio frequency shielding applications
JP5893800B2 (ja) 2012-06-14 2016-03-23 スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. パワーアンプモジュールを含む関連するシステム、デバイス、および方法
WO2014011808A1 (en) 2012-07-13 2014-01-16 Skyworks Solutions, Inc. Racetrack design in radio frequency shielding applications
US8680689B1 (en) 2012-10-04 2014-03-25 International Business Machines Corporation Coplanar waveguide for stacked multi-chip systems
US9807890B2 (en) 2013-05-31 2017-10-31 Qorvo Us, Inc. Electronic modules having grounded electromagnetic shields
SG2013083258A (en) * 2013-11-06 2015-06-29 Thales Solutions Asia Pte Ltd A guard structure for signal isolation
JP6177427B2 (ja) * 2014-04-04 2017-08-09 三菱電機株式会社 プリント配線板ユニット
JP2016025159A (ja) * 2014-07-17 2016-02-08 富士通株式会社 配線基板構造体および配線基板構造体の製造方法
US9530739B2 (en) * 2014-12-15 2016-12-27 Qualcomm Incorporated Package on package (PoP) device comprising a high performance inter package connection
TWI621378B (zh) * 2015-07-29 2018-04-11 乾坤科技股份有限公司 具有電磁屏蔽結構的電子模組及其製造方法
TWI570854B (zh) * 2015-08-10 2017-02-11 頎邦科技股份有限公司 具中空腔室之半導體封裝結構及其下基板及製程
US9553079B1 (en) * 2015-12-15 2017-01-24 International Business Machines Corporation Flip chip assembly with connected component
US11127689B2 (en) 2018-06-01 2021-09-21 Qorvo Us, Inc. Segmented shielding using wirebonds
US11219144B2 (en) 2018-06-28 2022-01-04 Qorvo Us, Inc. Electromagnetic shields for sub-modules
US11114363B2 (en) 2018-12-20 2021-09-07 Qorvo Us, Inc. Electronic package arrangements and related methods
US11515282B2 (en) 2019-05-21 2022-11-29 Qorvo Us, Inc. Electromagnetic shields with bonding wires for sub-modules

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990007792A1 (en) * 1989-01-03 1990-07-12 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
WO1991009419A1 (en) * 1989-12-18 1991-06-27 Epoxy Technology, Inc. Flip chip technology using electrically conductive polymers and dielectrics
US5060844A (en) * 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
WO1992006491A1 (en) * 1990-10-09 1992-04-16 Eastman Kodak Company Bonding of solid state device to terminal board
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5578874A (en) * 1994-06-14 1996-11-26 Hughes Aircraft Company Hermetically self-sealing flip chip
US5629241A (en) * 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
GB2324649A (en) * 1997-04-16 1998-10-28 Ibm Shielded semiconductor package

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3591839A (en) * 1969-08-27 1971-07-06 Siliconix Inc Micro-electronic circuit with novel hermetic sealing structure and method of manufacture
US4402450A (en) * 1981-08-21 1983-09-06 Western Electric Company, Inc. Adapting contacts for connection thereto
JPS6187396A (ja) * 1984-10-05 1986-05-02 株式会社日立製作所 電子回路装置とその製造方法
JPH0734455B2 (ja) * 1986-08-27 1995-04-12 日本電気株式会社 多層配線基板
US4900877A (en) * 1987-01-13 1990-02-13 Raychem Corporation Shielding and sealing gaskets
US4922377A (en) * 1987-11-16 1990-05-01 Hitachi, Ltd. Module and a substrate for the module
US5024372A (en) * 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
US5138436A (en) * 1990-11-16 1992-08-11 Ball Corporation Interconnect package having means for waveguide transmission of rf signals
US5483421A (en) * 1992-03-09 1996-01-09 International Business Machines Corporation IC chip attachment
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5643831A (en) * 1994-01-20 1997-07-01 Fujitsu Limited Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device
KR970701428A (ko) * 1994-02-16 1997-03-17 알베르트 발도르프, 롤프 옴케 3차원 회로 장치의 제조 방법(process for producing a three-dimensional circuit)
US5539153A (en) * 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
CA2135508C (en) * 1994-11-09 1998-11-03 Robert J. Lyn Method for forming solder balls on a semiconductor substrate
US5493075A (en) * 1994-09-30 1996-02-20 International Business Machines Corporation Fine pitch solder formation on printed circuit board process and product
US5477933A (en) * 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5783870A (en) * 1995-03-16 1998-07-21 National Semiconductor Corporation Method for connecting packages of a stacked ball grid array structure
US5607099A (en) * 1995-04-24 1997-03-04 Delco Electronics Corporation Solder bump transfer device for flip chip integrated circuit devices
US5657208A (en) * 1995-07-28 1997-08-12 Hewlett-Packard Company Surface mount attachments of daughterboards to motherboards
JPH10163386A (ja) * 1996-12-03 1998-06-19 Toshiba Corp 半導体装置、半導体パッケージおよび実装回路装置
JP3576727B2 (ja) * 1996-12-10 2004-10-13 株式会社デンソー 表面実装型パッケージ
US5898574A (en) * 1997-09-02 1999-04-27 Tan; Wiling Self aligning electrical component

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1990007792A1 (en) * 1989-01-03 1990-07-12 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
WO1991009419A1 (en) * 1989-12-18 1991-06-27 Epoxy Technology, Inc. Flip chip technology using electrically conductive polymers and dielectrics
US5060844A (en) * 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
WO1992006491A1 (en) * 1990-10-09 1992-04-16 Eastman Kodak Company Bonding of solid state device to terminal board
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5578874A (en) * 1994-06-14 1996-11-26 Hughes Aircraft Company Hermetically self-sealing flip chip
US5629241A (en) * 1995-07-07 1997-05-13 Hughes Aircraft Company Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same
GB2324649A (en) * 1997-04-16 1998-10-28 Ibm Shielded semiconductor package

Also Published As

Publication number Publication date
GB9917830D0 (en) 1999-09-29
US6137693A (en) 2000-10-24
GB2340313A (en) 2000-02-16
DE19924934A1 (de) 2000-02-10
JP2000058997A (ja) 2000-02-25

Similar Documents

Publication Publication Date Title
GB2340313B (en) High-Frequency electronic package with arbitrarily-shaped interconnects and integral shielding
GB2337854B (en) Electronic part
IL132268A (en) Multi-layered shielded substrate antenna
GB2344222B (en) Chip type electronic part and method for the manufacture thereof
GB2339971A (en) Methods of enhancing electromagnetic radiation properties of encapsulated circuit, and related devices
GB2337381B (en) Impedance-matching method and circuit at different frequencies
GB2333669B (en) High-frequency circuit device
PL341695A1 (en) High-frequency induction lamp and power oscillator
TW395572U (en) Shielding structure of electronic device
EP1101156A4 (en) ELECTRONIC BALLAST WITH FREQUENCY MANAGEMENT
AU138303S (en) An electronic computer
EP1059626A4 (en) ELECTRONIC DEVICE
SG75997A1 (en) Integrated circuit of inductive elements
GB2335097B (en) Mixed-signal circuitry and integrated circuit devices
EP0700114A3 (en) Integrated microwave circuit
GB2338827B (en) Electronic package assembly
SG68047A1 (en) Solder material and electronic part using the same
SG93202A1 (en) Conductive paste and ceramic electronic part including the same
AU137148S (en) An electronic computer
AU136219S (en) An electronic computer
GB2324665B (en) High-frequency electronic device
GB2338831B (en) Electronic devices
AU9650998A (en) Flip-flop circuit and semiconductor integrated circuit
TW433562U (en) Detachable antenna of electronic device
AU137149S (en) An electronic computer

Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080729