GB2233593B - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
GB2233593B
GB2233593B GB9014392A GB9014392A GB2233593B GB 2233593 B GB2233593 B GB 2233593B GB 9014392 A GB9014392 A GB 9014392A GB 9014392 A GB9014392 A GB 9014392A GB 2233593 B GB2233593 B GB 2233593B
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
heat sink
sink plate
plate
strong
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9014392A
Other versions
GB2233593A (en
GB9014392D0 (en
Inventor
Katsuyoshi Izawa
Ryoichi Kobayashi
Masayuki Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of GB9014392D0 publication Critical patent/GB9014392D0/en
Publication of GB2233593A publication Critical patent/GB2233593A/en
Application granted granted Critical
Publication of GB2233593B publication Critical patent/GB2233593B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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  • Engineering & Computer Science (AREA)
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  • Computer Hardware Design (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

A semiconductor device 2 which is strong to a heat cycle is characterized by a joint by lead-tin alloy solder having a weight ratio of 50+/-5/50-/+5, between an insulation plate (60) and a heat sink plate (80). A further heat sink plate (40) may also be provided. <IMAGE>
GB9014392A 1989-06-28 1990-06-28 Semiconductor device Expired - Fee Related GB2233593B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1163990A JP2609724B2 (en) 1989-06-28 1989-06-28 Semiconductor device

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GB9014392D0 GB9014392D0 (en) 1990-08-22
GB2233593A GB2233593A (en) 1991-01-16
GB2233593B true GB2233593B (en) 1993-11-10

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GB9014392A Expired - Fee Related GB2233593B (en) 1989-06-28 1990-06-28 Semiconductor device

Country Status (4)

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JP (1) JP2609724B2 (en)
KR (1) KR0183010B1 (en)
DE (1) DE4020577C3 (en)
GB (1) GB2233593B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05136304A (en) * 1991-11-14 1993-06-01 Mitsubishi Electric Corp Semiconductor module and power controller using same
JP2838625B2 (en) * 1992-09-08 1998-12-16 株式会社日立製作所 Semiconductor module
DE4300516C2 (en) * 1993-01-12 2001-05-17 Ixys Semiconductor Gmbh Power semiconductor module
KR100322177B1 (en) 1993-12-27 2002-05-13 이누이 도모지 Ignition Device for Internal Combustion Engines
DE19609929B4 (en) * 1996-03-14 2006-10-26 Ixys Semiconductor Gmbh The power semiconductor module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1122238A (en) * 1964-11-18 1968-07-31 English Electric Co Ltd Semi-conductor device

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JPS5344176A (en) * 1976-10-04 1978-04-20 Hitachi Cable Ltd Clad solder for semiconductor device
DE3009925C2 (en) * 1980-03-14 1984-03-08 Siemens AG, 1000 Berlin und 8000 München Contact piece for an electrical vacuum switch
JPS57114242A (en) * 1981-01-07 1982-07-16 Hitachi Ltd Semiconductor device
JPS5982734A (en) * 1982-11-04 1984-05-12 Hitachi Ltd Insulation type semiconductor device
JPS6010633A (en) * 1983-06-30 1985-01-19 Fujitsu Ltd Semiconductor device
DE3513530A1 (en) * 1984-06-01 1985-12-05 Bbc Brown Boveri & Cie METHOD FOR THE PRODUCTION OF PERFORMANCE SEMICONDUCTOR MODULES WITH INSULATED STRUCTURE
DE3523808C3 (en) * 1984-07-03 1995-05-04 Hitachi Ltd Process for soldering parts of an electronic arrangement made of different materials and its use
JPS6117355A (en) * 1984-07-03 1986-01-25 Hitachi Ltd Joining of different members by soldering
JPS61139047A (en) * 1984-12-11 1986-06-26 Toshiba Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1122238A (en) * 1964-11-18 1968-07-31 English Electric Co Ltd Semi-conductor device

Also Published As

Publication number Publication date
KR0183010B1 (en) 1999-03-20
DE4020577A1 (en) 1991-01-10
GB2233593A (en) 1991-01-16
JPH0330440A (en) 1991-02-08
DE4020577C3 (en) 1998-11-12
DE4020577C2 (en) 1994-07-07
KR910001953A (en) 1991-01-31
GB9014392D0 (en) 1990-08-22
JP2609724B2 (en) 1997-05-14

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