GB2207808B - A semiconductor device having an air bridge wiring structure - Google Patents

A semiconductor device having an air bridge wiring structure

Info

Publication number
GB2207808B
GB2207808B GB8814297A GB8814297A GB2207808B GB 2207808 B GB2207808 B GB 2207808B GB 8814297 A GB8814297 A GB 8814297A GB 8814297 A GB8814297 A GB 8814297A GB 2207808 B GB2207808 B GB 2207808B
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
wiring structure
air bridge
bridge wiring
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB8814297A
Other languages
English (en)
Other versions
GB2207808A (en
GB8814297D0 (en
Inventor
Hiroshi Matsuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB8814297D0 publication Critical patent/GB8814297D0/en
Publication of GB2207808A publication Critical patent/GB2207808A/en
Application granted granted Critical
Publication of GB2207808B publication Critical patent/GB2207808B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/43—Layouts of interconnections
    • H10W20/432—Layouts of interconnections comprising crossing interconnections
GB8814297A 1987-06-19 1988-06-16 A semiconductor device having an air bridge wiring structure Expired - Lifetime GB2207808B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62154104A JPH0783053B2 (ja) 1987-06-19 1987-06-19 半導体装置

Publications (3)

Publication Number Publication Date
GB8814297D0 GB8814297D0 (en) 1988-07-20
GB2207808A GB2207808A (en) 1989-02-08
GB2207808B true GB2207808B (en) 1990-07-11

Family

ID=15577008

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8814297A Expired - Lifetime GB2207808B (en) 1987-06-19 1988-06-16 A semiconductor device having an air bridge wiring structure

Country Status (4)

Country Link
US (1) US4924289A (https=)
JP (1) JPH0783053B2 (https=)
FR (1) FR2616965A1 (https=)
GB (1) GB2207808B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0393635B1 (en) * 1989-04-21 1997-09-03 Nec Corporation Semiconductor device having multi-level wirings
US5019877A (en) * 1989-08-31 1991-05-28 Mitsubishi Denki Kabushiki Kaisha Field effect transistor
FR2653595B1 (fr) * 1989-10-25 1992-02-14 Valtronic France Circuit electronique a grille d'interconnexion.
JP3031966B2 (ja) * 1990-07-02 2000-04-10 株式会社東芝 集積回路装置
JPH05259159A (ja) * 1992-03-16 1993-10-08 Nec Ic Microcomput Syst Ltd 半導体集積回路装置内の配線形状
GB2273201B (en) * 1992-09-18 1996-07-10 Texas Instruments Ltd High reliablity contact scheme
JPH0722583A (ja) * 1992-12-15 1995-01-24 Internatl Business Mach Corp <Ibm> 多層回路装置
JPH08306774A (ja) * 1995-05-01 1996-11-22 Oki Electric Ind Co Ltd 半導体装置及びその製造方法
CN1474452A (zh) * 1996-04-19 2004-02-11 ���µ�����ҵ��ʽ���� 半导体器件
JP2000269339A (ja) 1999-03-16 2000-09-29 Toshiba Corp 半導体集積回路装置とその配線配置方法
KR100697803B1 (ko) 2002-08-29 2007-03-20 시로 사카이 복수의 발광 소자를 갖는 발광 장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3921194A (en) * 1970-07-20 1975-11-18 Gen Electric Method and apparatus for storing and transferring information
JPS5154785A (https=) * 1974-11-08 1976-05-14 Nippon Electric Co
US3932226A (en) * 1974-12-06 1976-01-13 Rca Corporation Method of electrically interconnecting semiconductor elements
US4080722A (en) * 1976-03-22 1978-03-28 Rca Corporation Method of manufacturing semiconductor devices having a copper heat capacitor and/or copper heat sink
NL7608901A (nl) * 1976-08-11 1978-02-14 Philips Nv Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze.
JPS5357781A (en) * 1976-11-05 1978-05-25 Toshiba Corp Semiconductor integrated circuit
JPS5819144B2 (ja) * 1977-12-02 1983-04-16 株式会社東芝 読み出し専用記憶装置
JPS59198733A (ja) * 1983-04-26 1984-11-10 Mitsubishi Electric Corp 半導体集積回路装置
US4651183A (en) * 1984-06-28 1987-03-17 International Business Machines Corporation High density one device memory cell arrays

Also Published As

Publication number Publication date
GB2207808A (en) 1989-02-08
US4924289A (en) 1990-05-08
GB8814297D0 (en) 1988-07-20
JPS63318141A (ja) 1988-12-27
FR2616965B1 (https=) 1994-04-22
JPH0783053B2 (ja) 1995-09-06
FR2616965A1 (fr) 1988-12-23

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19950522

PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990616