GB2190215B - Integrated circuit substrates and masks - Google Patents

Integrated circuit substrates and masks

Info

Publication number
GB2190215B
GB2190215B GB8709208A GB8709208A GB2190215B GB 2190215 B GB2190215 B GB 2190215B GB 8709208 A GB8709208 A GB 8709208A GB 8709208 A GB8709208 A GB 8709208A GB 2190215 B GB2190215 B GB 2190215B
Authority
GB
United Kingdom
Prior art keywords
mask
substrate
composite representations
reproduced
representations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8709208A
Other versions
GB2190215A (en
GB8709208D0 (en
Inventor
Edward Stuart Eccles
James Curry Green
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smiths Group PLC
Original Assignee
Smiths Group PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB868610655A external-priority patent/GB8610655D0/en
Application filed by Smiths Group PLC filed Critical Smiths Group PLC
Priority to GB8709208A priority Critical patent/GB2190215B/en
Publication of GB8709208D0 publication Critical patent/GB8709208D0/en
Publication of GB2190215A publication Critical patent/GB2190215A/en
Application granted granted Critical
Publication of GB2190215B publication Critical patent/GB2190215B/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70466—Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A mask (1) is made by exposing a pattern (2) of several different dice A to I through reducing lens (3). The mask is exposed several times to produce composite representations CR1 to CR9 on the mask. Several different composite representations may be formed on the same mask using different patterns (cf Fig. 7). The mask 1 is contact printed onto a resist on an to integrated circuit substrate. The area of the mask (74) covered by the composite representations CR10 to CR79 may be greater than the area of the substrate (75) such that for composite representations CR74, CR76, CR77 and CR79 only a portion is reproduced on the substrate but some of those dice not reproduced in one of the composite representations will be reproduced in another of the composite representations. One half of the mask may have composite representations relating to one processing step, whilst the other half of the mask relates to a different processing step, the mask being reoriented after the first step so that the part of the substrate exposed initially to the one half of the mask is subsequently exposed to the other half of the mask, the other part of the substrate being rejected. <IMAGE>
GB8709208A 1986-05-01 1987-04-16 Integrated circuit substrates and masks Expired GB2190215B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8709208A GB2190215B (en) 1986-05-01 1987-04-16 Integrated circuit substrates and masks

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB868610655A GB8610655D0 (en) 1986-05-01 1986-05-01 Integrated circuit substrates
GB8709208A GB2190215B (en) 1986-05-01 1987-04-16 Integrated circuit substrates and masks

Publications (3)

Publication Number Publication Date
GB8709208D0 GB8709208D0 (en) 1987-05-20
GB2190215A GB2190215A (en) 1987-11-11
GB2190215B true GB2190215B (en) 1989-12-13

Family

ID=26290700

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8709208A Expired GB2190215B (en) 1986-05-01 1987-04-16 Integrated circuit substrates and masks

Country Status (1)

Country Link
GB (1) GB2190215B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2277998A (en) * 1993-05-13 1994-11-16 Marconi Gec Ltd Mask and apparatus for producing microlenses
US6040892A (en) 1997-08-19 2000-03-21 Micron Technology, Inc. Multiple image reticle for forming layers

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1156840A (en) * 1966-01-14 1969-07-02 Ibm Improvements in or relating to Multiple Image Cameras.
GB1259337A (en) * 1969-04-21 1972-01-05
US4343877A (en) * 1981-01-02 1982-08-10 Amdahl Corporation System for design and production of integrated circuit photomasks and integrated circuit devices
US4442188A (en) * 1981-01-02 1984-04-10 Amdahl Corporation System for specifying critical dimensions, sequence numbers and revision levels on integrated circuit photomasks
US4488806A (en) * 1981-12-21 1984-12-18 Canon Kabushiki Kaisha Shot arranging method in a divisional printing apparatus
EP0138639A2 (en) * 1983-09-16 1985-04-24 Fujitsu Limited Inspection method for mask pattern used in semiconductor device fabrication

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1156840A (en) * 1966-01-14 1969-07-02 Ibm Improvements in or relating to Multiple Image Cameras.
GB1259337A (en) * 1969-04-21 1972-01-05
US4343877A (en) * 1981-01-02 1982-08-10 Amdahl Corporation System for design and production of integrated circuit photomasks and integrated circuit devices
US4442188A (en) * 1981-01-02 1984-04-10 Amdahl Corporation System for specifying critical dimensions, sequence numbers and revision levels on integrated circuit photomasks
US4488806A (en) * 1981-12-21 1984-12-18 Canon Kabushiki Kaisha Shot arranging method in a divisional printing apparatus
EP0138639A2 (en) * 1983-09-16 1985-04-24 Fujitsu Limited Inspection method for mask pattern used in semiconductor device fabrication

Also Published As

Publication number Publication date
GB2190215A (en) 1987-11-11
GB8709208D0 (en) 1987-05-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee