GB2172441B - Method of mounting electronic parts onto single-sided printed wiring board - Google Patents

Method of mounting electronic parts onto single-sided printed wiring board

Info

Publication number
GB2172441B
GB2172441B GB8605572A GB8605572A GB2172441B GB 2172441 B GB2172441 B GB 2172441B GB 8605572 A GB8605572 A GB 8605572A GB 8605572 A GB8605572 A GB 8605572A GB 2172441 B GB2172441 B GB 2172441B
Authority
GB
United Kingdom
Prior art keywords
wiring board
printed wiring
electronic parts
mounting electronic
sided printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8605572A
Other languages
English (en)
Other versions
GB2172441A (en
GB8605572D0 (en
Inventor
Seiichi Kinugawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of GB8605572D0 publication Critical patent/GB8605572D0/en
Publication of GB2172441A publication Critical patent/GB2172441A/en
Application granted granted Critical
Publication of GB2172441B publication Critical patent/GB2172441B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
    • H01H13/70—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard
    • H01H13/702—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2207/00—Connections
    • H01H2207/012—Connections via underside of substrate
    • H01H2207/014—Plated through holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2207/00—Connections
    • H01H2207/016—Jumpers; Cross-overs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2239/00—Miscellaneous
    • H01H2239/008—Static electricity considerations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2239/00—Miscellaneous
    • H01H2239/01—Miscellaneous combined with other elements on the same substrate
    • H01H2239/014—Miscellaneous combined with other elements on the same substrate on both sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Push-Button Switches (AREA)
  • Calculators And Similar Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Manufacture Of Switches (AREA)
GB8605572A 1985-03-06 1986-03-06 Method of mounting electronic parts onto single-sided printed wiring board Expired GB2172441B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60045666A JPS61203695A (ja) 1985-03-06 1985-03-06 片面配線基板の部品実装方式

Publications (3)

Publication Number Publication Date
GB8605572D0 GB8605572D0 (en) 1986-04-09
GB2172441A GB2172441A (en) 1986-09-17
GB2172441B true GB2172441B (en) 1989-06-21

Family

ID=12725707

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8605572A Expired GB2172441B (en) 1985-03-06 1986-03-06 Method of mounting electronic parts onto single-sided printed wiring board

Country Status (4)

Country Link
US (1) US4841633A (enExample)
JP (1) JPS61203695A (enExample)
DE (1) DE3607049A1 (enExample)
GB (1) GB2172441B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01140871U (enExample) * 1988-03-23 1989-09-27
EP0479915B1 (en) * 1989-06-30 1999-08-18 Fujitsu Personal Systems, Inc. Compact portable computer
US5189638A (en) * 1990-04-26 1993-02-23 Mitsubishi Denki Kabushiki Kaisha Portable semiconductor memory device
DE4036081C2 (de) * 1990-04-26 1994-10-06 Mitsubishi Electric Corp Halbleiterspeicher-Steckmodul
JPH0420790U (enExample) * 1990-06-14 1992-02-21
JP2824148B2 (ja) * 1990-11-28 1998-11-11 富士通株式会社 両面ワイヤボンディング基板組立体製造用ワークテーブル
DE4213084A1 (de) * 1992-04-21 1993-01-07 Bock Hans A Dipl Ing Tu (tast)schalter im lenkrad oder in konsolen, armlehnen etc. zur bedienung durch die "elastische haut" (kunststoff) der oberflaeche
DE4307613C2 (de) * 1993-03-06 1996-03-28 Deutsche Telephonwerk Kabel Anordnung für Tastaturen von Kommunikations-Endgeräten
DE4326443C2 (de) * 1993-08-06 1996-06-05 Telefunken Microelectron Folientastatur mit bedrahtetem Bauelement
JP3014029B2 (ja) * 1995-06-16 2000-02-28 日本電気株式会社 半導体素子の実装方法
US5678304A (en) * 1996-07-24 1997-10-21 Eastman Kodak Company Method for manufacturing double-sided circuit assemblies
DE69941557D1 (de) * 1998-01-15 2009-12-03 Regenesis Biomedical Inc Verbesserte vorrichtung zur behandlung mittels pulsierter elektromagnetischer energie
JP2001308491A (ja) * 2000-04-21 2001-11-02 Three M Innovative Properties Co 片面配線基板、該片面配線基板を含む表示モジュール及び該片面配線基板の接続方法
JP3636127B2 (ja) * 2001-10-12 2005-04-06 松下電器産業株式会社 電子部品実装装置および電子部品実装方法
JP2005287902A (ja) * 2004-04-01 2005-10-20 Heiwa Corp 遊技機
JP2007059184A (ja) * 2005-08-24 2007-03-08 Citizen Electronics Co Ltd キーシートモジュール
ITMC20070018A1 (it) * 2007-02-01 2008-08-02 Cisel Srl Procedimento per la realizzazione di circuiti stampati su cui devono essere saldati componenti elettronici privi di reoforo.
US20080232074A1 (en) * 2007-03-20 2008-09-25 Viasat, Inc. Circuit Card Assembly Including Individually Testable Layers
FR2946219B1 (fr) * 2009-05-29 2013-01-04 Valeo Systemes Thermiques Facade de commande electronique avec protection contre les decharges electrostatiques
CN107996033A (zh) * 2015-06-26 2018-05-04 博世汽车多媒体葡萄牙公司 用于印刷电路板的固定和接地触头的弹簧
US9418327B1 (en) * 2016-01-29 2016-08-16 International Business Machines Corporation Security key system

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB773015A (en) * 1955-06-20 1957-04-17 Standard Telephones Cables Ltd Improvements in or relating to electrical apparatus-mounting arrangements
GB787599A (en) * 1955-06-14 1957-12-11 Pye Ltd Improvements in or relating to electric circuits
GB1015827A (en) * 1963-12-23 1966-01-05 Ibm Improvements in and relating to electrical connections in printed circuit boards
GB1458643A (en) * 1974-05-21 1976-12-15 Texas Instruments Inc Keyboard apparatus and method of making
GB1552444A (en) * 1975-10-29 1979-09-12 Serras Paulet Edouard Keyboard with depressible keys for electric or electronic machines
GB2035701A (en) * 1978-10-19 1980-06-18 Cii Honeywell Bull Flat package for integrated circuit devices
GB2046519A (en) * 1979-04-09 1980-11-12 American Telecomm Pushbutton switch for a dial assembly
GB2047474A (en) * 1978-10-19 1980-11-26 Cii Honeywell Bull A strip carrying devices for processing electrical signals, and a method of producing the strip
GB2118371A (en) * 1982-03-31 1983-10-26 Philips Nv High-frequency circuit comprising an integrated capacitor
EP0144944A2 (en) * 1983-12-05 1985-06-19 E.I. Du Pont De Nemours And Company Process for forming conductive through-holes through a dielectric layer

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2777192A (en) * 1952-12-03 1957-01-15 Philco Corp Method of forming a printed circuit and soldering components thereto
GB864479A (en) * 1957-08-22 1961-04-06 John Dawson Miller Printed circuit board
US3061911A (en) * 1958-01-31 1962-11-06 Xerox Corp Method of making printed circuits
US3152388A (en) * 1958-03-03 1964-10-13 Litton Industries Inc Printed circuit processing
DE1981360U (de) * 1959-10-02 1968-03-21 Siemens Ag Vorrichtung zur verbindung zweier schaltpunkte auf einer eine verdrahtung tragenden platte.
US3470043A (en) * 1965-09-08 1969-09-30 Nasa Selective plating of etched circuits without removing previous plating
GB1383297A (en) * 1972-02-23 1974-02-12 Plessey Co Ltd Electrical integrated circuit package
JPS5216665A (en) * 1975-07-28 1977-02-08 Sharp Kk Electronic device
JPS5494366A (en) * 1977-12-14 1979-07-26 Fontainemelon Horlogerie Method of making electronic module for timepiece
JPS58672A (ja) * 1981-06-25 1983-01-05 Kiyuubitsuku Eng:Kk 安全弁装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB787599A (en) * 1955-06-14 1957-12-11 Pye Ltd Improvements in or relating to electric circuits
GB773015A (en) * 1955-06-20 1957-04-17 Standard Telephones Cables Ltd Improvements in or relating to electrical apparatus-mounting arrangements
GB1015827A (en) * 1963-12-23 1966-01-05 Ibm Improvements in and relating to electrical connections in printed circuit boards
GB1458643A (en) * 1974-05-21 1976-12-15 Texas Instruments Inc Keyboard apparatus and method of making
GB1552444A (en) * 1975-10-29 1979-09-12 Serras Paulet Edouard Keyboard with depressible keys for electric or electronic machines
GB2035701A (en) * 1978-10-19 1980-06-18 Cii Honeywell Bull Flat package for integrated circuit devices
GB2047474A (en) * 1978-10-19 1980-11-26 Cii Honeywell Bull A strip carrying devices for processing electrical signals, and a method of producing the strip
GB2046519A (en) * 1979-04-09 1980-11-12 American Telecomm Pushbutton switch for a dial assembly
GB2118371A (en) * 1982-03-31 1983-10-26 Philips Nv High-frequency circuit comprising an integrated capacitor
EP0144944A2 (en) * 1983-12-05 1985-06-19 E.I. Du Pont De Nemours And Company Process for forming conductive through-holes through a dielectric layer

Also Published As

Publication number Publication date
GB2172441A (en) 1986-09-17
US4841633A (en) 1989-06-27
DE3607049C2 (enExample) 1990-09-20
JPS61203695A (ja) 1986-09-09
DE3607049A1 (de) 1986-09-11
GB8605572D0 (en) 1986-04-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990306