GB2146174B - Hermetic power chip packages - Google Patents

Hermetic power chip packages

Info

Publication number
GB2146174B
GB2146174B GB08420944A GB8420944A GB2146174B GB 2146174 B GB2146174 B GB 2146174B GB 08420944 A GB08420944 A GB 08420944A GB 8420944 A GB8420944 A GB 8420944A GB 2146174 B GB2146174 B GB 2146174B
Authority
GB
United Kingdom
Prior art keywords
power chip
chip packages
hermetic power
hermetic
packages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08420944A
Other languages
English (en)
Other versions
GB2146174A (en
GB8420944D0 (en
Inventor
Alexander John Yerman
Constantine Alois Neugebauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB8420944D0 publication Critical patent/GB8420944D0/en
Publication of GB2146174A publication Critical patent/GB2146174A/en
Application granted granted Critical
Publication of GB2146174B publication Critical patent/GB2146174B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
GB08420944A 1983-09-06 1984-08-17 Hermetic power chip packages Expired GB2146174B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52929583A 1983-09-06 1983-09-06

Publications (3)

Publication Number Publication Date
GB8420944D0 GB8420944D0 (en) 1984-09-19
GB2146174A GB2146174A (en) 1985-04-11
GB2146174B true GB2146174B (en) 1987-04-23

Family

ID=24109306

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08420944A Expired GB2146174B (en) 1983-09-06 1984-08-17 Hermetic power chip packages

Country Status (4)

Country Link
JP (1) JPS6094742A (enExample)
CA (1) CA1216960A (enExample)
DE (1) DE3432449A1 (enExample)
GB (1) GB2146174B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111146152A (zh) * 2019-10-30 2020-05-12 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体封装件

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5148264A (en) * 1990-05-02 1992-09-15 Harris Semiconductor Patents, Inc. High current hermetic package
US5446316A (en) * 1994-01-06 1995-08-29 Harris Corporation Hermetic package for a high power semiconductor device
FR2793350B1 (fr) * 1999-05-03 2003-08-15 St Microelectronics Sa Protection d'une puce semiconductrice
DE10156626A1 (de) * 2001-11-17 2003-06-05 Bosch Gmbh Robert Elektronische Anordnung
US7138708B2 (en) 1999-09-24 2006-11-21 Robert Bosch Gmbh Electronic system for fixing power and signal semiconductor chips
DE19950026B4 (de) * 1999-10-09 2010-11-11 Robert Bosch Gmbh Leistungshalbleitermodul
US6693350B2 (en) 1999-11-24 2004-02-17 Denso Corporation Semiconductor device having radiation structure and method for manufacturing semiconductor device having radiation structure
US6703707B1 (en) 1999-11-24 2004-03-09 Denso Corporation Semiconductor device having radiation structure
JP4479121B2 (ja) 2001-04-25 2010-06-09 株式会社デンソー 半導体装置の製造方法
US8018056B2 (en) 2005-12-21 2011-09-13 International Rectifier Corporation Package for high power density devices

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1251874B (enExample) * 1960-10-17
DE1815799C3 (de) * 1968-12-19 1979-09-13 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung eines Halbleiterbauelementgehäuses
US3646405A (en) * 1969-01-08 1972-02-29 Mallory & Co Inc P R Hermetic seal
DE2213915A1 (de) * 1972-03-22 1973-10-04 Siemens Ag Gehaeuse fuer halbleitersysteme
US3994430A (en) * 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
CH660258A5 (de) * 1983-01-20 1987-03-31 Landis & Gyr Ag Keramikgehaeuse fuer einen hybridschaltkreis.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111146152A (zh) * 2019-10-30 2020-05-12 苏师大半导体材料与设备研究院(邳州)有限公司 一种半导体封装件

Also Published As

Publication number Publication date
DE3432449C2 (enExample) 1991-08-22
JPS6094742A (ja) 1985-05-27
GB2146174A (en) 1985-04-11
DE3432449A1 (de) 1985-04-04
CA1216960A (en) 1987-01-20
JPH0118583B2 (enExample) 1989-04-06
GB8420944D0 (en) 1984-09-19

Similar Documents

Publication Publication Date Title
DE3380380D1 (en) Power chip package
DE3476296D1 (en) Semiconductor package
IL79656A (en) Microelectronic package
DE3664022D1 (en) Packaged semiconductor chip
GB8531706D0 (en) Package
GB8519352D0 (en) Package
GB8300451D0 (en) Resealable package
EP0148118A3 (en) Package
GB2157493B (en) Integrated circuit package
DE3572087D1 (en) Integrated circuit package
GB8413845D0 (en) Ic power pack
EP0211618A3 (en) Integrated circuit package
GB8420252D0 (en) Package
GB8522166D0 (en) Encapsulating semiconductor components
GB8506111D0 (en) Encapsulating semiconductor components
IL86643A0 (en) Semiconductor package
GB2146174B (en) Hermetic power chip packages
GB2167228B (en) Integrated circuit package
IL71420A0 (en) Package
GB8508576D0 (en) Package
DE3470255D1 (en) Power semiconductor device
EP0178481A3 (en) Hermetically sealed semiconductor package
GB2127101B (en) Sealant package
EG19195A (en) Power semiconductor package
AU91792S (en) Package

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030817