GB2132412B - Improvements in or relating to methods of manufacture of semiconductor devices - Google Patents

Improvements in or relating to methods of manufacture of semiconductor devices

Info

Publication number
GB2132412B
GB2132412B GB08332808A GB8332808A GB2132412B GB 2132412 B GB2132412 B GB 2132412B GB 08332808 A GB08332808 A GB 08332808A GB 8332808 A GB8332808 A GB 8332808A GB 2132412 B GB2132412 B GB 2132412B
Authority
GB
United Kingdom
Prior art keywords
relating
manufacture
methods
semiconductor devices
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08332808A
Other languages
English (en)
Other versions
GB2132412A (en
GB8332808D0 (en
Inventor
Anders Nilarp
Herbert J Gould
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/447,760 external-priority patent/US4878099A/en
Application filed by International Rectifier Corp USA filed Critical International Rectifier Corp USA
Publication of GB8332808D0 publication Critical patent/GB8332808D0/en
Publication of GB2132412A publication Critical patent/GB2132412A/en
Application granted granted Critical
Publication of GB2132412B publication Critical patent/GB2132412B/en
Expired legal-status Critical Current

Links

Classifications

    • H10W20/069—
    • H10P14/44—
    • H10P50/642—
    • H10P50/644—
    • H10P54/00—
GB08332808A 1982-12-08 1983-12-08 Improvements in or relating to methods of manufacture of semiconductor devices Expired GB2132412B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44776182A 1982-12-08 1982-12-08
US06/447,760 US4878099A (en) 1982-12-08 1982-12-08 Metallizing system for semiconductor wafers

Publications (3)

Publication Number Publication Date
GB8332808D0 GB8332808D0 (en) 1984-01-18
GB2132412A GB2132412A (en) 1984-07-04
GB2132412B true GB2132412B (en) 1987-08-19

Family

ID=27035081

Family Applications (2)

Application Number Title Priority Date Filing Date
GB08332808A Expired GB2132412B (en) 1982-12-08 1983-12-08 Improvements in or relating to methods of manufacture of semiconductor devices
GB08529225A Expired GB2168843B (en) 1982-12-08 1985-11-27 Manufacture of semiconductor devices

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB08529225A Expired GB2168843B (en) 1982-12-08 1985-11-27 Manufacture of semiconductor devices

Country Status (5)

Country Link
DE (1) DE3344462A1 (cg-RX-API-DMAC10.html)
FR (1) FR2537778B1 (cg-RX-API-DMAC10.html)
GB (2) GB2132412B (cg-RX-API-DMAC10.html)
IT (1) IT1194505B (cg-RX-API-DMAC10.html)
SE (1) SE8306663L (cg-RX-API-DMAC10.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3301666A1 (de) * 1983-01-20 1984-07-26 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zur herstellung einer mehrschichtigen kontaktmetallisierung
JPH07118534B2 (ja) * 1990-02-22 1995-12-18 三菱電機株式会社 半導体装置の製造方法
US5422286A (en) * 1994-10-07 1995-06-06 United Microelectronics Corp. Process for fabricating high-voltage semiconductor power device
CN1241253C (zh) * 2002-06-24 2006-02-08 丰田合成株式会社 半导体元件的制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL291270A (cg-RX-API-DMAC10.html) * 1961-08-12
US3288662A (en) * 1963-07-18 1966-11-29 Rca Corp Method of etching to dice a semiconductor slice
DE1258235B (de) * 1965-01-04 1968-01-04 Licentia Gmbh Verfahren zur Herstellung einer, die Sperrspannungsfestigkeit erhoehenden Randzonenprofilierung von Siliziumscheiben
DE1286641B (de) * 1966-08-26 1969-01-09 Bosch Gmbh Robert Verfahren zur Kontaktierung einer Halbleiteranordnung
DE1789062C3 (de) * 1968-09-30 1978-11-30 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen von Metallkontaktschichten für Halbleiteranordnungen
IT995593B (it) * 1972-12-11 1975-11-20 Rca Corp Dispositivo semiconduttore con connessioni a barretta e metodo di fabbricazione dello stesso
DE2332822B2 (de) * 1973-06-28 1978-04-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zum Herstellen von diffundierten, kontaktierten und oberflächenpassivierten Halbleiterbauelementen aus Halbleiterscheiben aus Silizium
GB1487201A (en) * 1974-12-20 1977-09-28 Lucas Electrical Ltd Method of manufacturing semi-conductor devices
US4042951A (en) * 1975-09-25 1977-08-16 Texas Instruments Incorporated Gold-germanium alloy contacts for a semiconductor device
IN144812B (cg-RX-API-DMAC10.html) * 1976-01-22 1978-07-15 Westinghouse Electric Corp
IT1059086B (it) * 1976-04-14 1982-05-31 Ates Componenti Elettron Procedimento per la passivazione di dispositivi a semiconduttore di potenza ad alta tensione inversa
DE2656015A1 (de) * 1976-12-10 1978-06-15 Bbc Brown Boveri & Cie Verfahren zum herstellen von halbleiterbauelementen
DE2709802A1 (de) * 1977-03-07 1978-09-14 Siemens Ag Verfahren zur entfernung von bei ionenimplantationsprozessen in halbleitersystemen entstehenden verunreinigungen
GB2064860B (en) * 1979-10-18 1984-01-25 Gen Electric Method for metallizing a semiconductor element
CA1164734A (en) * 1980-07-11 1984-04-03 Michael Schneider Method for applying an anti-reflection coating to a solar cell
US4339869A (en) * 1980-09-15 1982-07-20 General Electric Company Method of making low resistance contacts in semiconductor devices by ion induced silicides

Also Published As

Publication number Publication date
GB8529225D0 (en) 1986-01-02
GB2168843B (en) 1987-08-19
SE8306663D0 (sv) 1983-12-02
DE3344462A1 (de) 1984-06-20
GB2132412A (en) 1984-07-04
SE8306663L (sv) 1984-06-09
IT8324070A0 (it) 1983-12-06
DE3344462C2 (cg-RX-API-DMAC10.html) 1989-12-28
FR2537778B1 (fr) 1986-12-19
GB8332808D0 (en) 1984-01-18
GB2168843A (en) 1986-06-25
IT1194505B (it) 1988-09-22
FR2537778A1 (fr) 1984-06-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee