GB2064860B - Method for metallizing a semiconductor element - Google Patents

Method for metallizing a semiconductor element

Info

Publication number
GB2064860B
GB2064860B GB8031411A GB8031411A GB2064860B GB 2064860 B GB2064860 B GB 2064860B GB 8031411 A GB8031411 A GB 8031411A GB 8031411 A GB8031411 A GB 8031411A GB 2064860 B GB2064860 B GB 2064860B
Authority
GB
United Kingdom
Prior art keywords
metallizing
semiconductor element
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8031411A
Other versions
GB2064860A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP13352579A external-priority patent/JPS5659434A/en
Priority claimed from US06/098,907 external-priority patent/US4247579A/en
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB2064860A publication Critical patent/GB2064860A/en
Application granted granted Critical
Publication of GB2064860B publication Critical patent/GB2064860B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/02—Electrodes; Screens; Mounting, supporting, spacing or insulating thereof
    • H01J29/10—Screens on or from which an image or pattern is formed, picked up, converted or stored
    • H01J29/36—Photoelectric screens; Charge-storage screens
    • H01J29/39—Charge-storage screens
    • H01J29/44—Charge-storage screens exhibiting internal electric effects caused by particle radiation, e.g. bombardment-induced conductivity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Electrodes Of Semiconductors (AREA)
GB8031411A 1979-10-18 1980-09-29 Method for metallizing a semiconductor element Expired GB2064860B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP13352579A JPS5659434A (en) 1979-10-18 1979-10-18 Secondary electron multiplying target
US06/098,907 US4247579A (en) 1979-11-30 1979-11-30 Method for metallizing a semiconductor element

Publications (2)

Publication Number Publication Date
GB2064860A GB2064860A (en) 1981-06-17
GB2064860B true GB2064860B (en) 1984-01-25

Family

ID=26467852

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8031411A Expired GB2064860B (en) 1979-10-18 1980-09-29 Method for metallizing a semiconductor element

Country Status (1)

Country Link
GB (1) GB2064860B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE8306663L (en) * 1982-12-08 1984-06-09 Int Rectifier Corp PROCEDURE FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Also Published As

Publication number Publication date
GB2064860A (en) 1981-06-17

Similar Documents

Publication Publication Date Title
DE3068284D1 (en) Method for manufacturing a flocked substrate
DE3168688D1 (en) Method for manufacturing a semiconductor device
DE3265339D1 (en) Method for manufacturing semiconductor device
GB2058070B (en) Process for manufacturing 5-hydroxy-methyl-furfural
GB2101866B (en) A process for preparing cheese-base
DE3071446D1 (en) Process for producing a semiconductor device
YU308379A (en) Process for obtaining compound based on isosorbiddinitrate
GB2010580B (en) Method for manufacturing a semiconductor device
GB2105752B (en) A method for manufacturing a slide member
DE3063768D1 (en) A method of manufacturing a semiconductor device
DE3063191D1 (en) Method for manufacturing a semiconductor integrated circuit
DE3278181D1 (en) Method for manufacturing semiconductor device
DE3174752D1 (en) Method for manufacturing a semiconductor device
GB2090831B (en) A process for preparing n-acylcarnosine
PH17680A (en) Method for manufacturing brazed parts
DE3063971D1 (en) A method of manufacturing a semiconductor device
GB2064860B (en) Method for metallizing a semiconductor element
PT72756B (en) Process for preparing thiazoles
GB2086757B (en) Pre-diffusion method for sugar-works
DE3273038D1 (en) A method for preparing 1-aryl-3-arylamino-2-pyrazolin-5-ones
EG15730A (en) Process for preparing a arasin
JPS5682237A (en) Can manufacturing method
RO83931A (en) PROCESS FOR PREPARING FLUORING
GB2009497B (en) Method for manufacturing a semiconductor device
DE3162519D1 (en) Process for manufacturing caseinates

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee