GB2129600A - Methods of manufacturing magnetic thin film transducer heads - Google Patents
Methods of manufacturing magnetic thin film transducer heads Download PDFInfo
- Publication number
- GB2129600A GB2129600A GB08328339A GB8328339A GB2129600A GB 2129600 A GB2129600 A GB 2129600A GB 08328339 A GB08328339 A GB 08328339A GB 8328339 A GB8328339 A GB 8328339A GB 2129600 A GB2129600 A GB 2129600A
- Authority
- GB
- United Kingdom
- Prior art keywords
- thin film
- magnetic
- transducer head
- magnetic thin
- protective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
- G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
A method of manufacturing a magnetic thin film transducer head in which a protective layer 7 formed on a magnetic thin film transducer head element on a substrate 1 is made flat (cf Fig. 4), and then a protective plate 8 is bonded by an adhesive 9 onto the protective layer 7. A temporary protective layer (11) (Fig. 5) protects layer 7 and electrode portion (10) during processing. <IMAGE>
Description
SPECIFICATION
Methods of manufacturing magnetic thin film transducer heads
This invention relates to methods of manufacturing magnetic thin film transducer heads, for example, a magnetoresistance effect type magnetic transducer head.
As compared with an electromagnetic induction type magnetic reproducing transducer head, a magnetoresistance effect type magnetic transducer head has the advantages that it is capable of reproducing a magnetic signal from a relatively narrow track, or of relatively short wavelength, or at ultra-slow speed. One previously proposed magnetoresistance effect type magnetic transducer head is a so-called rear type, in which a magnetoresistance effect element is placed behind a tape contact surface relative to the tape. In a magnetoresistance effect type magnetic transducer head of rear type, since a step or projection is formed on the surface of a protective layer, which in practice is an insulating layer coated on the magnetoresistance effect element, spacing loss results, and the reliablity of the magnetic transducer head is lowered.This will now be further described with reference to an example shown in Figs. 1 to 3 of the accompanying drawings.
As schematically shown in Fig. 1, a magnetoresistance effect type magnetic transducer head of rear type is formed such that on a ferrite substrate 1 made of nickel-zinc ferrite or the like are sequentially deposited a bias conductor 2, a magnetoresistance effect film 3 and a core magnetic member 4 in that order, thereby to form a magnetic transducer head element portion which includes a thin film magnetic circuit. In Fig. 1, the insulating layer is not shown. The magnetoresistance effect film 3 is made of alloy containing mainly nickel-iron alloy or nickel-cobalt alloy.
It is formed at a position backward from a tape contact surface 1 a by approximately 10 microns. The magnetoresistance effect film 3 is of U shape, and the width thereof is approximately 5 to 10 microns. The core magnetic member 4 is formed of an amorphous film or the like made, for example, of permalloy, molybdenum-permalloy, sendust, cobaltzinc or iron-boron, and extends from the tape contact surface 1 a side rearwards so as to bridge over the magnetoresistance effect film 3. The core magnetic member 4 is cut away on the portion corresponding to the magnetoresistance effect film 3, so that the magnetic flux which passes through the magnetic circuit formed of the core magnetic member 4 and the substrate 1 is allowed to pass through the magnetoresistance effect film 3. At the tape contact surface side, a magnetic gap g is formed between the substrate 1 and the core magnetic member 4.It is possible for the bias conductor 2 to be ommited and self-biasing -employed.
When such a magnetoresistance effect type magnetic transducer head of rear type is manufactured, a thin-film forming technique is employed. As shown in Figs. 2 and 3, the substrate 1 is first prepred and then the bias conductor 2 is deposited thereon. When a ferrite substrate made of a good conductor such as manganese-zinc ferrite is used as the substrate 1, it is necessary previously to coat an insulating layer on the substrate 1. On the bias conductor 2 is deposited an insulating layer 5, on which is deposited the magnetoresistance effect film 3. On the magnetoresistance effect film 3 is further deposited an insulating layer 6. To reduce the magneticresistance of the magnetic circuit, a contact window 6a is formed through the insulating layer 6.After that, the core magnetic member 4 is deposited thereon, and then an insulating layer (protective layer) 7 is further deposited on the core magnetic member 4. On the insulating layer 7 is bonded a protective plate 8 which is made of glass or ceramic. This bonding is carried out by a bonding layer 9 of epoxy or glass adhesive.
With this configuration, due to the construction of the magnetic circuit, on the upper surface of the upper-most insulating layer 7 there is formed a step portion having a depth of some microns. Thus, in the vicinity of the skirt portion of the step portion including the tape contact surface 1 a, the thickness of the bonding layer 9 is increased. As a result, spacing loss is caused, and thereby the reproducing resolution is deteriorated, and the stable running of the magnetic recording medium or tape is disturbed. Moreover, at the skirt portion of this step portion, holes are produced in the bonding layer 9, and thereby the bonding layer 9 is peeled off. Thus, the magnetic transducer head becomes partially worn by the tape, so that the reliablility of the magnetic transducer head is lowered.Furthermore, when a resin adhesive is used as the bonding layer 9, owing to the thickness of the bonding layer 9, the resin adhesive exudes, and clogging is caused.
According to the present invention there is provided a method of manufacturing a magnetic thin film transducer head comprising the steps of: forming a magnetic transducer head element portion which includes a thin film magnetic circuit on a substrate; forming a protective layer on said magnetic transducer head element portion; making said protective layer flat; and bonding a protective plate onto said protective layer.
The invention will now be described by way of example with reference to the accompanying drawings, throughout which like parts are referred to by like references, and in which:
Figure 1 is a perspective view schematically illustrating an example of a previously proposed magnetic thin film transducer head;
Figure 2 is a cross-sectional view used to explain the manufacturing process of the magnetic thin film transducer head shown in Figs.
1;
Figure 3 is a plan view used in the same way; and
Figures 4 to 6 are respective cross-sectional views used to explain an embodiment of method according to the invention.
In the method according to the invention, as shown in Fig. 4, a ferrite substrate 1 is prepared and thereon are successively deposited a bias conductor 2, an insulating layer 5, a magnetoresistance effect film 3, an insulating layer 6, a core magnetic member 4, and an insulating layer 7 in that order, to form the magnetic transducer head element portion which includes the thin film magnetic circuit.
This process is the same as that described in connection with Figs. 2 and 3. In this case, after that, the upper-most insulating layer 7 is flattened as shown by a broken line in Fig. 4.
The flattening of the insulating layer 7 can be carried out by ion etching or lapping.
When ion etching is carried out, masking is effected so as to expose the step portion of the insulating layer 7, and then the ion etching is carried out.
When lapping is carried out, there is a risk that an electrode portion 10 shown in Fig. 5 may be scratched or broken. A protective layer 11 is coated on the electrode portion 10 before the lapping is carried out. The protective layer 11 is removed chemically after the lapping. In this case, the insulating layer 7 and the electrode portion 10 are protected from being corroded or damaged.
After the step portion of the insulating layer 7 has been flattened as described above, then as shown in Fig. 6, a protective plate 8 is bonded to the insulating layer 7 by a bonding layer 9. Since the upper surface of the insulating layer 7 has been made flat, the thickness of the bonding layer 9 can be thin. As a result, the spacing loss can be reduced, and the bonding layer 9 can be prevented from being peeled off.
Although the manufacture of a magnetoresistance effect type magnetic transducer head has been described, the invention can be applied to the manufacture of a thin film magnetic recording transducer head.
With magnetic transducer heads so made spacing loss can be reduced and superior resolution and more stable running of the tape can be obtained. Moreover, since the bonding layer does not peel off, partial wear of the magnetic transducer head can be avoided, and the reliablity of the magnetic transducer head improved. Furthermore, even when a resin adhesive is employed, it is prevented from extruding, and hence clogging can be avoided.
Claims (4)
1. A method of manufacturing a magnetic thin film transducer head comprising the steps of: forming a magnetic transducer head element portion which includes a thin film magnetic circuit on a substrate; forming a protective layer on said magnetic transducer head element portion; making said protective layer flat; and bonding a protective plate onto said protective layer.
2. A method according to claim 1, wherein said thin film magnetic circuit includes a magnetoresistance effect element.
3. A method of manufacturing a magnetic thin film transducer head, the method being substantially as hereinbefore described with reference to Figs. 4 to 6 of the accompanying drawings.
4. A magnetic thin film transducer head made by a method according to claim 1, claim 2 or claim 3.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57187074A JPS5977617A (en) | 1982-10-25 | 1982-10-25 | Production of thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8328339D0 GB8328339D0 (en) | 1983-11-23 |
| GB2129600A true GB2129600A (en) | 1984-05-16 |
Family
ID=16199676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08328339A Withdrawn GB2129600A (en) | 1982-10-25 | 1983-10-24 | Methods of manufacturing magnetic thin film transducer heads |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5977617A (en) |
| KR (1) | KR840006861A (en) |
| CA (1) | CA1212469A (en) |
| DE (1) | DE3338719A1 (en) |
| FR (1) | FR2535098A1 (en) |
| GB (1) | GB2129600A (en) |
| NL (1) | NL8303677A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0760490B2 (en) * | 1983-08-29 | 1995-06-28 | ソニー株式会社 | Method for manufacturing multi-element thin film magnetic head |
| JPS61107520A (en) * | 1984-10-31 | 1986-05-26 | Sony Corp | Multi-channel magnetoresistance effect type magnetic head |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1276073A (en) * | 1970-01-29 | 1972-06-01 | Ibm | Ceramic composition |
| GB1431996A (en) * | 1972-07-03 | 1976-04-14 | Linformatique Comp Int | Magnetic head devices |
| GB1476943A (en) * | 1973-09-04 | 1977-06-16 | Siemens Ag | Magnetic recording and playback heads |
| GB2064849A (en) * | 1979-11-28 | 1981-06-17 | Philips Nv | Integrated magnetic transducer head |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1518515A (en) * | 1974-08-20 | 1978-07-19 | Matsushita Electric Ind Co Ltd | Magnetic heads |
| US4065797A (en) * | 1974-12-20 | 1977-12-27 | Matsushita Electric Industrial Co., Ltd. | Multi-element magnetic head |
| JPS54104812A (en) * | 1978-02-03 | 1979-08-17 | Matsushita Electric Ind Co Ltd | Thin film magnetic head and production of the same |
| JPS55135321A (en) * | 1979-04-10 | 1980-10-22 | Fujitsu Ltd | Manufacture of thin-film magnetic head |
-
1982
- 1982-10-25 JP JP57187074A patent/JPS5977617A/en active Pending
-
1983
- 1983-10-21 KR KR1019830004989A patent/KR840006861A/en not_active IP Right Cessation
- 1983-10-21 CA CA000439505A patent/CA1212469A/en not_active Expired
- 1983-10-24 GB GB08328339A patent/GB2129600A/en not_active Withdrawn
- 1983-10-25 DE DE19833338719 patent/DE3338719A1/en not_active Withdrawn
- 1983-10-25 FR FR8317002A patent/FR2535098A1/en active Pending
- 1983-10-25 NL NL8303677A patent/NL8303677A/en not_active Application Discontinuation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1276073A (en) * | 1970-01-29 | 1972-06-01 | Ibm | Ceramic composition |
| GB1431996A (en) * | 1972-07-03 | 1976-04-14 | Linformatique Comp Int | Magnetic head devices |
| GB1476943A (en) * | 1973-09-04 | 1977-06-16 | Siemens Ag | Magnetic recording and playback heads |
| GB2064849A (en) * | 1979-11-28 | 1981-06-17 | Philips Nv | Integrated magnetic transducer head |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8328339D0 (en) | 1983-11-23 |
| DE3338719A1 (en) | 1984-04-26 |
| FR2535098A1 (en) | 1984-04-27 |
| NL8303677A (en) | 1984-05-16 |
| JPS5977617A (en) | 1984-05-04 |
| CA1212469A (en) | 1986-10-07 |
| KR840006861A (en) | 1984-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |