GB2109996B - Hydraulically actuated semiconductor wafer clamping and cooling apparatus - Google Patents

Hydraulically actuated semiconductor wafer clamping and cooling apparatus

Info

Publication number
GB2109996B
GB2109996B GB08232241A GB8232241A GB2109996B GB 2109996 B GB2109996 B GB 2109996B GB 08232241 A GB08232241 A GB 08232241A GB 8232241 A GB8232241 A GB 8232241A GB 2109996 B GB2109996 B GB 2109996B
Authority
GB
United Kingdom
Prior art keywords
semiconductor wafer
cooling apparatus
hydraulically actuated
wafer clamping
actuated semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08232241A
Other languages
English (en)
Other versions
GB2109996A (en
Inventor
Robert Billings Bramhall
Norman Leonard Turner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Varian Medical Systems Inc
Original Assignee
Varian Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates Inc filed Critical Varian Associates Inc
Publication of GB2109996A publication Critical patent/GB2109996A/en
Application granted granted Critical
Publication of GB2109996B publication Critical patent/GB2109996B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
GB08232241A 1981-11-24 1982-11-11 Hydraulically actuated semiconductor wafer clamping and cooling apparatus Expired GB2109996B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32451281A 1981-11-24 1981-11-24

Publications (2)

Publication Number Publication Date
GB2109996A GB2109996A (en) 1983-06-08
GB2109996B true GB2109996B (en) 1985-08-07

Family

ID=23263921

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08232241A Expired GB2109996B (en) 1981-11-24 1982-11-11 Hydraulically actuated semiconductor wafer clamping and cooling apparatus

Country Status (5)

Country Link
JP (1) JPS5893247A (https=)
DE (1) DE3242856A1 (https=)
FR (1) FR2517124A1 (https=)
GB (1) GB2109996B (https=)
NL (1) NL8204560A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110379729A (zh) * 2018-04-13 2019-10-25 北京北方华创微电子装备有限公司 加热基座及半导体加工设备

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775158B2 (ja) * 1986-05-20 1995-08-09 東京エレクトロン株式会社 半導体製造装置用高真空チヤンバ−における駆動装置
JPH0770297B2 (ja) * 1986-05-20 1995-07-31 東京エレクトロン株式会社 イオン注入装置におけるウエハ保持装置
US4938815A (en) * 1986-10-15 1990-07-03 Advantage Production Technology, Inc. Semiconductor substrate heater and reactor process and apparatus
US5044314A (en) * 1986-10-15 1991-09-03 Advantage Production Technology, Inc. Semiconductor wafer processing apparatus
US4956046A (en) * 1986-10-15 1990-09-11 Advantage Production Technology, Inc. Semiconductor substrate treating method
US4778559A (en) * 1986-10-15 1988-10-18 Advantage Production Technology Semiconductor substrate heater and reactor process and apparatus
US4891335A (en) * 1986-10-15 1990-01-02 Advantage Production Technology Inc. Semiconductor substrate heater and reactor process and apparatus
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
CH697200A5 (de) 2004-10-01 2008-06-25 Oerlikon Assembly Equipment Ag Klemmvorrichtung und Transportvorrichtung zum Transportieren von Substraten.

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
FR2501907A1 (fr) * 1981-03-13 1982-09-17 Thomson Csf Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110379729A (zh) * 2018-04-13 2019-10-25 北京北方华创微电子装备有限公司 加热基座及半导体加工设备

Also Published As

Publication number Publication date
FR2517124B1 (https=) 1985-02-15
NL8204560A (nl) 1983-06-16
FR2517124A1 (fr) 1983-05-27
GB2109996A (en) 1983-06-08
JPS5893247A (ja) 1983-06-02
DE3242856A1 (de) 1983-06-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee