NL8204560A - Hydraulisch bediende inkleminrichting voor een halfgeleiderplaatje. - Google Patents

Hydraulisch bediende inkleminrichting voor een halfgeleiderplaatje. Download PDF

Info

Publication number
NL8204560A
NL8204560A NL8204560A NL8204560A NL8204560A NL 8204560 A NL8204560 A NL 8204560A NL 8204560 A NL8204560 A NL 8204560A NL 8204560 A NL8204560 A NL 8204560A NL 8204560 A NL8204560 A NL 8204560A
Authority
NL
Netherlands
Prior art keywords
plate
pressure
fluid
printing plate
wafer
Prior art date
Application number
NL8204560A
Other languages
English (en)
Dutch (nl)
Original Assignee
Varian Associates
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Varian Associates filed Critical Varian Associates
Publication of NL8204560A publication Critical patent/NL8204560A/nl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
NL8204560A 1981-11-24 1982-11-23 Hydraulisch bediende inkleminrichting voor een halfgeleiderplaatje. NL8204560A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US32451281A 1981-11-24 1981-11-24
US32451281 1981-11-24

Publications (1)

Publication Number Publication Date
NL8204560A true NL8204560A (nl) 1983-06-16

Family

ID=23263921

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8204560A NL8204560A (nl) 1981-11-24 1982-11-23 Hydraulisch bediende inkleminrichting voor een halfgeleiderplaatje.

Country Status (5)

Country Link
JP (1) JPS5893247A (https=)
DE (1) DE3242856A1 (https=)
FR (1) FR2517124A1 (https=)
GB (1) GB2109996B (https=)
NL (1) NL8204560A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0775158B2 (ja) * 1986-05-20 1995-08-09 東京エレクトロン株式会社 半導体製造装置用高真空チヤンバ−における駆動装置
JPH0770297B2 (ja) * 1986-05-20 1995-07-31 東京エレクトロン株式会社 イオン注入装置におけるウエハ保持装置
US4938815A (en) * 1986-10-15 1990-07-03 Advantage Production Technology, Inc. Semiconductor substrate heater and reactor process and apparatus
US5044314A (en) * 1986-10-15 1991-09-03 Advantage Production Technology, Inc. Semiconductor wafer processing apparatus
US4956046A (en) * 1986-10-15 1990-09-11 Advantage Production Technology, Inc. Semiconductor substrate treating method
US4778559A (en) * 1986-10-15 1988-10-18 Advantage Production Technology Semiconductor substrate heater and reactor process and apparatus
US4891335A (en) * 1986-10-15 1990-01-02 Advantage Production Technology Inc. Semiconductor substrate heater and reactor process and apparatus
US7385821B1 (en) * 2001-12-06 2008-06-10 Apple Inc. Cooling method for ICS
CH697200A5 (de) 2004-10-01 2008-06-25 Oerlikon Assembly Equipment Ag Klemmvorrichtung und Transportvorrichtung zum Transportieren von Substraten.
CN110379729B (zh) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 加热基座及半导体加工设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282924A (en) * 1979-03-16 1981-08-11 Varian Associates, Inc. Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
FR2501907A1 (fr) * 1981-03-13 1982-09-17 Thomson Csf Procede de positionnement, de maintien d'un substrat plan sur une platine porte-substrat et de retrait de ce substrat ainsi que l'appareillage pour la mise en oeuvre du procede

Also Published As

Publication number Publication date
FR2517124B1 (https=) 1985-02-15
GB2109996B (en) 1985-08-07
FR2517124A1 (fr) 1983-05-27
GB2109996A (en) 1983-06-08
JPS5893247A (ja) 1983-06-02
DE3242856A1 (de) 1983-06-01

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Legal Events

Date Code Title Description
A85 Still pending on 85-01-01
BV The patent application has lapsed