GB2092376B - Improvements in semiconductor devices - Google Patents

Improvements in semiconductor devices

Info

Publication number
GB2092376B
GB2092376B GB8139049A GB8139049A GB2092376B GB 2092376 B GB2092376 B GB 2092376B GB 8139049 A GB8139049 A GB 8139049A GB 8139049 A GB8139049 A GB 8139049A GB 2092376 B GB2092376 B GB 2092376B
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8139049A
Other languages
English (en)
Other versions
GB2092376A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of GB2092376A publication Critical patent/GB2092376A/en
Application granted granted Critical
Publication of GB2092376B publication Critical patent/GB2092376B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/069—Manufacture or treatment of conductive parts of the interconnections by forming self-aligned vias or self-aligned contact plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars
GB8139049A 1980-12-29 1981-12-30 Improvements in semiconductor devices Expired GB2092376B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55188204A JPS57113235A (en) 1980-12-29 1980-12-29 Semiconductor device

Publications (2)

Publication Number Publication Date
GB2092376A GB2092376A (en) 1982-08-11
GB2092376B true GB2092376B (en) 1985-03-06

Family

ID=16219589

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8139049A Expired GB2092376B (en) 1980-12-29 1981-12-30 Improvements in semiconductor devices

Country Status (3)

Country Link
US (1) US4472730A (https=)
JP (1) JPS57113235A (https=)
GB (1) GB2092376B (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0105915A1 (en) * 1982-04-23 1984-04-25 Western Electric Company, Incorporated Semiconductor integrated circuit structures having insulated conductors
JPS5955037A (ja) * 1982-09-24 1984-03-29 Hitachi Ltd 半導体装置
FR2555364B1 (fr) * 1983-11-18 1990-02-02 Hitachi Ltd Procede de fabrication de connexions d'un dispositif a circuits integres a semi-conducteurs comportant en particulier un mitset
US4622576A (en) * 1984-10-22 1986-11-11 National Semiconductor Corporation Conductive non-metallic self-passivating non-corrodable IC bonding pads
US4824801A (en) * 1986-09-09 1989-04-25 Mitsubishi Denki Kabushiki Kaisha Method of manufacturing aluminum bonding pad with PSG coating
KR900007231B1 (ko) * 1986-09-16 1990-10-05 가부시키가이샤 도시바 반도체집적회로장치
US4922323A (en) * 1987-04-09 1990-05-01 Microelectronics And Computer Technology Corporation Hermetically sealed multilayer electrical feedthru
JPH0695517B2 (ja) * 1987-06-25 1994-11-24 日本電気株式会社 半導体装置
US5065222A (en) * 1987-11-11 1991-11-12 Seiko Instruments Inc. Semiconductor device having two-layered passivation film
US5366921A (en) * 1987-11-13 1994-11-22 Canon Kabushiki Kaisha Process for fabricating an electronic circuit apparatus
JPH0734449B2 (ja) * 1987-11-30 1995-04-12 三菱電機株式会社 半導体装置の電極接合部構造
US4998805A (en) * 1988-02-19 1991-03-12 Eastman Kodak Company Elimination of field-induced instabilities in electrooptic modulators
US5044220A (en) * 1988-03-10 1991-09-03 Dr. Ing. H.C.F. Porsche Ag Shifting arrangement for an automatic transmission of a motor vehicle
US4903118A (en) * 1988-03-30 1990-02-20 Director General, Agency Of Industrial Science And Technology Semiconductor device including a resilient bonding resin
US5121187A (en) * 1988-10-17 1992-06-09 Semiconductor Energy Laboratory Co., Ltd. Electric device having a leadframe covered with an antioxidation film
US5293073A (en) * 1989-06-27 1994-03-08 Kabushiki Kaisha Toshiba Electrode structure of a semiconductor device which uses a copper wire as a bonding wire
JPH0682704B2 (ja) * 1989-06-27 1994-10-19 株式会社東芝 半導体装置
JP2550248B2 (ja) * 1991-10-14 1996-11-06 株式会社東芝 半導体集積回路装置およびその製造方法
FR2691836B1 (fr) * 1992-05-27 1997-04-30 Ela Medical Sa Procede de fabrication d'un dispositif a semi-conducteurs comportant au moins une puce et dispositif correspondant.
JP3057130B2 (ja) 1993-02-18 2000-06-26 三菱電機株式会社 樹脂封止型半導体パッケージおよびその製造方法
JP2940432B2 (ja) * 1995-04-27 1999-08-25 ヤマハ株式会社 半導体装置とその製造方法
US5960306A (en) * 1995-12-15 1999-09-28 Motorola, Inc. Process for forming a semiconductor device
US6396145B1 (en) * 1998-06-12 2002-05-28 Hitachi, Ltd. Semiconductor device and method for manufacturing the same technical field
US6710446B2 (en) * 1999-12-30 2004-03-23 Renesas Technology Corporation Semiconductor device comprising stress relaxation layers and method for manufacturing the same
JP4003780B2 (ja) * 2004-09-17 2007-11-07 カシオ計算機株式会社 半導体装置及びその製造方法
CN100452367C (zh) * 2004-09-17 2009-01-14 卡西欧计算机株式会社 具有密封膜的芯片尺寸的半导体装置及其制造方法
CN102282659B (zh) * 2009-02-04 2013-11-20 松下电器产业株式会社 半导体基板结构及半导体装置
US9305788B2 (en) * 2012-10-29 2016-04-05 Sumitomo Electric Device Innovations, Inc. Method of fabricating semiconductor device
US9362191B2 (en) * 2013-08-29 2016-06-07 Infineon Technologies Austria Ag Encapsulated semiconductor device
CN110190118A (zh) * 2018-02-22 2019-08-30 三垦电气株式会社 半导体装置和电子设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005455A (en) * 1974-08-21 1977-01-25 Intel Corporation Corrosive resistant semiconductor interconnect pad
JPS5221782A (en) * 1975-08-13 1977-02-18 Toshiba Corp Producing system and unit of semiconductor
JPS5232270A (en) * 1975-09-05 1977-03-11 Hitachi Ltd Passivation film formaion by sputtering
JPS5295171A (en) * 1976-02-06 1977-08-10 Hitachi Ltd Electrode for semi-conductor
JPS5414672A (en) * 1977-07-06 1979-02-03 Hitachi Ltd Bonding electrode structure of semiconductor device
JPS54147789A (en) * 1978-05-11 1979-11-19 Matsushita Electric Ind Co Ltd Semiconductor divice and its manufacture
US4273805A (en) * 1978-06-19 1981-06-16 Rca Corporation Passivating composite for a semiconductor device comprising a silicon nitride (Si1 3N4) layer and phosphosilicate glass (PSG) layer
JPS558090A (en) * 1978-07-03 1980-01-21 Nec Corp Semiconductor device
JPS5519850A (en) * 1978-07-31 1980-02-12 Hitachi Ltd Semiconductor
JPS5527644A (en) * 1978-08-17 1980-02-27 Nec Corp Multi-layer wiring type semiconductor device

Also Published As

Publication number Publication date
JPS57113235A (en) 1982-07-14
GB2092376A (en) 1982-08-11
US4472730A (en) 1984-09-18
JPS6221266B2 (https=) 1987-05-12

Similar Documents

Publication Publication Date Title
GB2092376B (en) Improvements in semiconductor devices
JPS56142667A (en) Semiconductor device
JPS56126961A (en) Semiconductor device
JPS5778168A (en) Semiconductor device
JPS56164577A (en) Semiconductor device
JPS56105662A (en) Semiconductor device
DE3163340D1 (en) Semiconductor device
JPS56114370A (en) Semiconductor device
GB8403595D0 (en) Semiconductor device
JPS56126966A (en) Semiconductor device
EP0055558A3 (en) Semiconductor device
JPS56138956A (en) Semiconductor device
JPS56142668A (en) Semiconductor device
JPS56155567A (en) Semiconductor device
GB2149575B (en) Semiconductor device
DE3161615D1 (en) Semiconductor device
DE3166929D1 (en) Semiconductor device
JPS56101695A (en) Semiconductor device
JPS5773981A (en) Semiconductor device
DE3175373D1 (en) Semiconductor device
JPS57106075A (en) Semiconductor device
EP0048358A3 (en) Semiconductor device
DE3162083D1 (en) Semiconductor device
DE3174500D1 (en) Semiconductor device
DE3174789D1 (en) Semiconductor device

Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Effective date: 20011229