GB2087315B - Plasma etching of aluminum - Google Patents

Plasma etching of aluminum

Info

Publication number
GB2087315B
GB2087315B GB8140894A GB8130894A GB2087315B GB 2087315 B GB2087315 B GB 2087315B GB 8140894 A GB8140894 A GB 8140894A GB 8130894 A GB8130894 A GB 8130894A GB 2087315 B GB2087315 B GB 2087315B
Authority
GB
United Kingdom
Prior art keywords
aluminum
plasma etching
etching
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8140894A
Other languages
English (en)
Other versions
GB2087315A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Branson International Plasma Corp
Original Assignee
Branson International Plasma Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Branson International Plasma Corp filed Critical Branson International Plasma Corp
Publication of GB2087315A publication Critical patent/GB2087315A/en
Application granted granted Critical
Publication of GB2087315B publication Critical patent/GB2087315B/en
Expired legal-status Critical Current

Links

Classifications

    • H10P50/267—
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
GB8140894A 1980-10-14 1981-10-13 Plasma etching of aluminum Expired GB2087315B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19661680A 1980-10-14 1980-10-14

Publications (2)

Publication Number Publication Date
GB2087315A GB2087315A (en) 1982-05-26
GB2087315B true GB2087315B (en) 1984-07-18

Family

ID=22726125

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8140894A Expired GB2087315B (en) 1980-10-14 1981-10-13 Plasma etching of aluminum

Country Status (3)

Country Link
JP (1) JPS57123978A (enExample)
DE (1) DE3140675A1 (enExample)
GB (1) GB2087315B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4505782A (en) * 1983-03-25 1985-03-19 Lfe Corporation Plasma reactive ion etching of aluminum and aluminum alloys
JPH061770B2 (ja) * 1984-01-30 1994-01-05 株式会社日立製作所 ドライエツチング方法
GB2171360A (en) * 1985-02-19 1986-08-28 Oerlikon Buehrle Inc Etching aluminum/copper alloy films
JPS61235576A (ja) * 1985-04-10 1986-10-20 Tokuda Seisakusho Ltd ドライエツチング装置
JP2681058B2 (ja) * 1986-04-03 1997-11-19 アネルバ株式会社 ドライエッチング方法
JPH0727890B2 (ja) * 1986-09-19 1995-03-29 日本電気株式会社 ドライエツチング方法
DE3821207A1 (de) * 1988-06-23 1989-12-28 Leybold Ag Anordnung zum beschichten eines substrats mit dielektrika
DE3940820C2 (de) * 1989-12-11 1998-07-09 Leybold Ag Verfahren zur Behandlung von Werkstücken durch reaktives Ionenätzen
US5397433A (en) * 1993-08-20 1995-03-14 Vlsi Technology, Inc. Method and apparatus for patterning a metal layer
JP6061384B2 (ja) * 2013-01-17 2017-01-18 国立大学法人静岡大学 アルミ・樹脂接合体の製造方法及びアルミ・樹脂接合体

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54158343A (en) * 1978-06-05 1979-12-14 Hitachi Ltd Dry etching method for al and al alloy
US4182646A (en) * 1978-07-27 1980-01-08 John Zajac Process of etching with plasma etch gas
US4208241A (en) * 1978-07-31 1980-06-17 Bell Telephone Laboratories, Incorporated Device fabrication by plasma etching
US4256534A (en) * 1978-07-31 1981-03-17 Bell Telephone Laboratories, Incorporated Device fabrication by plasma etching
FR2432560A1 (fr) * 1978-08-02 1980-02-29 Texas Instruments Inc Procede de decapage de metaux, en particulier d'aluminium, au plasma de tetrachlorure de silicium
US4209357A (en) * 1979-05-18 1980-06-24 Tegal Corporation Plasma reactor apparatus

Also Published As

Publication number Publication date
DE3140675C2 (enExample) 1991-03-07
JPS57123978A (en) 1982-08-02
JPH0245714B2 (enExample) 1990-10-11
DE3140675A1 (de) 1982-06-16
GB2087315A (en) 1982-05-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19971013