GB2079534A - Package for semiconductor devices - Google Patents
Package for semiconductor devices Download PDFInfo
- Publication number
- GB2079534A GB2079534A GB8110198A GB8110198A GB2079534A GB 2079534 A GB2079534 A GB 2079534A GB 8110198 A GB8110198 A GB 8110198A GB 8110198 A GB8110198 A GB 8110198A GB 2079534 A GB2079534 A GB 2079534A
- Authority
- GB
- United Kingdom
- Prior art keywords
- package
- base
- leads
- metallization pattern
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 238000001465 metallisation Methods 0.000 claims abstract description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 239000003870 refractory metal Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000002860 competitive effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16545780A | 1980-07-02 | 1980-07-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2079534A true GB2079534A (en) | 1982-01-20 |
Family
ID=22598970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8110198A Withdrawn GB2079534A (en) | 1980-07-02 | 1981-04-01 | Package for semiconductor devices |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5745263A (de) |
| DE (1) | DE3123844A1 (de) |
| FR (1) | FR2486307A1 (de) |
| GB (1) | GB2079534A (de) |
| IT (1) | IT8167917A0 (de) |
| NL (1) | NL8102871A (de) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0116117A2 (de) * | 1982-10-21 | 1984-08-22 | Abbott Laboratories | Verfahren zum Herstellen elektrischer Verbindungen an einer Halbleiteranordnung |
| US4547795A (en) * | 1983-03-24 | 1985-10-15 | Bourns, Inc. | Leadless chip carrier with frangible shorting bars |
| WO1989008324A1 (en) * | 1988-02-29 | 1989-09-08 | Digital Equipment Corporation | Alignment of leads for ceramic integrated circuit packages |
| US4987475A (en) * | 1988-02-29 | 1991-01-22 | Digital Equipment Corporation | Alignment of leads for ceramic integrated circuit packages |
| FR2750798A1 (fr) * | 1996-07-02 | 1998-01-09 | Sgs Thomson Microelectronics | Boitier a faible cout pour circuits integres fabriques en petite quantite |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6263455A (ja) * | 1985-09-13 | 1987-03-20 | Hitachi Cable Ltd | リ−ドフレ−ムの製造方法 |
| JPS6422043U (de) * | 1987-07-30 | 1989-02-03 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH526203A (it) * | 1968-11-06 | 1972-07-31 | Olivetti & Co Spa | Procedimento di montaggio di uno o più circuiti elettronici integrati in un contenitore |
| US3550766A (en) * | 1969-03-03 | 1970-12-29 | David Nixen | Flat electronic package assembly |
| GB1258870A (de) * | 1969-09-29 | 1971-12-30 | ||
| US3760090A (en) * | 1971-08-19 | 1973-09-18 | Globe Union Inc | Electronic circuit package and method for making same |
-
1981
- 1981-04-01 GB GB8110198A patent/GB2079534A/en not_active Withdrawn
- 1981-06-15 NL NL8102871A patent/NL8102871A/nl not_active Application Discontinuation
- 1981-06-16 DE DE19813123844 patent/DE3123844A1/de not_active Withdrawn
- 1981-06-24 FR FR8112378A patent/FR2486307A1/fr active Pending
- 1981-07-01 IT IT8167917A patent/IT8167917A0/it unknown
- 1981-07-02 JP JP56102356A patent/JPS5745263A/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0116117A2 (de) * | 1982-10-21 | 1984-08-22 | Abbott Laboratories | Verfahren zum Herstellen elektrischer Verbindungen an einer Halbleiteranordnung |
| EP0116117A3 (en) * | 1982-10-21 | 1985-09-18 | Abbott Laboratories | A method of establishing electrical connections at a semiconductor device |
| US4547795A (en) * | 1983-03-24 | 1985-10-15 | Bourns, Inc. | Leadless chip carrier with frangible shorting bars |
| WO1989008324A1 (en) * | 1988-02-29 | 1989-09-08 | Digital Equipment Corporation | Alignment of leads for ceramic integrated circuit packages |
| US4987475A (en) * | 1988-02-29 | 1991-01-22 | Digital Equipment Corporation | Alignment of leads for ceramic integrated circuit packages |
| FR2750798A1 (fr) * | 1996-07-02 | 1998-01-09 | Sgs Thomson Microelectronics | Boitier a faible cout pour circuits integres fabriques en petite quantite |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2486307A1 (fr) | 1982-01-08 |
| NL8102871A (nl) | 1982-02-01 |
| IT8167917A0 (it) | 1981-07-01 |
| DE3123844A1 (de) | 1982-04-08 |
| JPS5745263A (en) | 1982-03-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |