GB2033927A - Device for attaching a printed circuit board to a product carrier for electroplating - Google Patents
Device for attaching a printed circuit board to a product carrier for electroplating Download PDFInfo
- Publication number
- GB2033927A GB2033927A GB7936145A GB7936145A GB2033927A GB 2033927 A GB2033927 A GB 2033927A GB 7936145 A GB7936145 A GB 7936145A GB 7936145 A GB7936145 A GB 7936145A GB 2033927 A GB2033927 A GB 2033927A
- Authority
- GB
- United Kingdom
- Prior art keywords
- arms
- printed circuit
- circuit board
- clamping
- product carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000009713 electroplating Methods 0.000 title claims description 9
- 125000006850 spacer group Chemical group 0.000 claims abstract description 11
- 241000826860 Trapezium Species 0.000 claims description 7
- 239000000463 material Substances 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 7
- 238000000576 coating method Methods 0.000 abstract description 7
- 238000012423 maintenance Methods 0.000 abstract description 3
- 239000007921 spray Substances 0.000 abstract description 3
- 239000003792 electrolyte Substances 0.000 description 5
- 230000008021 deposition Effects 0.000 description 3
- 239000008237 rinsing water Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Clamps And Clips (AREA)
- Load-Engaging Elements For Cranes (AREA)
- Manipulator (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782845886 DE2845886A1 (de) | 1978-10-21 | 1978-10-21 | Vorrichtung zum befestigen von leiterplatten an einem warentraeger |
Publications (1)
Publication Number | Publication Date |
---|---|
GB2033927A true GB2033927A (en) | 1980-05-29 |
Family
ID=6052764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7936145A Withdrawn GB2033927A (en) | 1978-10-21 | 1979-10-18 | Device for attaching a printed circuit board to a product carrier for electroplating |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5558399A (enrdf_load_stackoverflow) |
DE (1) | DE2845886A1 (enrdf_load_stackoverflow) |
FR (1) | FR2439320A1 (enrdf_load_stackoverflow) |
GB (1) | GB2033927A (enrdf_load_stackoverflow) |
IT (1) | IT1125501B (enrdf_load_stackoverflow) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3129909A1 (de) * | 1981-07-24 | 1983-02-10 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Schraub- und bestueckungsvorrichtung zum befestigen und loesen von leiterplatten fuer gedruckte schaltungen an einem galvanik-gestell |
AT381509B (de) * | 1985-02-06 | 1986-10-27 | Galvano Gestellbau Ing Rudolf | Vorrichtung zum halten von leiterplatten |
DE4212567A1 (de) * | 1992-03-14 | 1993-09-16 | Schmid Gmbh & Co Geb | Einrichtung zur behandlung von gegenstaenden, insbesondere galvanisiereinrichtungen fuer leiterplatten |
DE4317408C2 (de) * | 1993-05-18 | 1995-06-08 | Atotech Deutschland Gmbh | Vorrichtung zur Reduzierung von korrosionsbedingten elektrischen Übergangswiderständen an Kontaktstellen an Anoden- und Kathodenschienen elektrolytischer Bäder |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1404674A (en) * | 1918-04-27 | 1922-01-24 | Carl C Wille | Clamp |
US1519045A (en) * | 1924-05-01 | 1924-12-09 | Panko Albert | Plate hoist |
DE470681C (de) * | 1927-01-08 | 1929-01-25 | Riedel & Co | Vorrichtung zum UEberziehen von Gegenstaenden mit einem galvanischen UEberzug |
US1773042A (en) * | 1929-06-13 | 1930-08-12 | William S Jones | Mold or plate hanger |
US2820757A (en) * | 1955-05-26 | 1958-01-21 | Belke Mfg Co | Plating racks and methods of racking articles for electroplating |
DE7605843U1 (de) * | 1976-02-27 | 1976-07-15 | Seemann, Heinz, 7220 Schwenningen | Aufhaengevorrichtung fuer galvanische baeder |
-
1978
- 1978-10-21 DE DE19782845886 patent/DE2845886A1/de active Granted
-
1979
- 1979-10-18 GB GB7936145A patent/GB2033927A/en not_active Withdrawn
- 1979-10-18 IT IT26613/79A patent/IT1125501B/it active
- 1979-10-22 FR FR7926169A patent/FR2439320A1/fr not_active Withdrawn
- 1979-10-22 JP JP13534879A patent/JPS5558399A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5558399A (en) | 1980-05-01 |
DE2845886C2 (enrdf_load_stackoverflow) | 1987-11-26 |
FR2439320A1 (fr) | 1980-05-16 |
IT7926613A0 (it) | 1979-10-18 |
IT1125501B (it) | 1986-05-14 |
DE2845886A1 (de) | 1980-04-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4043891A (en) | Electrolytic cell with bipolar electrodes | |
US4297197A (en) | Electroplating rack | |
US6887113B1 (en) | Contact element for use in electroplating | |
CN215163269U (zh) | 一种电镀载具及电镀装置 | |
GB2033927A (en) | Device for attaching a printed circuit board to a product carrier for electroplating | |
CN205529113U (zh) | 一种半导体晶圆电镀夹持装置 | |
JPH06228791A (ja) | 電気めっき装置 | |
JP7532418B2 (ja) | 電気化学的プロセス用の電極アセンブリ | |
KR20200030651A (ko) | 인쇄회로기판용 개별 전기 도금장치 | |
CA2341218A1 (en) | Contact element | |
US4964964A (en) | Electroplating apparatus | |
KR20190056460A (ko) | 인쇄회로기판의 도금편차 개선을 위한 지그장치 | |
DE69602907D1 (de) | Verfahren zur Elektrolyse von Silber in Moebius-Zellen | |
JPH0338353B2 (enrdf_load_stackoverflow) | ||
US3746627A (en) | Method of metal electroplating | |
US3701726A (en) | Support assembly for electrolytic deposition on contact element | |
KR100584095B1 (ko) | 도금장치의 초박판형 기판 행거 랙구조 | |
US20070144896A1 (en) | Plating process enhanced by squeegee roller apparatus | |
US3888755A (en) | Cylinder plating rack | |
JPS5952716B2 (ja) | めつき装置 | |
CN217733328U (zh) | 一种电镀挂具 | |
JP2001073196A (ja) | メッキ装置及びこれを用いたメッキ方法 | |
KR890009047Y1 (ko) | 전기 도금기의 전류 전도장치 | |
US4487681A (en) | Electroplating test cell | |
SU1044684A1 (ru) | Анодное устройство электролитических ванн |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |