GB1597519A - Electrodeposition of copper - Google Patents
Electrodeposition of copper Download PDFInfo
- Publication number
- GB1597519A GB1597519A GB1677478A GB1677478A GB1597519A GB 1597519 A GB1597519 A GB 1597519A GB 1677478 A GB1677478 A GB 1677478A GB 1677478 A GB1677478 A GB 1677478A GB 1597519 A GB1597519 A GB 1597519A
- Authority
- GB
- United Kingdom
- Prior art keywords
- carbon atoms
- group
- bath
- organic
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 29
- 229910052802 copper Inorganic materials 0.000 title claims description 29
- 239000010949 copper Substances 0.000 title claims description 29
- 238000004070 electrodeposition Methods 0.000 title description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 28
- 238000007747 plating Methods 0.000 claims description 28
- -1 polypropylene propanols Polymers 0.000 claims description 26
- 150000001875 compounds Chemical class 0.000 claims description 25
- 229920000570 polyether Polymers 0.000 claims description 24
- 125000002947 alkylene group Chemical group 0.000 claims description 18
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 16
- 230000002378 acidificating effect Effects 0.000 claims description 15
- 239000007795 chemical reaction product Substances 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- 229940100198 alkylating agent Drugs 0.000 claims description 9
- 239000002168 alkylating agent Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 229920001021 polysulfide Polymers 0.000 claims description 9
- 150000003568 thioethers Chemical class 0.000 claims description 9
- 229920002873 Polyethylenimine Polymers 0.000 claims description 8
- 150000007513 acids Chemical class 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 7
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 6
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052783 alkali metal Inorganic materials 0.000 claims description 4
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 4
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 claims description 4
- 229940073608 benzyl chloride Drugs 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- 125000001273 sulfonato group Chemical group [O-]S(*)(=O)=O 0.000 claims description 4
- 239000001117 sulphuric acid Substances 0.000 claims description 4
- 235000011149 sulphuric acid Nutrition 0.000 claims description 4
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 3
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 claims description 3
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims description 3
- 239000005864 Sulphur Substances 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 125000003342 alkenyl group Chemical group 0.000 claims description 3
- 125000000304 alkynyl group Chemical group 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- CSPHGSFZFWKVDL-UHFFFAOYSA-M (3-chloro-2-hydroxypropyl)-trimethylazanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC(O)CCl CSPHGSFZFWKVDL-UHFFFAOYSA-M 0.000 claims description 2
- FSSPGSAQUIYDCN-UHFFFAOYSA-N 1,3-Propane sultone Chemical compound O=S1(=O)CCCO1 FSSPGSAQUIYDCN-UHFFFAOYSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 2
- 229910006069 SO3H Chemical group 0.000 claims description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 2
- 150000001340 alkali metals Chemical class 0.000 claims description 2
- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 claims description 2
- 239000011260 aqueous acid Substances 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- JXLHNMVSKXFWAO-UHFFFAOYSA-N azane;7-fluoro-2,1,3-benzoxadiazole-4-sulfonic acid Chemical compound N.OS(=O)(=O)C1=CC=C(F)C2=NON=C12 JXLHNMVSKXFWAO-UHFFFAOYSA-N 0.000 claims description 2
- 238000005282 brightening Methods 0.000 claims description 2
- VAYGXNSJCAHWJZ-UHFFFAOYSA-N dimethyl sulfate Chemical compound COS(=O)(=O)OC VAYGXNSJCAHWJZ-UHFFFAOYSA-N 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 150000002334 glycols Chemical class 0.000 claims description 2
- 125000000623 heterocyclic group Chemical group 0.000 claims description 2
- 125000000963 oxybis(methylene) group Chemical group [H]C([H])(*)OC([H])([H])* 0.000 claims description 2
- 229920000151 polyglycol Polymers 0.000 claims description 2
- 239000010695 polyglycol Substances 0.000 claims description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 claims description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-N sulfonic acid Chemical group OS(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-N 0.000 claims description 2
- 150000003558 thiocarbamic acid derivatives Chemical class 0.000 claims description 2
- 239000000080 wetting agent Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 229910021653 sulphate ion Inorganic materials 0.000 claims 1
- 238000013019 agitation Methods 0.000 description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 125000001453 quaternary ammonium group Chemical group 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000002152 alkylating effect Effects 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 150000001767 cationic compounds Chemical class 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 229910001411 inorganic cation Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000005956 quaternization reaction Methods 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/793,701 US4110176A (en) | 1975-03-11 | 1977-05-04 | Electrodeposition of copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1597519A true GB1597519A (en) | 1981-09-09 |
Family
ID=25160576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1677478A Expired GB1597519A (en) | 1977-05-04 | 1978-04-27 | Electrodeposition of copper |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5448646A (enrdf_load_stackoverflow) |
| AR (1) | AR224861A1 (enrdf_load_stackoverflow) |
| CA (1) | CA1105045A (enrdf_load_stackoverflow) |
| DE (1) | DE2818725A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2389689B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1597519A (enrdf_load_stackoverflow) |
| NL (1) | NL7804874A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2133028A (en) * | 1982-12-23 | 1984-07-18 | Procter & Gamble | Detergent compositions |
| EP2770087A1 (en) * | 2013-02-25 | 2014-08-27 | Rohm and Haas Electronic Materials LLC | Electroplating bath |
| US20160076160A1 (en) * | 2014-09-15 | 2016-03-17 | Enthone Inc. | Levelers for copper deposition in microelectronics |
| CN115917049A (zh) * | 2021-07-30 | 2023-04-04 | 宏维科技有限公司 | 用于填充通孔的流平剂和电解组合物 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU559896B2 (en) * | 1983-06-10 | 1987-03-26 | Omi International Corp. | Electrolytic copper depositing processes |
| EP2547731B1 (en) * | 2010-03-18 | 2014-07-30 | Basf Se | Composition for metal electroplating comprising leveling agent |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3334138A (en) * | 1963-08-02 | 1967-08-01 | Crompton & Knowles Corp | Polymeric quaternary ammonium compound |
| US3650915A (en) * | 1969-01-23 | 1972-03-21 | Itt | Copper electrodeposition electrolytes and method |
| ZA708430B (en) * | 1970-02-12 | 1971-09-29 | Udylite Corp | Electrodeposition of copper from acidic baths |
| US3770598A (en) * | 1972-01-21 | 1973-11-06 | Oxy Metal Finishing Corp | Electrodeposition of copper from acid baths |
| IT1046971B (it) * | 1975-03-11 | 1980-09-10 | Oxy Metal Industries Corp | Begno per l elettrodeposizione di rame e metodo per prepararlo |
| JPS527819A (en) * | 1975-07-10 | 1977-01-21 | Furukawa Electric Co Ltd:The | Process for smooth electrodeposition of copper |
-
1978
- 1978-04-11 CA CA300,851A patent/CA1105045A/en not_active Expired
- 1978-04-19 FR FR7811498A patent/FR2389689B1/fr not_active Expired
- 1978-04-27 GB GB1677478A patent/GB1597519A/en not_active Expired
- 1978-04-28 DE DE19782818725 patent/DE2818725A1/de active Pending
- 1978-04-28 AR AR27198378A patent/AR224861A1/es active
- 1978-05-01 JP JP5262178A patent/JPS5448646A/ja active Pending
- 1978-05-05 NL NL7804874A patent/NL7804874A/xx not_active Application Discontinuation
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2133028A (en) * | 1982-12-23 | 1984-07-18 | Procter & Gamble | Detergent compositions |
| GB2171108A (en) * | 1982-12-23 | 1986-08-20 | Procter & Gamble | Detergent compositions |
| EP2770087A1 (en) * | 2013-02-25 | 2014-08-27 | Rohm and Haas Electronic Materials LLC | Electroplating bath |
| US20160076160A1 (en) * | 2014-09-15 | 2016-03-17 | Enthone Inc. | Levelers for copper deposition in microelectronics |
| EP3195708A4 (en) * | 2014-09-15 | 2018-07-18 | Macdermid Enthone Inc. | Levelers for copper deposition in microelectronics |
| US10294574B2 (en) | 2014-09-15 | 2019-05-21 | Macdermid Enthone Inc. | Levelers for copper deposition in microelectronics |
| CN115917049A (zh) * | 2021-07-30 | 2023-04-04 | 宏维科技有限公司 | 用于填充通孔的流平剂和电解组合物 |
| EP4151777A4 (en) * | 2021-07-30 | 2024-02-28 | YMT Co., Ltd. | LEVELING AGENT AND ELECTRICAL PLATING COMPOSITION CONTAINING SAME FOR FILLING CONTACT HOLES |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2389689B1 (enrdf_load_stackoverflow) | 1983-04-22 |
| NL7804874A (nl) | 1978-11-07 |
| JPS5448646A (en) | 1979-04-17 |
| DE2818725A1 (de) | 1978-11-16 |
| AR224861A1 (es) | 1982-01-29 |
| CA1105045A (en) | 1981-07-14 |
| FR2389689A1 (enrdf_load_stackoverflow) | 1978-12-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |