AR224861A1 - Bano para electrodeposicion de cobre que incluye polialquileniminas cuaternizadas como aditivos depositos brillantes de cobre y procedimientos para preparar dicho aditivo de aplicacion exclusiva para dicho bano - Google Patents

Bano para electrodeposicion de cobre que incluye polialquileniminas cuaternizadas como aditivos depositos brillantes de cobre y procedimientos para preparar dicho aditivo de aplicacion exclusiva para dicho bano

Info

Publication number
AR224861A1
AR224861A1 AR27198378A AR27198378A AR224861A1 AR 224861 A1 AR224861 A1 AR 224861A1 AR 27198378 A AR27198378 A AR 27198378A AR 27198378 A AR27198378 A AR 27198378A AR 224861 A1 AR224861 A1 AR 224861A1
Authority
AR
Argentina
Prior art keywords
bathroom
copper
polyalkylenimines
additives
additive
Prior art date
Application number
AR27198378A
Other languages
English (en)
Spanish (es)
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/793,701 external-priority patent/US4110176A/en
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Application granted granted Critical
Publication of AR224861A1 publication Critical patent/AR224861A1/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
AR27198378A 1977-05-04 1978-04-28 Bano para electrodeposicion de cobre que incluye polialquileniminas cuaternizadas como aditivos depositos brillantes de cobre y procedimientos para preparar dicho aditivo de aplicacion exclusiva para dicho bano AR224861A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/793,701 US4110176A (en) 1975-03-11 1977-05-04 Electrodeposition of copper

Publications (1)

Publication Number Publication Date
AR224861A1 true AR224861A1 (es) 1982-01-29

Family

ID=25160576

Family Applications (1)

Application Number Title Priority Date Filing Date
AR27198378A AR224861A1 (es) 1977-05-04 1978-04-28 Bano para electrodeposicion de cobre que incluye polialquileniminas cuaternizadas como aditivos depositos brillantes de cobre y procedimientos para preparar dicho aditivo de aplicacion exclusiva para dicho bano

Country Status (7)

Country Link
JP (1) JPS5448646A (enrdf_load_stackoverflow)
AR (1) AR224861A1 (enrdf_load_stackoverflow)
CA (1) CA1105045A (enrdf_load_stackoverflow)
DE (1) DE2818725A1 (enrdf_load_stackoverflow)
FR (1) FR2389689B1 (enrdf_load_stackoverflow)
GB (1) GB1597519A (enrdf_load_stackoverflow)
NL (1) NL7804874A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0111965B1 (en) * 1982-12-23 1989-07-26 THE PROCTER & GAMBLE COMPANY Detergent compositions containing cationic compounds having clay soil removal/anti-redeposition properties
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
JP5955785B2 (ja) * 2010-03-18 2016-07-20 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ レベリング剤を含有する金属電解めっき用組成物
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
TWI710671B (zh) * 2014-09-15 2020-11-21 美商麥德美樂思公司 微電子技術中銅沈積用之平整劑
KR102339867B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334138A (en) * 1963-08-02 1967-08-01 Crompton & Knowles Corp Polymeric quaternary ammonium compound
US3650915A (en) * 1969-01-23 1972-03-21 Itt Copper electrodeposition electrolytes and method
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
GB1526076A (en) * 1975-03-11 1978-09-27 Oxy Metal Industries Corp Electrodeposition of copper
JPS527819A (en) * 1975-07-10 1977-01-21 Furukawa Electric Co Ltd:The Process for smooth electrodeposition of copper

Also Published As

Publication number Publication date
CA1105045A (en) 1981-07-14
FR2389689B1 (enrdf_load_stackoverflow) 1983-04-22
FR2389689A1 (enrdf_load_stackoverflow) 1978-12-01
NL7804874A (nl) 1978-11-07
JPS5448646A (en) 1979-04-17
GB1597519A (en) 1981-09-09
DE2818725A1 (de) 1978-11-16

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