CA1105045A - Electrodeposition of copper - Google Patents

Electrodeposition of copper

Info

Publication number
CA1105045A
CA1105045A CA300,851A CA300851A CA1105045A CA 1105045 A CA1105045 A CA 1105045A CA 300851 A CA300851 A CA 300851A CA 1105045 A CA1105045 A CA 1105045A
Authority
CA
Canada
Prior art keywords
carbon atoms
group
bath
alkylene
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA300,851A
Other languages
English (en)
French (fr)
Inventor
Hans G. Creutz (Deceased)
Roy W. Herr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/793,701 external-priority patent/US4110176A/en
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Application granted granted Critical
Publication of CA1105045A publication Critical patent/CA1105045A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
CA300,851A 1977-05-04 1978-04-11 Electrodeposition of copper Expired CA1105045A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US793,701 1977-05-04
US05/793,701 US4110176A (en) 1975-03-11 1977-05-04 Electrodeposition of copper

Publications (1)

Publication Number Publication Date
CA1105045A true CA1105045A (en) 1981-07-14

Family

ID=25160576

Family Applications (1)

Application Number Title Priority Date Filing Date
CA300,851A Expired CA1105045A (en) 1977-05-04 1978-04-11 Electrodeposition of copper

Country Status (7)

Country Link
JP (1) JPS5448646A (enrdf_load_stackoverflow)
AR (1) AR224861A1 (enrdf_load_stackoverflow)
CA (1) CA1105045A (enrdf_load_stackoverflow)
DE (1) DE2818725A1 (enrdf_load_stackoverflow)
FR (1) FR2389689B1 (enrdf_load_stackoverflow)
GB (1) GB1597519A (enrdf_load_stackoverflow)
NL (1) NL7804874A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0111965B1 (en) * 1982-12-23 1989-07-26 THE PROCTER & GAMBLE COMPANY Detergent compositions containing cationic compounds having clay soil removal/anti-redeposition properties
AU559896B2 (en) * 1983-06-10 1987-03-26 Omi International Corp. Electrolytic copper depositing processes
EP2547731B1 (en) * 2010-03-18 2014-07-30 Basf Se Composition for metal electroplating comprising leveling agent
US20140238868A1 (en) * 2013-02-25 2014-08-28 Dow Global Technologies Llc Electroplating bath
TWI710671B (zh) * 2014-09-15 2020-11-21 美商麥德美樂思公司 微電子技術中銅沈積用之平整劑
KR102339867B1 (ko) * 2021-07-30 2021-12-16 와이엠티 주식회사 레벨링제 및 이를 포함하는 비아홀 충진을 위한 전기도금 조성물

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3334138A (en) * 1963-08-02 1967-08-01 Crompton & Knowles Corp Polymeric quaternary ammonium compound
US3650915A (en) * 1969-01-23 1972-03-21 Itt Copper electrodeposition electrolytes and method
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
IT1046971B (it) * 1975-03-11 1980-09-10 Oxy Metal Industries Corp Begno per l elettrodeposizione di rame e metodo per prepararlo
JPS527819A (en) * 1975-07-10 1977-01-21 Furukawa Electric Co Ltd:The Process for smooth electrodeposition of copper

Also Published As

Publication number Publication date
FR2389689B1 (enrdf_load_stackoverflow) 1983-04-22
NL7804874A (nl) 1978-11-07
JPS5448646A (en) 1979-04-17
DE2818725A1 (de) 1978-11-16
AR224861A1 (es) 1982-01-29
GB1597519A (en) 1981-09-09
FR2389689A1 (enrdf_load_stackoverflow) 1978-12-01

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Legal Events

Date Code Title Description
MKEX Expiry