GB1594399A - Metal deposition - Google Patents

Metal deposition Download PDF

Info

Publication number
GB1594399A
GB1594399A GB22633/78A GB2263378A GB1594399A GB 1594399 A GB1594399 A GB 1594399A GB 22633/78 A GB22633/78 A GB 22633/78A GB 2263378 A GB2263378 A GB 2263378A GB 1594399 A GB1594399 A GB 1594399A
Authority
GB
United Kingdom
Prior art keywords
tiba
aluminium
argon
deposition
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB22633/78A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB22633/78A priority Critical patent/GB1594399A/en
Priority to IT22732/79A priority patent/IT1192727B/it
Priority to DE19792920384 priority patent/DE2920384C2/de
Priority to FR7913339A priority patent/FR2426743A1/fr
Priority to JP6488579A priority patent/JPS54163793A/ja
Publication of GB1594399A publication Critical patent/GB1594399A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561Gas plumbing upstream of the reaction chamber
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/06Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
    • C23C16/18Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
    • C23C16/20Deposition of aluminium only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
GB22633/78A 1978-05-25 1978-05-25 Metal deposition Expired GB1594399A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB22633/78A GB1594399A (en) 1978-05-25 1978-05-25 Metal deposition
IT22732/79A IT1192727B (it) 1978-05-25 1979-05-17 Perfezionamento nella deposizione di pellicole di metallo
DE19792920384 DE2920384C2 (de) 1978-05-25 1979-05-19 Verfahren zur Herstellung von Beschichtungen und Leitbahnen aus Aluminium
FR7913339A FR2426743A1 (fr) 1978-05-25 1979-05-25 Procede et dispositif de revetement metallique par depot sous forme de vapeurs
JP6488579A JPS54163793A (en) 1978-05-25 1979-05-25 Aluminum thermal decomposition depositing method and apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB22633/78A GB1594399A (en) 1978-05-25 1978-05-25 Metal deposition

Publications (1)

Publication Number Publication Date
GB1594399A true GB1594399A (en) 1981-07-30

Family

ID=10182595

Family Applications (1)

Application Number Title Priority Date Filing Date
GB22633/78A Expired GB1594399A (en) 1978-05-25 1978-05-25 Metal deposition

Country Status (4)

Country Link
JP (1) JPS54163793A (enrdf_load_stackoverflow)
FR (1) FR2426743A1 (enrdf_load_stackoverflow)
GB (1) GB1594399A (enrdf_load_stackoverflow)
IT (1) IT1192727B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4716050A (en) * 1985-05-03 1987-12-29 American Telephone And Telegraph Company, At&T Bell Laboratories Chemical vapor deposition of aluminum on an activated surface

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5985857A (ja) * 1982-11-08 1984-05-17 Semiconductor Energy Lab Co Ltd アルミニユ−ム被膜の作製方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2921868A (en) * 1956-06-07 1960-01-19 Union Carbide Corp Aluminum gas plating of various substrates
FR1210117A (fr) * 1958-09-02 1960-03-07 Ohio Commw Eng Co Dépôt d'aluminium à partir d'un composé gazeux, en particulier du triisobutyle d'aluminium
FR1405106A (fr) * 1964-08-26 1965-07-02 Union Carbide Corp Procédé pour déposer des revêtements métallliques dans des trous, des tubes, des fentes, des fissures et autres cavités analogues

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4716050A (en) * 1985-05-03 1987-12-29 American Telephone And Telegraph Company, At&T Bell Laboratories Chemical vapor deposition of aluminum on an activated surface

Also Published As

Publication number Publication date
JPS54163793A (en) 1979-12-26
IT7922732A0 (it) 1979-05-17
FR2426743B1 (enrdf_load_stackoverflow) 1983-08-26
FR2426743A1 (fr) 1979-12-21
IT1192727B (it) 1988-05-04
JPS641550B2 (enrdf_load_stackoverflow) 1989-01-11

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940525