GB1593694A - Method for making a semiconductor device - Google Patents
Method for making a semiconductor device Download PDFInfo
- Publication number
- GB1593694A GB1593694A GB1075/78A GB107578A GB1593694A GB 1593694 A GB1593694 A GB 1593694A GB 1075/78 A GB1075/78 A GB 1075/78A GB 107578 A GB107578 A GB 107578A GB 1593694 A GB1593694 A GB 1593694A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- polyoxide
- polysilicon
- substrate
- oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/013—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator
- H10D64/01302—Manufacture or treatment of electrodes having a conductor capacitively coupled to a semiconductor by an insulator the insulator being formed after the semiconductor body, the semiconductor being silicon
- H10D64/01332—Making the insulator
- H10D64/0135—Making the insulator by deposition of a layer, e.g. metal, metal compound or polysilicon, followed by transformation thereof into the insulator
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/61—Formation of materials, e.g. in the shape of layers or pillars of insulating materials using masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
- H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
- H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6304—Formation by oxidation, e.g. oxidation of the substrate
- H10P14/6306—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials
- H10P14/6308—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors
- H10P14/6309—Formation by oxidation, e.g. oxidation of the substrate of the semiconductor materials of Group IV semiconductors of silicon in uncombined form, i.e. pure silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6302—Non-deposition formation processes
- H10P14/6322—Formation by thermal treatments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6502—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed before formation of the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
- H10P32/30—Diffusion for doping of conductive or resistive layers
- H10P32/302—Doping polycrystalline silicon or amorphous silicon layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
Landscapes
- Formation Of Insulating Films (AREA)
- Element Separation (AREA)
- Weting (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Local Oxidation Of Silicon (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75980377A | 1977-01-17 | 1977-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1593694A true GB1593694A (en) | 1981-07-22 |
Family
ID=25057013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1075/78A Expired GB1593694A (en) | 1977-01-17 | 1978-01-11 | Method for making a semiconductor device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5812732B2 (enExample) |
| DE (1) | DE2801680A1 (enExample) |
| FR (1) | FR2377703A1 (enExample) |
| GB (1) | GB1593694A (enExample) |
| IT (1) | IT1089298B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4268951A (en) * | 1978-11-13 | 1981-05-26 | Rockwell International Corporation | Submicron semiconductor devices |
| JPS5941870A (ja) * | 1982-08-25 | 1984-03-08 | Toshiba Corp | 半導体装置の製造方法 |
| JPS5955071A (ja) * | 1982-09-24 | 1984-03-29 | Hitachi Micro Comput Eng Ltd | 不揮発性半導体装置 |
| GB2131407B (en) * | 1982-11-12 | 1987-02-04 | Rca Corp | Method of formation of silicon dioxide layer |
| JPS59184547A (ja) * | 1983-04-04 | 1984-10-19 | Agency Of Ind Science & Technol | 半導体装置及びその製造方法 |
| JPS6066866A (ja) * | 1983-09-24 | 1985-04-17 | Sharp Corp | 炭化珪素mos構造の製造方法 |
| CN112002648A (zh) * | 2020-07-14 | 2020-11-27 | 全球能源互联网研究院有限公司 | 一种碳化硅功率器件的制备方法及碳化硅功率器件 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3966501A (en) * | 1973-03-23 | 1976-06-29 | Mitsubishi Denki Kabushiki Kaisha | Process of producing semiconductor devices |
| JPS5536185B2 (enExample) * | 1973-05-08 | 1980-09-19 | ||
| US3911168A (en) * | 1973-06-01 | 1975-10-07 | Fairchild Camera Instr Co | Method for forming a continuous layer of silicon dioxide over a substrate |
| US3874920A (en) * | 1973-06-28 | 1975-04-01 | Ibm | Boron silicide method for making thermally oxidized boron doped poly-crystalline silicon having minimum resistivity |
| US3899373A (en) * | 1974-05-20 | 1975-08-12 | Ibm | Method for forming a field effect device |
-
1977
- 1977-12-30 IT IT31505/77A patent/IT1089298B/it active
-
1978
- 1978-01-11 GB GB1075/78A patent/GB1593694A/en not_active Expired
- 1978-01-16 FR FR7801128A patent/FR2377703A1/fr active Granted
- 1978-01-16 DE DE19782801680 patent/DE2801680A1/de not_active Ceased
- 1978-01-17 JP JP53002850A patent/JPS5812732B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2377703A1 (fr) | 1978-08-11 |
| IT1089298B (it) | 1985-06-18 |
| JPS5390776A (en) | 1978-08-09 |
| FR2377703B1 (enExample) | 1985-04-12 |
| JPS5812732B2 (ja) | 1983-03-10 |
| DE2801680A1 (de) | 1978-07-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PE20 | Patent expired after termination of 20 years |
Effective date: 19980110 |