GB1536794A - Cooling device for a liquid-cooled power semiconductor device - Google Patents

Cooling device for a liquid-cooled power semiconductor device

Info

Publication number
GB1536794A
GB1536794A GB672277A GB672277A GB1536794A GB 1536794 A GB1536794 A GB 1536794A GB 672277 A GB672277 A GB 672277A GB 672277 A GB672277 A GB 672277A GB 1536794 A GB1536794 A GB 1536794A
Authority
GB
United Kingdom
Prior art keywords
connector
cooling
feb
tubes
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB672277A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Germany
Original Assignee
BBC BROWN BOVERI and CIE
Brown Boveri und Cie AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, Brown Boveri und Cie AG Germany filed Critical BBC BROWN BOVERI and CIE
Publication of GB1536794A publication Critical patent/GB1536794A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB672277A 1976-02-17 1977-02-17 Cooling device for a liquid-cooled power semiconductor device Expired GB1536794A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762606157 DE2606157C2 (de) 1976-02-17 1976-02-17 Verbindung von Kühldose einer Kühleinrichtung mit einer Kühlflüssigkeitszuleitung oder- ableitung

Publications (1)

Publication Number Publication Date
GB1536794A true GB1536794A (en) 1978-12-20

Family

ID=5970025

Family Applications (1)

Application Number Title Priority Date Filing Date
GB672277A Expired GB1536794A (en) 1976-02-17 1977-02-17 Cooling device for a liquid-cooled power semiconductor device

Country Status (5)

Country Link
AT (1) AT348063B (enrdf_load_stackoverflow)
CH (1) CH594289A5 (enrdf_load_stackoverflow)
DE (1) DE2606157C2 (enrdf_load_stackoverflow)
FR (1) FR2341946A1 (enrdf_load_stackoverflow)
GB (1) GB1536794A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3617611A1 (de) * 1986-05-24 1987-11-26 Licentia Gmbh Thermisch leitende und elektrisch isolierende zwischenlage fuer aufbau und befestigung von halbleiterelementen und anordnung unter anwendung derartiger zwischenlagen

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2160302C3 (de) * 1971-12-04 1975-07-17 Siemens Ag Kühldose zum Einbau in Scheibenzellenstapel
US3794886A (en) * 1972-06-26 1974-02-26 W Goldman Fluid cooled semiconductor socket

Also Published As

Publication number Publication date
DE2606157A1 (de) 1977-08-18
ATA104577A (de) 1978-06-15
AT348063B (de) 1979-01-25
DE2606157C2 (de) 1983-11-10
CH594289A5 (enrdf_load_stackoverflow) 1978-01-13
FR2341946A1 (fr) 1977-09-16
FR2341946B1 (enrdf_load_stackoverflow) 1982-04-09

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee