GB1531327A - Thin film circuit assemblies - Google Patents

Thin film circuit assemblies

Info

Publication number
GB1531327A
GB1531327A GB8825/76A GB882576A GB1531327A GB 1531327 A GB1531327 A GB 1531327A GB 8825/76 A GB8825/76 A GB 8825/76A GB 882576 A GB882576 A GB 882576A GB 1531327 A GB1531327 A GB 1531327A
Authority
GB
United Kingdom
Prior art keywords
layer
nickel
solder
resistance
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8825/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB1531327A publication Critical patent/GB1531327A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/01—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
    • H01L27/016—Thin-film circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
GB8825/76A 1975-03-07 1976-03-05 Thin film circuit assemblies Expired GB1531327A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2509912A DE2509912C3 (de) 1975-03-07 1975-03-07 Elektronische Dünnfilmschaltung

Publications (1)

Publication Number Publication Date
GB1531327A true GB1531327A (en) 1978-11-08

Family

ID=5940691

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8825/76A Expired GB1531327A (en) 1975-03-07 1976-03-05 Thin film circuit assemblies

Country Status (6)

Country Link
US (1) US4075416A (US07922777-20110412-C00004.png)
JP (1) JPS51110668A (US07922777-20110412-C00004.png)
DE (1) DE2509912C3 (US07922777-20110412-C00004.png)
FR (1) FR2303386A2 (US07922777-20110412-C00004.png)
GB (1) GB1531327A (US07922777-20110412-C00004.png)
IT (1) IT1056918B (US07922777-20110412-C00004.png)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2906813C2 (de) * 1979-02-22 1982-06-03 Robert Bosch Gmbh, 7000 Stuttgart Elektronische Dünnschichtschaltung
DE3029277C2 (de) * 1980-08-01 1983-10-20 Siemens AG, 1000 Berlin und 8000 München Aufbau von Metallschichten
JPS57138168A (en) * 1981-01-15 1982-08-26 Bosch Gmbh Robert Electron thin film circuit
DE3136198A1 (de) * 1981-01-15 1982-08-05 Robert Bosch Gmbh, 7000 Stuttgart "elektronische duennschichtschaltung"
DE3139670A1 (de) * 1981-10-06 1983-04-21 Robert Bosch Gmbh, 7000 Stuttgart Elektronische duennschichtschaltung und deren herstellungsverfahren
FR2532472B1 (fr) * 1982-08-31 1985-12-20 Lignes Telegraph Telephon Procede de fabrication de connexions electriques pour circuit hybride et circuit hybride comportant de telles connexions
GB2137421A (en) * 1983-03-15 1984-10-03 Standard Telephones Cables Ltd Printed circuits
JPS61236192A (ja) * 1985-04-12 1986-10-21 株式会社日立製作所 セラミツク基板の電極形成方法
DE3536821A1 (de) * 1985-10-16 1987-04-16 Standard Elektrik Lorenz Ag Verfahren zur herstellung einer stromlos abgeschiedenen, loetbaren metallschicht
US4946563A (en) * 1988-12-12 1990-08-07 General Electric Company Process for manufacturing a selective plated board for surface mount components
US4940181A (en) * 1989-04-06 1990-07-10 Motorola, Inc. Pad grid array for receiving a solder bumped chip carrier
US5235139A (en) * 1990-09-12 1993-08-10 Macdermid, Incorprated Method for fabricating printed circuits
JPH07235772A (ja) 1994-02-25 1995-09-05 Fujitsu Ltd 薄膜多層回路基板およびその製造方法
JP4127433B2 (ja) * 1998-09-17 2008-07-30 イビデン株式会社 多層ビルドアップ配線板及び多層ビルドアップ配線板の製造方法
KR20080024239A (ko) * 1998-09-17 2008-03-17 이비덴 가부시키가이샤 다층빌드업배선판
JP2003023239A (ja) * 2001-07-05 2003-01-24 Sumitomo Electric Ind Ltd 回路基板とその製造方法及び高出力モジュール
US6768063B2 (en) * 2001-08-31 2004-07-27 International Business Machines Corporation Structure and method for shadow mask electrode
US9558859B2 (en) * 2014-02-18 2017-01-31 Rsm Electron Power, Inc. Multilayer substrate and method for manufacturing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT310285B (de) * 1966-02-22 1973-09-25 Photocircuits Corp Verfahren zur Herstellung eines Schichtkörpers für gedruckte Schaltungen
US3423260A (en) * 1966-03-21 1969-01-21 Bunker Ramo Method of making a thin film circuit having a resistor-conductor pattern
US3621442A (en) * 1968-11-07 1971-11-16 Allen Bradley Co Terminal connection of electronic devices
US3576722A (en) * 1969-03-26 1971-04-27 Bendix Corp Method for metalizing ceramics
GB1248142A (en) * 1969-06-20 1971-09-29 Decca Ltd Improvements in or relating to electrical circuits assemblies
US3778530A (en) * 1971-04-01 1973-12-11 W Reimann Flatpack lead positioning device
US3809797A (en) * 1971-11-16 1974-05-07 Du Pont Seal ring compositions and electronic packages made therewith
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof

Also Published As

Publication number Publication date
DE2509912C3 (de) 1979-11-29
DE2509912A1 (de) 1976-09-16
FR2303386B2 (US07922777-20110412-C00004.png) 1979-08-24
JPS51110668A (US07922777-20110412-C00004.png) 1976-09-30
FR2303386A2 (fr) 1976-10-01
US4075416A (en) 1978-02-21
DE2509912B2 (de) 1979-03-29
IT1056918B (it) 1982-02-20

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee