GB1523225A - Methods of manufacturing carrier supports for integrated circuit chips - Google Patents

Methods of manufacturing carrier supports for integrated circuit chips

Info

Publication number
GB1523225A
GB1523225A GB17133/76A GB1713376A GB1523225A GB 1523225 A GB1523225 A GB 1523225A GB 17133/76 A GB17133/76 A GB 17133/76A GB 1713376 A GB1713376 A GB 1713376A GB 1523225 A GB1523225 A GB 1523225A
Authority
GB
United Kingdom
Prior art keywords
strips
copper
chip
resin
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB17133/76A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CII HONEYWELL BULL
Original Assignee
CII HONEYWELL BULL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CII HONEYWELL BULL filed Critical CII HONEYWELL BULL
Publication of GB1523225A publication Critical patent/GB1523225A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Wire Bonding (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Credit Cards Or The Like (AREA)
GB17133/76A 1975-05-13 1976-04-27 Methods of manufacturing carrier supports for integrated circuit chips Expired GB1523225A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7514872A FR2311406A1 (fr) 1975-05-13 1975-05-13 Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres

Publications (1)

Publication Number Publication Date
GB1523225A true GB1523225A (en) 1978-08-31

Family

ID=9155164

Family Applications (1)

Application Number Title Priority Date Filing Date
GB17133/76A Expired GB1523225A (en) 1975-05-13 1976-04-27 Methods of manufacturing carrier supports for integrated circuit chips

Country Status (6)

Country Link
US (1) US4038744A (https=)
JP (1) JPS51139777A (https=)
DE (1) DE2620998A1 (https=)
FR (1) FR2311406A1 (https=)
GB (1) GB1523225A (https=)
SE (1) SE406248B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
CH623452B (fr) * 1977-12-14 Fontainemelon Horlogerie Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede.
US4209355A (en) * 1978-07-26 1980-06-24 National Semiconductor Corporation Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices
US4399610A (en) * 1981-04-01 1983-08-23 Western Electric Company, Inc. Assembling an electronic device
EP0102525B1 (en) * 1982-08-23 1988-07-06 BURROUGHS CORPORATION (a Delaware corporation) Alpha-particle protection in integrated circuit packages
US4531285A (en) * 1983-03-21 1985-07-30 The United States Of America As Represented By The Secretary Of The Navy Method for interconnecting close lead center integrated circuit packages to boards
DE3534502A1 (de) * 1985-09-27 1987-04-09 Licentia Gmbh Verfahren zum herstellen einer klebekontaktierung
JPS6413600U (https=) * 1987-07-17 1989-01-24
JPH0266480A (ja) * 1988-08-31 1990-03-06 Murata Mfg Co Ltd センサ素子の組立て実装方法
AU7954491A (en) * 1990-05-14 1991-12-10 Richard Lee Schendelman Interdigitated trans-die lead construction and method of construction for maximizing population density of chip-on-board construction
US5152056A (en) * 1991-08-27 1992-10-06 Sun Microsystems, Inc. Method for replacing tape automated bonding components on a printed circuit board
US5686352A (en) * 1993-07-26 1997-11-11 Motorola Inc. Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE787379A (fr) * 1971-08-10 1973-02-09 Merck & Co Inc Enzymes pour l'hygiene de la bouche et procede de preparation de ces enzymes
US3868724A (en) * 1973-11-21 1975-02-25 Fairchild Camera Instr Co Multi-layer connecting structures for packaging semiconductor devices mounted on a flexible carrier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138210A (en) * 1982-02-05 1984-10-17 Hitachi Ltd A multiple frame
US4691225A (en) * 1982-02-05 1987-09-01 Hitachi, Ltd. Semiconductor device and a method of producing the same

Also Published As

Publication number Publication date
DE2620998A1 (de) 1976-11-25
FR2311406A1 (fr) 1976-12-10
SE7605080L (sv) 1976-11-14
FR2311406B1 (https=) 1977-12-02
JPS51139777A (en) 1976-12-02
JPS5750072B2 (https=) 1982-10-25
US4038744A (en) 1977-08-02
SE406248B (sv) 1979-01-29

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee