GB1509946A - Method of electroless metal-plating - Google Patents

Method of electroless metal-plating

Info

Publication number
GB1509946A
GB1509946A GB37339/75A GB3733975A GB1509946A GB 1509946 A GB1509946 A GB 1509946A GB 37339/75 A GB37339/75 A GB 37339/75A GB 3733975 A GB3733975 A GB 3733975A GB 1509946 A GB1509946 A GB 1509946A
Authority
GB
United Kingdom
Prior art keywords
solution
polyimide
sept
wavelength
applying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37339/75A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Corp
Original Assignee
AMP Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AMP Inc filed Critical AMP Inc
Publication of GB1509946A publication Critical patent/GB1509946A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB37339/75A 1974-09-23 1975-09-11 Method of electroless metal-plating Expired GB1509946A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US508601A US3928670A (en) 1974-09-23 1974-09-23 Selective plating on non-metallic surfaces

Publications (1)

Publication Number Publication Date
GB1509946A true GB1509946A (en) 1978-05-10

Family

ID=24023375

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37339/75A Expired GB1509946A (en) 1974-09-23 1975-09-11 Method of electroless metal-plating

Country Status (9)

Country Link
US (1) US3928670A (enExample)
JP (1) JPS5157643A (enExample)
CA (1) CA1059363A (enExample)
DE (1) DE2541868A1 (enExample)
ES (1) ES441164A1 (enExample)
FR (1) FR2285470A1 (enExample)
GB (1) GB1509946A (enExample)
IT (1) IT1042746B (enExample)
NL (1) NL7511181A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2123854A (en) * 1981-12-11 1984-02-08 Schering Ag Process for strongly-bonded metallisation of polyimides
GB2206128A (en) * 1987-06-23 1988-12-29 Glaverbel Copper mirrors and method of manufacturing same
WO2009009070A1 (en) * 2007-07-09 2009-01-15 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
US8449949B2 (en) 2007-07-09 2013-05-28 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2742899C3 (de) * 1977-09-23 1980-06-12 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur optischen Übertragung von Nachrichten
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
DE3048665A1 (de) * 1980-12-23 1982-07-22 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt "verfahren zur selektiven metallabscheidung sowie damit herstellbare metallhaltige struktur"
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
US4738869A (en) * 1986-11-24 1988-04-19 Pacific Bell Photoselective electroless plating method employing UV-absorbing substrates
JP2559717B2 (ja) * 1986-11-28 1996-12-04 呉羽化学工業株式会社 選択的化学メツキ法
US4770897A (en) * 1987-05-05 1988-09-13 Digital Equipment Corporation Multilayer interconnection system for multichip high performance semiconductor packaging
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
JPH0379100A (ja) * 1989-08-22 1991-04-04 Matsushita Electric Ind Co Ltd 光透過ペーストおよびそれを用いた金属銅析出方法
US6692895B2 (en) * 2001-05-25 2004-02-17 3M Innovative Properties Company Imageable article and method of imaging
US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US20090017309A1 (en) * 2007-07-09 2009-01-15 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
KR100904251B1 (ko) * 2008-01-28 2009-06-25 한국생산기술연구원 폴리머 표면에 귀금속촉매의 선택적 흡착방법
US20100181284A1 (en) * 2009-01-19 2010-07-22 E. I. Du Pont De Nemours And Company Method of obtaining electronic circuitry features

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562005A (en) * 1968-04-09 1971-02-09 Western Electric Co Method of generating precious metal-reducing patterns
US3779758A (en) * 1969-03-25 1973-12-18 Photocircuits Corp Photosensitive process for producing printed circuits employing electroless deposition

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2123854A (en) * 1981-12-11 1984-02-08 Schering Ag Process for strongly-bonded metallisation of polyimides
US5050978A (en) * 1987-06-22 1991-09-24 Glaverbel Copper mirrors and method of manufacturing same
GB2206128A (en) * 1987-06-23 1988-12-29 Glaverbel Copper mirrors and method of manufacturing same
US4981720A (en) * 1987-06-23 1991-01-01 Glaverbel Method of manufacturing copper mirrors
GB2206128B (en) * 1987-06-23 1991-11-20 Glaverbel Copper mirrors and method of manufacturing same
WO2009009070A1 (en) * 2007-07-09 2009-01-15 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
US8449949B2 (en) 2007-07-09 2013-05-28 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
US8475924B2 (en) 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry

Also Published As

Publication number Publication date
US3928670A (en) 1975-12-23
DE2541868A1 (de) 1976-04-01
IT1042746B (it) 1980-01-30
FR2285470B1 (enExample) 1978-10-13
NL7511181A (nl) 1976-03-25
FR2285470A1 (fr) 1976-04-16
ES441164A1 (es) 1977-03-16
JPS5157643A (enExample) 1976-05-20
CA1059363A (en) 1979-07-31

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee