IT1042746B - Method di placcatura metallica per riduzione - Google Patents

Method di placcatura metallica per riduzione

Info

Publication number
IT1042746B
IT1042746B IT27554/75A IT2755475A IT1042746B IT 1042746 B IT1042746 B IT 1042746B IT 27554/75 A IT27554/75 A IT 27554/75A IT 2755475 A IT2755475 A IT 2755475A IT 1042746 B IT1042746 B IT 1042746B
Authority
IT
Italy
Prior art keywords
reduction
plating method
metallic plating
metallic
plating
Prior art date
Application number
IT27554/75A
Other languages
English (en)
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Inc filed Critical Amp Inc
Application granted granted Critical
Publication of IT1042746B publication Critical patent/IT1042746B/it

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
    • G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
    • G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
IT27554/75A 1974-09-23 1975-09-23 Method di placcatura metallica per riduzione IT1042746B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US508601A US3928670A (en) 1974-09-23 1974-09-23 Selective plating on non-metallic surfaces

Publications (1)

Publication Number Publication Date
IT1042746B true IT1042746B (it) 1980-01-30

Family

ID=24023375

Family Applications (1)

Application Number Title Priority Date Filing Date
IT27554/75A IT1042746B (it) 1974-09-23 1975-09-23 Method di placcatura metallica per riduzione

Country Status (9)

Country Link
US (1) US3928670A (it)
JP (1) JPS5157643A (it)
CA (1) CA1059363A (it)
DE (1) DE2541868A1 (it)
ES (1) ES441164A1 (it)
FR (1) FR2285470A1 (it)
GB (1) GB1509946A (it)
IT (1) IT1042746B (it)
NL (1) NL7511181A (it)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2742899C3 (de) * 1977-09-23 1980-06-12 Siemens Ag, 1000 Berlin Und 8000 Muenchen Anordnung zur optischen Übertragung von Nachrichten
DE2847298A1 (de) * 1978-10-27 1980-05-08 Schering Ag Verfahren zur herstellung von metallmustern auf einem isolierenden traegerstoff
US4229218A (en) * 1979-02-05 1980-10-21 Shipley Company Inc. Self-monitoring electroless plating solution
DE3048665A1 (de) * 1980-12-23 1982-07-22 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt "verfahren zur selektiven metallabscheidung sowie damit herstellbare metallhaltige struktur"
DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
US5182135A (en) * 1986-08-12 1993-01-26 Bayer Aktiengesellschaft Process for improving the adherency of metallic coatings deposited without current on plastic surfaces
US4738869A (en) * 1986-11-24 1988-04-19 Pacific Bell Photoselective electroless plating method employing UV-absorbing substrates
JP2559717B2 (ja) * 1986-11-28 1996-12-04 呉羽化学工業株式会社 選択的化学メツキ法
US4770897A (en) * 1987-05-05 1988-09-13 Digital Equipment Corporation Multilayer interconnection system for multichip high performance semiconductor packaging
GB2206128B (en) * 1987-06-23 1991-11-20 Glaverbel Copper mirrors and method of manufacturing same
US4818286A (en) * 1988-03-08 1989-04-04 International Business Machines Corporation Electroless copper plating bath
JPH0379100A (ja) * 1989-08-22 1991-04-04 Matsushita Electric Ind Co Ltd 光透過ペーストおよびそれを用いた金属銅析出方法
US6692895B2 (en) * 2001-05-25 2004-02-17 3M Innovative Properties Company Imageable article and method of imaging
US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US8475924B2 (en) 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
US20090017309A1 (en) * 2007-07-09 2009-01-15 E. I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
JP5292398B2 (ja) * 2007-07-09 2013-09-18 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 電子回路構造を製造するための組成物および方法
KR100904251B1 (ko) * 2008-01-28 2009-06-25 한국생산기술연구원 폴리머 표면에 귀금속촉매의 선택적 흡착방법
US20100181284A1 (en) * 2009-01-19 2010-07-22 E. I. Du Pont De Nemours And Company Method of obtaining electronic circuitry features

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562005A (en) * 1968-04-09 1971-02-09 Western Electric Co Method of generating precious metal-reducing patterns
US3779758A (en) * 1969-03-25 1973-12-18 Photocircuits Corp Photosensitive process for producing printed circuits employing electroless deposition

Also Published As

Publication number Publication date
US3928670A (en) 1975-12-23
NL7511181A (nl) 1976-03-25
FR2285470A1 (fr) 1976-04-16
FR2285470B1 (it) 1978-10-13
JPS5157643A (it) 1976-05-20
ES441164A1 (es) 1977-03-16
CA1059363A (en) 1979-07-31
DE2541868A1 (de) 1976-04-01
GB1509946A (en) 1978-05-10

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