GB1503136A - Semiconductor device assembly - Google Patents
Semiconductor device assemblyInfo
- Publication number
- GB1503136A GB1503136A GB3189076A GB3189076A GB1503136A GB 1503136 A GB1503136 A GB 1503136A GB 3189076 A GB3189076 A GB 3189076A GB 3189076 A GB3189076 A GB 3189076A GB 1503136 A GB1503136 A GB 1503136A
- Authority
- GB
- United Kingdom
- Prior art keywords
- glass
- support
- window
- weight
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 239000011521 glass Substances 0.000 abstract 4
- 239000000919 ceramic Substances 0.000 abstract 2
- 229910004298 SiO 2 Inorganic materials 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 238000010521 absorption reaction Methods 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 abstract 1
- 238000005816 glass manufacturing process Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910000833 kovar Inorganic materials 0.000 abstract 1
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229920000647 polyepoxide Polymers 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 abstract 1
- 239000000565 sealant Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000005361 soda-lime glass Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/078—Glass compositions containing silica with 40% to 90% silica, by weight containing an oxide of a divalent metal, e.g. an oxide of zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
- C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
- C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/18—Circuits for erasing optically
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Glass Compositions (AREA)
- Non-Volatile Memory (AREA)
- Read Only Memory (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60168275A | 1975-08-01 | 1975-08-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1503136A true GB1503136A (en) | 1978-03-08 |
Family
ID=24408384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB3189076A Expired GB1503136A (en) | 1975-08-01 | 1976-07-30 | Semiconductor device assembly |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPS5219077A (nl) |
DE (1) | DE2633086B2 (nl) |
GB (1) | GB1503136A (nl) |
NL (1) | NL7608475A (nl) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2174538A (en) * | 1985-04-24 | 1986-11-05 | Stanley Bracey | Semiconductor package |
EP1391934A2 (de) * | 2002-08-23 | 2004-02-25 | Z/I Imaging GmbH | Sensormodul |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52150971A (en) * | 1976-06-11 | 1977-12-15 | Hitachi Ltd | Semiconductor device for memory |
DE2936615C2 (de) * | 1979-09-11 | 1985-03-28 | Brown, Boveri & Cie Ag, 6800 Mannheim | Schutzvorrichtung |
JPS5732656A (en) * | 1980-08-05 | 1982-02-22 | Fujitsu Ltd | Semiconductor device |
DE3041596C2 (de) * | 1980-09-22 | 1983-12-15 | Remo Dipl.-El.-Ing. Balzers Vogelsang | Steckeinheit mit Steckkarte und Vielfachstecker |
JPS58129642U (ja) * | 1982-02-26 | 1983-09-02 | 鳴海製陶株式会社 | 窓付セラミックパッケ−ジ |
JPS58159697U (ja) * | 1982-04-15 | 1983-10-24 | 富士通株式会社 | Epromパツケ−ジ |
JPS59501605A (ja) * | 1982-09-09 | 1984-09-06 | プレツシ− オ−バ−シ−ズ リミテツド | 光装置 |
FR2566962B1 (fr) * | 1984-06-29 | 1987-03-06 | Thomson Csf | Circuit integre photosensible comportant une plaque transparente collee sur sa zone photosensible |
JPS61172352A (ja) * | 1985-01-26 | 1986-08-04 | Kyocera Corp | 半導体パツケ−ジ |
AU7219898A (en) * | 1997-04-29 | 1998-11-24 | Pilkingon Plc | Glass compositions used in plasma displays |
-
1976
- 1976-07-22 DE DE19762633086 patent/DE2633086B2/de not_active Withdrawn
- 1976-07-30 NL NL7608475A patent/NL7608475A/nl not_active Application Discontinuation
- 1976-07-30 GB GB3189076A patent/GB1503136A/en not_active Expired
- 1976-07-31 JP JP9087676A patent/JPS5219077A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2174538A (en) * | 1985-04-24 | 1986-11-05 | Stanley Bracey | Semiconductor package |
EP1391934A2 (de) * | 2002-08-23 | 2004-02-25 | Z/I Imaging GmbH | Sensormodul |
EP1391934A3 (de) * | 2002-08-23 | 2006-06-07 | Z/I Imaging Ltd. | Sensormodul |
Also Published As
Publication number | Publication date |
---|---|
DE2633086A1 (de) | 1977-02-10 |
DE2633086B2 (de) | 1977-12-15 |
NL7608475A (nl) | 1977-02-03 |
JPS5219077A (en) | 1977-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |