JPS5219077A - Lead frame assembly - Google Patents

Lead frame assembly

Info

Publication number
JPS5219077A
JPS5219077A JP9087676A JP9087676A JPS5219077A JP S5219077 A JPS5219077 A JP S5219077A JP 9087676 A JP9087676 A JP 9087676A JP 9087676 A JP9087676 A JP 9087676A JP S5219077 A JPS5219077 A JP S5219077A
Authority
JP
Japan
Prior art keywords
lead frame
frame assembly
assembly
lead
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9087676A
Other languages
Japanese (ja)
Inventor
Furederitsuku Ratsu Chiyaaruzu
Roorensu Howaito Pooru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OI Glass Inc
Original Assignee
Owens Illinois Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Owens Illinois Inc filed Critical Owens Illinois Inc
Publication of JPS5219077A publication Critical patent/JPS5219077A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/078—Glass compositions containing silica with 40% to 90% silica, by weight containing an oxide of a divalent metal, e.g. an oxide of zinc
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/083—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound
    • C03C3/085—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal
    • C03C3/087—Glass compositions containing silica with 40% to 90% silica, by weight containing aluminium oxide or an iron compound containing an oxide of a divalent metal containing calcium oxide, e.g. common sheet or container glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00—Compositions for glass with special properties
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G11C16/18—Circuits for erasing optically
JP9087676A 1975-08-01 1976-07-31 Lead frame assembly Pending JPS5219077A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US60168275A 1975-08-01 1975-08-01

Publications (1)

Publication Number Publication Date
JPS5219077A true JPS5219077A (en) 1977-01-14

Family

ID=24408384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9087676A Pending JPS5219077A (en) 1975-08-01 1976-07-31 Lead frame assembly

Country Status (4)

Country Link
JP (1) JPS5219077A (en)
DE (1) DE2633086B2 (en)
GB (1) GB1503136A (en)
NL (1) NL7608475A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52150971A (en) * 1976-06-11 1977-12-15 Hitachi Ltd Semiconductor device for memory
JPS5732656A (en) * 1980-08-05 1982-02-22 Fujitsu Ltd Semiconductor device
JPS58129642U (en) * 1982-02-26 1983-09-02 鳴海製陶株式会社 Ceramic package with window
JPS58159697U (en) * 1982-04-15 1983-10-24 富士通株式会社 EPROM package
JPS61172352A (en) * 1985-01-26 1986-08-04 Kyocera Corp Semiconductor package

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2936615C2 (en) * 1979-09-11 1985-03-28 Brown, Boveri & Cie Ag, 6800 Mannheim Protective device
DE3041596C2 (en) * 1980-09-22 1983-12-15 Remo Dipl.-El.-Ing. Balzers Vogelsang Plug-in unit with plug-in card and multiple plug
WO1984001057A1 (en) * 1982-09-09 1984-03-15 Plessey Overseas Optical device
FR2566962B1 (en) * 1984-06-29 1987-03-06 Thomson Csf INTEGRATED PHOTOSENSITIVE CIRCUIT COMPRISING A TRANSPARENT PLATE PASTED ON ITS PHOTOSENSITIVE AREA
GB2174538A (en) * 1985-04-24 1986-11-05 Stanley Bracey Semiconductor package
WO1998049111A1 (en) * 1997-04-29 1998-11-05 Pilkington Plc Glass compositions used in plasma displays
DE10239524A1 (en) * 2002-08-23 2004-03-04 Z/I Imaging Gmbh sensor module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52150971A (en) * 1976-06-11 1977-12-15 Hitachi Ltd Semiconductor device for memory
JPS5741102B2 (en) * 1976-06-11 1982-09-01
JPS5732656A (en) * 1980-08-05 1982-02-22 Fujitsu Ltd Semiconductor device
JPS58129642U (en) * 1982-02-26 1983-09-02 鳴海製陶株式会社 Ceramic package with window
JPS638135Y2 (en) * 1982-02-26 1988-03-10
JPS58159697U (en) * 1982-04-15 1983-10-24 富士通株式会社 EPROM package
JPS6241440Y2 (en) * 1982-04-15 1987-10-23
JPS61172352A (en) * 1985-01-26 1986-08-04 Kyocera Corp Semiconductor package

Also Published As

Publication number Publication date
DE2633086A1 (en) 1977-02-10
DE2633086B2 (en) 1977-12-15
NL7608475A (en) 1977-02-03
GB1503136A (en) 1978-03-08

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