FR2566962B1 - Circuit integre photosensible comportant une plaque transparente collee sur sa zone photosensible - Google Patents
Circuit integre photosensible comportant une plaque transparente collee sur sa zone photosensibleInfo
- Publication number
- FR2566962B1 FR2566962B1 FR8410347A FR8410347A FR2566962B1 FR 2566962 B1 FR2566962 B1 FR 2566962B1 FR 8410347 A FR8410347 A FR 8410347A FR 8410347 A FR8410347 A FR 8410347A FR 2566962 B1 FR2566962 B1 FR 2566962B1
- Authority
- FR
- France
- Prior art keywords
- photosensitive
- transparent plate
- integrated
- circuit
- plate pasted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8410347A FR2566962B1 (fr) | 1984-06-29 | 1984-06-29 | Circuit integre photosensible comportant une plaque transparente collee sur sa zone photosensible |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8410347A FR2566962B1 (fr) | 1984-06-29 | 1984-06-29 | Circuit integre photosensible comportant une plaque transparente collee sur sa zone photosensible |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2566962A1 FR2566962A1 (fr) | 1986-01-03 |
FR2566962B1 true FR2566962B1 (fr) | 1987-03-06 |
Family
ID=9305620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8410347A Expired FR2566962B1 (fr) | 1984-06-29 | 1984-06-29 | Circuit integre photosensible comportant une plaque transparente collee sur sa zone photosensible |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2566962B1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2819103B1 (fr) * | 2000-12-29 | 2003-12-12 | St Microelectronics Sa | Boitier semi-conducteur optique a pastille transparente et son procede de fabrication |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5328751B2 (fr) * | 1974-11-27 | 1978-08-16 | ||
DE2633086B2 (de) * | 1975-08-01 | 1977-12-15 | Elektronisches programmierbares speicher-chip | |
JPS55159678A (en) * | 1979-05-31 | 1980-12-11 | Toshiba Corp | Solidstate image sensor |
GB2077995B (en) * | 1980-06-05 | 1984-03-14 | Bfg Glassgroup | Panels incorporating photo-cells and method of manufacturing same |
-
1984
- 1984-06-29 FR FR8410347A patent/FR2566962B1/fr not_active Expired
Also Published As
Publication number | Publication date |
---|---|
FR2566962A1 (fr) | 1986-01-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |