GB1485331A - Multitarget sequential sputtering apparatus - Google Patents
Multitarget sequential sputtering apparatusInfo
- Publication number
- GB1485331A GB1485331A GB15575/75A GB1557575A GB1485331A GB 1485331 A GB1485331 A GB 1485331A GB 15575/75 A GB15575/75 A GB 15575/75A GB 1557575 A GB1557575 A GB 1557575A GB 1485331 A GB1485331 A GB 1485331A
- Authority
- GB
- United Kingdom
- Prior art keywords
- anode
- cathode
- apertures
- targets
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000004544 sputter deposition Methods 0.000 title abstract 3
- 210000002381 plasma Anatomy 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000005284 excitation Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000013077 target material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US462705A US3864239A (en) | 1974-04-22 | 1974-04-22 | Multitarget sequential sputtering apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1485331A true GB1485331A (en) | 1977-09-08 |
Family
ID=23837464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB15575/75A Expired GB1485331A (en) | 1974-04-22 | 1975-04-16 | Multitarget sequential sputtering apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US3864239A (de) |
JP (1) | JPS5830389B2 (de) |
CA (1) | CA1045582A (de) |
DE (1) | DE2517554A1 (de) |
FR (1) | FR2268089B1 (de) |
GB (1) | GB1485331A (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2208657A (en) * | 1987-08-10 | 1989-04-12 | Ion Tech Ltd | Thin film alloying |
GB2228948A (en) * | 1989-02-28 | 1990-09-12 | British Aerospace | Fabrication of thin films from a composite target |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3904503A (en) * | 1974-05-31 | 1975-09-09 | Western Electric Co | Depositing material on a substrate using a shield |
US3932232A (en) * | 1974-11-29 | 1976-01-13 | Bell Telephone Laboratories, Incorporated | Suppression of X-ray radiation during sputter-etching |
US4060471A (en) * | 1975-05-19 | 1977-11-29 | Rca Corporation | Composite sputtering method |
US4051010A (en) * | 1975-12-18 | 1977-09-27 | Western Electric Company, Inc. | Sputtering apparatus |
US4239611A (en) * | 1979-06-11 | 1980-12-16 | Vac-Tec Systems, Inc. | Magnetron sputtering devices |
US4333814A (en) * | 1979-12-26 | 1982-06-08 | Western Electric Company, Inc. | Methods and apparatus for improving an RF excited reactive gas plasma |
US4362611A (en) * | 1981-07-27 | 1982-12-07 | International Business Machines Corporation | Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield |
US4448149A (en) * | 1982-10-12 | 1984-05-15 | International Business Machines Corporation | Apparatus for removably mounting and supplying mechanical and electrical energy to a vacuum chamber substrate holder |
DE3404880A1 (de) * | 1984-02-11 | 1985-08-14 | Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden | Verfahren zum herstellen von schichtwerkstoff oder schichtwerkstuecken |
US4885074A (en) * | 1987-02-24 | 1989-12-05 | International Business Machines Corporation | Plasma reactor having segmented electrodes |
JPH01127674A (ja) * | 1987-11-11 | 1989-05-19 | Matsushita Electric Ind Co Ltd | マグネトロンスパッタ装置 |
US5391275A (en) * | 1990-03-02 | 1995-02-21 | Applied Materials, Inc. | Method for preparing a shield to reduce particles in a physical vapor deposition chamber |
US5202008A (en) * | 1990-03-02 | 1993-04-13 | Applied Materials, Inc. | Method for preparing a shield to reduce particles in a physical vapor deposition chamber |
NL9002176A (nl) * | 1990-10-08 | 1992-05-06 | Philips Nv | Werkwijze voor het verminderen van deeltjescontaminatie tijdens sputteren en een sputterinrichting voor gebruik van een dergelijke werkwijze. |
US5223108A (en) * | 1991-12-30 | 1993-06-29 | Materials Research Corporation | Extended lifetime collimator |
EP0837491A3 (de) * | 1996-10-21 | 2000-11-15 | Nihon Shinku Gijutsu Kabushiki Kaisha | Vorrichtung zusammengesetzter Zerstäubungskathode und Zerstäubungsgerät mit solcher zusammengesetzten Kathode |
JP4137277B2 (ja) * | 1999-04-15 | 2008-08-20 | 株式会社アルバック | スパッタリング装置 |
US6328856B1 (en) | 1999-08-04 | 2001-12-11 | Seagate Technology Llc | Method and apparatus for multilayer film deposition utilizing rotating multiple magnetron cathode device |
US6451176B1 (en) * | 2000-11-03 | 2002-09-17 | The Regents Of The University Of California | Electrostatic particle trap for ion beam sputter deposition |
SE521095C2 (sv) * | 2001-06-08 | 2003-09-30 | Cardinal Cg Co | Förfarande för reaktiv sputtring |
US6635154B2 (en) * | 2001-11-03 | 2003-10-21 | Intevac, Inc. | Method and apparatus for multi-target sputtering |
US20040086639A1 (en) * | 2002-09-24 | 2004-05-06 | Grantham Daniel Harrison | Patterned thin-film deposition using collimating heated mask asembly |
JP4494047B2 (ja) * | 2004-03-12 | 2010-06-30 | キヤノンアネルバ株式会社 | 多元スパッタ成膜装置の二重シャッタ制御方法 |
KR20050093230A (ko) * | 2004-03-18 | 2005-09-23 | 엘지.필립스 엘시디 주식회사 | 스퍼터링 장비 |
US7794574B2 (en) * | 2005-04-14 | 2010-09-14 | Tango Systems, Inc. | Top shield for sputtering system |
US7479210B2 (en) * | 2005-04-14 | 2009-01-20 | Tango Systems, Inc. | Temperature control of pallet in sputtering system |
CA2626073A1 (en) * | 2005-11-01 | 2007-05-10 | Cardinal Cg Company | Reactive sputter deposition processes and equipment |
JP4142706B2 (ja) * | 2006-09-28 | 2008-09-03 | 富士フイルム株式会社 | 成膜装置、成膜方法、絶縁膜、誘電体膜、圧電膜、強誘電体膜、圧電素子および液体吐出装置 |
JP4993294B2 (ja) * | 2007-09-05 | 2012-08-08 | 富士フイルム株式会社 | ペロブスカイト型酸化物、強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置 |
JP5047087B2 (ja) * | 2008-07-31 | 2012-10-10 | 富士フイルム株式会社 | 成膜装置、成膜方法、圧電膜、および、液体吐出装置 |
JP5415979B2 (ja) * | 2009-02-16 | 2014-02-12 | キヤノンアネルバ株式会社 | スパッタリング装置及び二重回転シャッタユニット並びにスパッタリング方法 |
CN105420679B (zh) * | 2015-11-16 | 2018-04-03 | 江苏中腾石英材料科技有限公司 | 一种孪生对靶磁控溅射制备覆铜陶瓷基板的装置及方法 |
US10431440B2 (en) * | 2015-12-20 | 2019-10-01 | Applied Materials, Inc. | Methods and apparatus for processing a substrate |
US11361950B2 (en) | 2020-04-15 | 2022-06-14 | Applied Materials, Inc. | Multi-cathode processing chamber with dual rotatable shields |
US20240194455A1 (en) * | 2022-12-12 | 2024-06-13 | Intevac, Inc. | Method and apparatus for uniform high throughput multiple layer films |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3528906A (en) * | 1967-06-05 | 1970-09-15 | Texas Instruments Inc | Rf sputtering method and system |
US3803019A (en) * | 1971-10-07 | 1974-04-09 | Hewlett Packard Co | Sputtering system |
US3796649A (en) * | 1971-12-13 | 1974-03-12 | Varian Associates | Coaxial sputtering apparatus |
-
1974
- 1974-04-22 US US462705A patent/US3864239A/en not_active Expired - Lifetime
-
1975
- 1975-04-16 GB GB15575/75A patent/GB1485331A/en not_active Expired
- 1975-04-21 DE DE19752517554 patent/DE2517554A1/de not_active Ceased
- 1975-04-21 CA CA225,051A patent/CA1045582A/en not_active Expired
- 1975-04-22 JP JP50048271A patent/JPS5830389B2/ja not_active Expired
- 1975-04-22 FR FR7512460A patent/FR2268089B1/fr not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2208657A (en) * | 1987-08-10 | 1989-04-12 | Ion Tech Ltd | Thin film alloying |
GB2228948A (en) * | 1989-02-28 | 1990-09-12 | British Aerospace | Fabrication of thin films from a composite target |
Also Published As
Publication number | Publication date |
---|---|
DE2517554A1 (de) | 1975-10-30 |
JPS50148286A (de) | 1975-11-27 |
FR2268089A1 (de) | 1975-11-14 |
US3864239A (en) | 1975-02-04 |
FR2268089B1 (de) | 1978-06-23 |
JPS5830389B2 (ja) | 1983-06-29 |
CA1045582A (en) | 1979-01-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |