JPS50148286A - - Google Patents

Info

Publication number
JPS50148286A
JPS50148286A JP50048271A JP4827175A JPS50148286A JP S50148286 A JPS50148286 A JP S50148286A JP 50048271 A JP50048271 A JP 50048271A JP 4827175 A JP4827175 A JP 4827175A JP S50148286 A JPS50148286 A JP S50148286A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50048271A
Other languages
Japanese (ja)
Other versions
JPS5830389B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50148286A publication Critical patent/JPS50148286A/ja
Publication of JPS5830389B2 publication Critical patent/JPS5830389B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3464—Sputtering using more than one target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP50048271A 1974-04-22 1975-04-22 タダンタ−ゲツトシキスパツタリングソウチ Expired JPS5830389B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US462705A US3864239A (en) 1974-04-22 1974-04-22 Multitarget sequential sputtering apparatus

Publications (2)

Publication Number Publication Date
JPS50148286A true JPS50148286A (de) 1975-11-27
JPS5830389B2 JPS5830389B2 (ja) 1983-06-29

Family

ID=23837464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50048271A Expired JPS5830389B2 (ja) 1974-04-22 1975-04-22 タダンタ−ゲツトシキスパツタリングソウチ

Country Status (6)

Country Link
US (1) US3864239A (de)
JP (1) JPS5830389B2 (de)
CA (1) CA1045582A (de)
DE (1) DE2517554A1 (de)
FR (1) FR2268089B1 (de)
GB (1) GB1485331A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127674A (ja) * 1987-11-11 1989-05-19 Matsushita Electric Ind Co Ltd マグネトロンスパッタ装置

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904503A (en) * 1974-05-31 1975-09-09 Western Electric Co Depositing material on a substrate using a shield
US3932232A (en) * 1974-11-29 1976-01-13 Bell Telephone Laboratories, Incorporated Suppression of X-ray radiation during sputter-etching
US4060471A (en) * 1975-05-19 1977-11-29 Rca Corporation Composite sputtering method
US4051010A (en) * 1975-12-18 1977-09-27 Western Electric Company, Inc. Sputtering apparatus
US4239611A (en) * 1979-06-11 1980-12-16 Vac-Tec Systems, Inc. Magnetron sputtering devices
US4333814A (en) * 1979-12-26 1982-06-08 Western Electric Company, Inc. Methods and apparatus for improving an RF excited reactive gas plasma
US4362611A (en) * 1981-07-27 1982-12-07 International Business Machines Corporation Quadrupole R.F. sputtering system having an anode/cathode shield and a floating target shield
US4448149A (en) * 1982-10-12 1984-05-15 International Business Machines Corporation Apparatus for removably mounting and supplying mechanical and electrical energy to a vacuum chamber substrate holder
DE3404880A1 (de) * 1984-02-11 1985-08-14 Glyco-Metall-Werke Daelen & Loos Gmbh, 6200 Wiesbaden Verfahren zum herstellen von schichtwerkstoff oder schichtwerkstuecken
US4885074A (en) * 1987-02-24 1989-12-05 International Business Machines Corporation Plasma reactor having segmented electrodes
GB8718916D0 (en) * 1987-08-10 1987-09-16 Ion Tech Ltd Thin film alloying apparatus
GB2228948A (en) * 1989-02-28 1990-09-12 British Aerospace Fabrication of thin films from a composite target
US5391275A (en) * 1990-03-02 1995-02-21 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
US5202008A (en) * 1990-03-02 1993-04-13 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
NL9002176A (nl) * 1990-10-08 1992-05-06 Philips Nv Werkwijze voor het verminderen van deeltjescontaminatie tijdens sputteren en een sputterinrichting voor gebruik van een dergelijke werkwijze.
US5223108A (en) * 1991-12-30 1993-06-29 Materials Research Corporation Extended lifetime collimator
EP0837491A3 (de) * 1996-10-21 2000-11-15 Nihon Shinku Gijutsu Kabushiki Kaisha Vorrichtung zusammengesetzter Zerstäubungskathode und Zerstäubungsgerät mit solcher zusammengesetzten Kathode
JP4137277B2 (ja) * 1999-04-15 2008-08-20 株式会社アルバック スパッタリング装置
US6328856B1 (en) 1999-08-04 2001-12-11 Seagate Technology Llc Method and apparatus for multilayer film deposition utilizing rotating multiple magnetron cathode device
US6451176B1 (en) * 2000-11-03 2002-09-17 The Regents Of The University Of California Electrostatic particle trap for ion beam sputter deposition
SE521095C2 (sv) * 2001-06-08 2003-09-30 Cardinal Cg Co Förfarande för reaktiv sputtring
US6635154B2 (en) * 2001-11-03 2003-10-21 Intevac, Inc. Method and apparatus for multi-target sputtering
US20040086639A1 (en) * 2002-09-24 2004-05-06 Grantham Daniel Harrison Patterned thin-film deposition using collimating heated mask asembly
JP4494047B2 (ja) * 2004-03-12 2010-06-30 キヤノンアネルバ株式会社 多元スパッタ成膜装置の二重シャッタ制御方法
KR20050093230A (ko) * 2004-03-18 2005-09-23 엘지.필립스 엘시디 주식회사 스퍼터링 장비
US7794574B2 (en) * 2005-04-14 2010-09-14 Tango Systems, Inc. Top shield for sputtering system
US7479210B2 (en) * 2005-04-14 2009-01-20 Tango Systems, Inc. Temperature control of pallet in sputtering system
CA2626073A1 (en) * 2005-11-01 2007-05-10 Cardinal Cg Company Reactive sputter deposition processes and equipment
JP4142706B2 (ja) * 2006-09-28 2008-09-03 富士フイルム株式会社 成膜装置、成膜方法、絶縁膜、誘電体膜、圧電膜、強誘電体膜、圧電素子および液体吐出装置
JP4993294B2 (ja) * 2007-09-05 2012-08-08 富士フイルム株式会社 ペロブスカイト型酸化物、強誘電体膜とその製造方法、強誘電体素子、及び液体吐出装置
JP5047087B2 (ja) * 2008-07-31 2012-10-10 富士フイルム株式会社 成膜装置、成膜方法、圧電膜、および、液体吐出装置
JP5415979B2 (ja) * 2009-02-16 2014-02-12 キヤノンアネルバ株式会社 スパッタリング装置及び二重回転シャッタユニット並びにスパッタリング方法
CN105420679B (zh) * 2015-11-16 2018-04-03 江苏中腾石英材料科技有限公司 一种孪生对靶磁控溅射制备覆铜陶瓷基板的装置及方法
US10431440B2 (en) * 2015-12-20 2019-10-01 Applied Materials, Inc. Methods and apparatus for processing a substrate
US11361950B2 (en) 2020-04-15 2022-06-14 Applied Materials, Inc. Multi-cathode processing chamber with dual rotatable shields
US20240194455A1 (en) * 2022-12-12 2024-06-13 Intevac, Inc. Method and apparatus for uniform high throughput multiple layer films

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528906A (en) * 1967-06-05 1970-09-15 Texas Instruments Inc Rf sputtering method and system
US3803019A (en) * 1971-10-07 1974-04-09 Hewlett Packard Co Sputtering system
US3796649A (en) * 1971-12-13 1974-03-12 Varian Associates Coaxial sputtering apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01127674A (ja) * 1987-11-11 1989-05-19 Matsushita Electric Ind Co Ltd マグネトロンスパッタ装置

Also Published As

Publication number Publication date
DE2517554A1 (de) 1975-10-30
GB1485331A (en) 1977-09-08
FR2268089A1 (de) 1975-11-14
US3864239A (en) 1975-02-04
FR2268089B1 (de) 1978-06-23
JPS5830389B2 (ja) 1983-06-29
CA1045582A (en) 1979-01-02

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