GB1483746A - Processing of wafers - Google Patents
Processing of wafersInfo
- Publication number
- GB1483746A GB1483746A GB5470774A GB5470774A GB1483746A GB 1483746 A GB1483746 A GB 1483746A GB 5470774 A GB5470774 A GB 5470774A GB 5470774 A GB5470774 A GB 5470774A GB 1483746 A GB1483746 A GB 1483746A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wafers
- etching
- dec
- rods
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 title abstract 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 3
- 238000005530 etching Methods 0.000 abstract 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910017604 nitric acid Inorganic materials 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US42638773A | 1973-12-19 | 1973-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1483746A true GB1483746A (en) | 1977-08-24 |
Family
ID=23690593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB5470774A Expired GB1483746A (en) | 1973-12-19 | 1974-12-18 | Processing of wafers |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS5093775A (enrdf_load_html_response) |
| BE (1) | BE823525A (enrdf_load_html_response) |
| CA (1) | CA1027465A (enrdf_load_html_response) |
| DE (1) | DE2459892A1 (enrdf_load_html_response) |
| GB (1) | GB1483746A (enrdf_load_html_response) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2142283A (en) * | 1983-06-27 | 1985-01-16 | Psi Star Inc | Liquid etching |
| GB2313811A (en) * | 1996-06-05 | 1997-12-10 | Samsung Electronics Co Ltd | Wafer overflow etching bath having outlet holes in sidewalls |
| CN113793819A (zh) * | 2021-09-16 | 2021-12-14 | 长江存储科技有限责任公司 | 化学槽及其温度控制方法 |
| CN115241330A (zh) * | 2022-09-19 | 2022-10-25 | 英利能源发展(天津)有限公司 | 一种氢氟酸刻蚀太阳能电池用半导体硅片装置 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2326479A1 (fr) * | 1975-10-03 | 1977-04-29 | Radiotechnique Compelec | Procede de decapage de plaquettes semi-conductrices, notamment pour cellules solaires et appareillage de mise en oeuvre du procede |
| JPS5288967U (enrdf_load_html_response) * | 1975-12-26 | 1977-07-02 | ||
| JPS5721321Y2 (enrdf_load_html_response) * | 1975-12-26 | 1982-05-08 | ||
| JPS5619933Y2 (enrdf_load_html_response) * | 1978-01-10 | 1981-05-12 | ||
| JPS5617021A (en) * | 1979-07-20 | 1981-02-18 | Fujitsu Ltd | Surface treatment of substrate |
| JPS5729140U (enrdf_load_html_response) * | 1980-07-24 | 1982-02-16 | ||
| JPS6327784Y2 (enrdf_load_html_response) * | 1980-09-19 | 1988-07-27 | ||
| US5278104A (en) * | 1989-07-25 | 1994-01-11 | Kabushiki Kaisha Toshiba | Semiconductor wafer carrier having a dust cover |
| JPH0770505B2 (ja) * | 1989-07-25 | 1995-07-31 | 株式会社東芝 | 半導体装置支持キャリヤ |
| US5054519A (en) * | 1990-12-26 | 1991-10-08 | Imtec Products, Inc. | Recirculating chemical bath with inflow and self balancing outflow |
| JP5478604B2 (ja) * | 2008-03-31 | 2014-04-23 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | シリコンウェハの端部をエッチングするための方法 |
| CN102282647A (zh) * | 2008-11-19 | 2011-12-14 | Memc电子材料有限公司 | 剥除半导体晶片边缘的方法和系统 |
-
1974
- 1974-12-18 CA CA216,323A patent/CA1027465A/en not_active Expired
- 1974-12-18 GB GB5470774A patent/GB1483746A/en not_active Expired
- 1974-12-18 DE DE19742459892 patent/DE2459892A1/de not_active Withdrawn
- 1974-12-18 BE BE151653A patent/BE823525A/xx unknown
- 1974-12-18 JP JP14552574A patent/JPS5093775A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2142283A (en) * | 1983-06-27 | 1985-01-16 | Psi Star Inc | Liquid etching |
| GB2313811A (en) * | 1996-06-05 | 1997-12-10 | Samsung Electronics Co Ltd | Wafer overflow etching bath having outlet holes in sidewalls |
| GB2313811B (en) * | 1996-06-05 | 2000-09-20 | Samsung Electronics Co Ltd | A chemical bath |
| CN113793819A (zh) * | 2021-09-16 | 2021-12-14 | 长江存储科技有限责任公司 | 化学槽及其温度控制方法 |
| CN115241330A (zh) * | 2022-09-19 | 2022-10-25 | 英利能源发展(天津)有限公司 | 一种氢氟酸刻蚀太阳能电池用半导体硅片装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2459892A1 (de) | 1975-09-04 |
| BE823525A (fr) | 1975-06-18 |
| CA1027465A (en) | 1978-03-07 |
| JPS5093775A (enrdf_load_html_response) | 1975-07-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PCNP | Patent ceased through non-payment of renewal fee |