GB1476176A - Bright solder electro plating baths - Google Patents

Bright solder electro plating baths

Info

Publication number
GB1476176A
GB1476176A GB2244174A GB2244174A GB1476176A GB 1476176 A GB1476176 A GB 1476176A GB 2244174 A GB2244174 A GB 2244174A GB 2244174 A GB2244174 A GB 2244174A GB 1476176 A GB1476176 A GB 1476176A
Authority
GB
United Kingdom
Prior art keywords
gpl
alkyl
aromatic
bright
amine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2244174A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxy Metal Industries Corp
Original Assignee
Oxy Metal Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxy Metal Industries Corp filed Critical Oxy Metal Industries Corp
Publication of GB1476176A publication Critical patent/GB1476176A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

1476176 Electro-plating bright Sn-Pb alloy OXY METAL INDUSTRIES CORP 20 May 1974 [21 May 1973] 22441/74 Heading C7B Bright Sn-Pb of high solderability is electroplated from an aqueous acid bath (preferred pH<1À0) containing 3À5-6 gpl Sn<SP>2+</SP>, 30-45 wt per cent Pb<SP>2+</SP> based on the total Sn and Pb, 6- 12 gpl formaldehyde, at least 0À1 gpl aromatic primary amine, at least 0À001 gpl condensation product of an aromatic amine and an aromatic aldehyde, and a surfactant combination which includes an anionic, a cationic and an amphoteric surfactant. The aromatic amine may have Formula wherein R 1 -R 5 are C 1-4 alkyl, alkoxy, halide, H or OH and the aldehyde may have Formula wherein R is alkyl or H, Ar is aryl with up to two fused rings with or without halide or C 1-4 alkyl or alkoxy substituents and the CHO and OR groups are ortho to each other. The use of o-anisidine and the condensation product of 2-hydroxy-naphthalene-1-carboxaldehyde with o-ethylaniline is specified. Up to 0À001 gpl of a polyaromatic disulphonic acid or salt may be included e.g. disodium naphthalene-2,7-disulphonate. The surfactant combination may be a blend of (1) tetrasodium-N-(1,2-dicarboxyethyl)-N- octadecyl sulphosuccinamate; (2) diosodium N, N- dicarboxymethyl-2-undecyl imidazoline or a sulphated tertiary amine and (3) a polyethoxylated benzylphenol or #-naphthol. The Pb and Sn may be present as fluoborates or methane sulphonates with HBF4 or H 2 SiF 6 to maintain acidity. Optional additions include H 3 BO 3 and alkanols.
GB2244174A 1973-05-21 1974-05-20 Bright solder electro plating baths Expired GB1476176A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00362595A US3850765A (en) 1973-05-21 1973-05-21 Bright solder plating

Publications (1)

Publication Number Publication Date
GB1476176A true GB1476176A (en) 1977-06-10

Family

ID=23426724

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2244174A Expired GB1476176A (en) 1973-05-21 1974-05-20 Bright solder electro plating baths

Country Status (11)

Country Link
US (1) US3850765A (en)
JP (1) JPS5736990B2 (en)
AT (1) AT333093B (en)
BE (1) BE815368A (en)
CA (1) CA1031291A (en)
DE (1) DE2424070C2 (en)
ES (1) ES426548A1 (en)
FR (1) FR2230752B1 (en)
GB (1) GB1476176A (en)
IT (1) IT1023029B (en)
NL (1) NL7406817A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE390986B (en) * 1973-10-18 1977-01-31 Modo Kemi Ab PROCEDURE FOR ELECTROPLETING AW COATINGS OF IGNITION OR IGNITION ALLOY UNIT OF AN ACID ELECTROLYTE BATH
US4073701A (en) * 1976-10-15 1978-02-14 Bethlehem Steel Corporation Acid electrotinning bath
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (en) * 1981-09-08 1983-03-09 Occidental Chem Co ELECTROPLETING FOR PROVISION OF TIN LEAD ALLOYS ON DIFFERENT SUBSTRACTS
US4662999A (en) * 1985-06-26 1987-05-05 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
DE3934866A1 (en) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech METHOD FOR DEPOSITING LEAD AND LEAD-CONTAINING LAYERS, ELECTROLYTE FOR CARRYING OUT THE METHOD AND USE OF SURFACTANTS IN ACID LEAD ELECTROLYTE
US5326453A (en) * 1993-02-19 1994-07-05 Motorola, Inc. Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661730A (en) * 1969-09-22 1972-05-09 Kazuo Nishihara Process for the formation of a super-bright solder coating
US3730853A (en) * 1971-06-18 1973-05-01 Schloetter M Electroplating bath for depositing tin-lead alloy plates
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating

Also Published As

Publication number Publication date
JPS5736990B2 (en) 1982-08-06
JPS5041728A (en) 1975-04-16
ATA409774A (en) 1976-02-15
FR2230752A1 (en) 1974-12-20
DE2424070C2 (en) 1985-08-22
DE2424070A1 (en) 1974-12-12
CA1031291A (en) 1978-05-16
FR2230752B1 (en) 1983-07-22
NL7406817A (en) 1974-11-25
IT1023029B (en) 1978-05-10
US3850765A (en) 1974-11-26
ES426548A1 (en) 1976-07-01
AU6893474A (en) 1975-11-20
AT333093B (en) 1976-11-10
BE815368A (en) 1974-11-21

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee