JPS5736990B2 - - Google Patents

Info

Publication number
JPS5736990B2
JPS5736990B2 JP5380074A JP5380074A JPS5736990B2 JP S5736990 B2 JPS5736990 B2 JP S5736990B2 JP 5380074 A JP5380074 A JP 5380074A JP 5380074 A JP5380074 A JP 5380074A JP S5736990 B2 JPS5736990 B2 JP S5736990B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5380074A
Other versions
JPS5041728A (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5041728A publication Critical patent/JPS5041728A/ja
Publication of JPS5736990B2 publication Critical patent/JPS5736990B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP5380074A 1973-05-21 1974-05-14 Expired JPS5736990B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00362595A US3850765A (en) 1973-05-21 1973-05-21 Bright solder plating

Publications (2)

Publication Number Publication Date
JPS5041728A JPS5041728A (ja) 1975-04-16
JPS5736990B2 true JPS5736990B2 (ja) 1982-08-06

Family

ID=23426724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5380074A Expired JPS5736990B2 (ja) 1973-05-21 1974-05-14

Country Status (11)

Country Link
US (1) US3850765A (ja)
JP (1) JPS5736990B2 (ja)
AT (1) AT333093B (ja)
BE (1) BE815368A (ja)
CA (1) CA1031291A (ja)
DE (1) DE2424070C2 (ja)
ES (1) ES426548A1 (ja)
FR (1) FR2230752B1 (ja)
GB (1) GB1476176A (ja)
IT (1) IT1023029B (ja)
NL (1) NL7406817A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE390986B (sv) * 1973-10-18 1977-01-31 Modo Kemi Ab Forfarande for elektropletering aw beleggningar av tenn eller tenn- blylegerinh ur ett surt elektrolytbad
US4073701A (en) * 1976-10-15 1978-02-14 Bethlehem Steel Corporation Acid electrotinning bath
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (sv) * 1981-09-08 1983-03-09 Occidental Chem Co Elektropletering for avsettning av tenn-blylegeringar pa olika underlag
US4662999A (en) * 1985-06-26 1987-05-05 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
DE3934866A1 (de) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech Verfahren zur abscheidung von blei- und bleihaltigen schichten, elektrolyte zur durchfuehrung des verfahrens sowie verwendung von tensiden in sauren blei-elektrolyten
US5326453A (en) * 1993-02-19 1994-07-05 Motorola, Inc. Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661730A (en) * 1969-09-22 1972-05-09 Kazuo Nishihara Process for the formation of a super-bright solder coating
US3730853A (en) * 1971-06-18 1973-05-01 Schloetter M Electroplating bath for depositing tin-lead alloy plates
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating

Also Published As

Publication number Publication date
FR2230752A1 (ja) 1974-12-20
AT333093B (de) 1976-11-10
US3850765A (en) 1974-11-26
ES426548A1 (es) 1976-07-01
JPS5041728A (ja) 1975-04-16
AU6893474A (en) 1975-11-20
ATA409774A (de) 1976-02-15
CA1031291A (en) 1978-05-16
BE815368A (fr) 1974-11-21
FR2230752B1 (ja) 1983-07-22
GB1476176A (en) 1977-06-10
DE2424070A1 (de) 1974-12-12
NL7406817A (ja) 1974-11-25
DE2424070C2 (de) 1985-08-22
IT1023029B (it) 1978-05-10

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