IT1023029B - METHOD AND COMPOSITION FOR THE ELECTROLYTIC PLATING OF METALS - Google Patents

METHOD AND COMPOSITION FOR THE ELECTROLYTIC PLATING OF METALS

Info

Publication number
IT1023029B
IT1023029B IT51116/74A IT5111674A IT1023029B IT 1023029 B IT1023029 B IT 1023029B IT 51116/74 A IT51116/74 A IT 51116/74A IT 5111674 A IT5111674 A IT 5111674A IT 1023029 B IT1023029 B IT 1023029B
Authority
IT
Italy
Prior art keywords
metals
composition
electrolytic plating
electrolytic
plating
Prior art date
Application number
IT51116/74A
Other languages
Italian (it)
Inventor
Pettengill E Leahy
Jr G A Karustis
Original Assignee
Oxi Metal Finishing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxi Metal Finishing Corp filed Critical Oxi Metal Finishing Corp
Application granted granted Critical
Publication of IT1023029B publication Critical patent/IT1023029B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
IT51116/74A 1973-05-21 1974-05-20 METHOD AND COMPOSITION FOR THE ELECTROLYTIC PLATING OF METALS IT1023029B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00362595A US3850765A (en) 1973-05-21 1973-05-21 Bright solder plating

Publications (1)

Publication Number Publication Date
IT1023029B true IT1023029B (en) 1978-05-10

Family

ID=23426724

Family Applications (1)

Application Number Title Priority Date Filing Date
IT51116/74A IT1023029B (en) 1973-05-21 1974-05-20 METHOD AND COMPOSITION FOR THE ELECTROLYTIC PLATING OF METALS

Country Status (11)

Country Link
US (1) US3850765A (en)
JP (1) JPS5736990B2 (en)
AT (1) AT333093B (en)
BE (1) BE815368A (en)
CA (1) CA1031291A (en)
DE (1) DE2424070C2 (en)
ES (1) ES426548A1 (en)
FR (1) FR2230752B1 (en)
GB (1) GB1476176A (en)
IT (1) IT1023029B (en)
NL (1) NL7406817A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE390986B (en) * 1973-10-18 1977-01-31 Modo Kemi Ab PROCEDURE FOR ELECTROPLETING AW COATINGS OF IGNITION OR IGNITION ALLOY UNIT OF AN ACID ELECTROLYTE BATH
US4073701A (en) * 1976-10-15 1978-02-14 Bethlehem Steel Corporation Acid electrotinning bath
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
US4347107A (en) * 1981-04-02 1982-08-31 Hooker Chemicals & Plastics Corp. Electroplating tin and tin alloys and baths therefor
SE8204505L (en) * 1981-09-08 1983-03-09 Occidental Chem Co ELECTROPLETING FOR PROVISION OF TIN LEAD ALLOYS ON DIFFERENT SUBSTRACTS
US4662999A (en) * 1985-06-26 1987-05-05 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
DE3934866A1 (en) * 1989-10-19 1991-04-25 Blasberg Oberflaechentech METHOD FOR DEPOSITING LEAD AND LEAD-CONTAINING LAYERS, ELECTROLYTE FOR CARRYING OUT THE METHOD AND USE OF SURFACTANTS IN ACID LEAD ELECTROLYTE
US5326453A (en) * 1993-02-19 1994-07-05 Motorola, Inc. Method and solution for electrodeposition of a dense, reflective tin or tin-lead alloy
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3661730A (en) * 1969-09-22 1972-05-09 Kazuo Nishihara Process for the formation of a super-bright solder coating
US3730853A (en) * 1971-06-18 1973-05-01 Schloetter M Electroplating bath for depositing tin-lead alloy plates
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating

Also Published As

Publication number Publication date
JPS5736990B2 (en) 1982-08-06
ATA409774A (en) 1976-02-15
NL7406817A (en) 1974-11-25
BE815368A (en) 1974-11-21
AU6893474A (en) 1975-11-20
GB1476176A (en) 1977-06-10
FR2230752A1 (en) 1974-12-20
DE2424070C2 (en) 1985-08-22
DE2424070A1 (en) 1974-12-12
JPS5041728A (en) 1975-04-16
AT333093B (en) 1976-11-10
CA1031291A (en) 1978-05-16
ES426548A1 (en) 1976-07-01
FR2230752B1 (en) 1983-07-22
US3850765A (en) 1974-11-26

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