GB1474103A - Thermoplastic hot melt adhesive polyamide composition for bonding metals - Google Patents
Thermoplastic hot melt adhesive polyamide composition for bonding metalsInfo
- Publication number
- GB1474103A GB1474103A GB2325574A GB2325574A GB1474103A GB 1474103 A GB1474103 A GB 1474103A GB 2325574 A GB2325574 A GB 2325574A GB 2325574 A GB2325574 A GB 2325574A GB 1474103 A GB1474103 A GB 1474103A
- Authority
- GB
- United Kingdom
- Prior art keywords
- hot melt
- melt adhesive
- polyamide composition
- adhesive
- metals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 title abstract 4
- 239000002184 metal Substances 0.000 title abstract 4
- 150000002739 metals Chemical class 0.000 title abstract 3
- 239000004831 Hot glue Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title abstract 2
- 239000004952 Polyamide Substances 0.000 title 1
- 229920002647 polyamide Polymers 0.000 title 1
- 229920001169 thermoplastic Polymers 0.000 title 1
- 239000004416 thermosoftening plastic Substances 0.000 title 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 abstract 1
- 239000005977 Ethylene Substances 0.000 abstract 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 abstract 1
- 229910001209 Low-carbon steel Inorganic materials 0.000 abstract 1
- 229920000299 Nylon 12 Polymers 0.000 abstract 1
- 229920000577 Nylon 6/66 Polymers 0.000 abstract 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052742 iron Inorganic materials 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 239000005029 tin-free steel Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6065973A JPS5318060B2 (enrdf_load_stackoverflow) | 1973-05-30 | 1973-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1474103A true GB1474103A (en) | 1977-05-18 |
Family
ID=13148672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB2325574A Expired GB1474103A (en) | 1973-05-30 | 1974-05-24 | Thermoplastic hot melt adhesive polyamide composition for bonding metals |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS5318060B2 (enrdf_load_stackoverflow) |
| DE (1) | DE2425989C3 (enrdf_load_stackoverflow) |
| FR (1) | FR2231722B1 (enrdf_load_stackoverflow) |
| GB (1) | GB1474103A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53111340A (en) * | 1977-03-10 | 1978-09-28 | Daicel Chem Ind Ltd | Hot-melt adhesive film |
| JPS53111359A (en) * | 1977-03-10 | 1978-09-28 | Daicel Chem Ind Ltd | Resin composition for film |
| JPS564652A (en) * | 1979-06-27 | 1981-01-19 | Toray Gosei Film Kk | Hot-melt adhesive composition |
| US4348502A (en) * | 1981-01-23 | 1982-09-07 | Monsanto Company | Thermoplastic compositions of nylon and ethylene-vinyl acetate rubber |
| JPS5857480A (ja) * | 1981-09-30 | 1983-04-05 | Toyo Seikan Kaisha Ltd | 金属性ビンの製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4818096B1 (enrdf_load_stackoverflow) * | 1969-03-06 | 1973-06-04 | ||
| BE754443A (fr) * | 1969-08-05 | 1971-01-18 | Veba Chemie Ag | Adhesif par fusion a base de polyamide |
| US3646154A (en) * | 1970-02-02 | 1972-02-29 | Grace W R & Co | Hot melt adhesive containing polyamide and ethylene-vinyl acetate copolymer |
| DE2025914A1 (en) * | 1970-05-27 | 1971-12-09 | Stockhausen & Cie Chem Fab | Thermoplastic compsn prodn - from polyamides and - ethylene-vinyl acetate and/or vinyl alcohol copolymers, mixed in melt |
| CA984727A (en) * | 1971-07-22 | 1976-03-02 | Francis L. Chupka (Jr.) | Side seam adhesive |
-
1973
- 1973-05-30 JP JP6065973A patent/JPS5318060B2/ja not_active Expired
-
1974
- 1974-05-24 GB GB2325574A patent/GB1474103A/en not_active Expired
- 1974-05-30 DE DE2425989A patent/DE2425989C3/de not_active Expired
- 1974-05-30 FR FR7418826A patent/FR2231722B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5318060B2 (enrdf_load_stackoverflow) | 1978-06-13 |
| DE2425989C3 (de) | 1982-12-30 |
| DE2425989A1 (de) | 1974-12-19 |
| FR2231722B1 (enrdf_load_stackoverflow) | 1978-05-05 |
| DE2425989B2 (de) | 1978-12-14 |
| FR2231722A1 (enrdf_load_stackoverflow) | 1974-12-27 |
| JPS5010332A (enrdf_load_stackoverflow) | 1975-02-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PE20 | Patent expired after termination of 20 years |
Effective date: 19940523 |