GB1461921A - Method and apparatus for thin film deposition on a substrate - Google Patents
Method and apparatus for thin film deposition on a substrateInfo
- Publication number
- GB1461921A GB1461921A GB64474A GB64474A GB1461921A GB 1461921 A GB1461921 A GB 1461921A GB 64474 A GB64474 A GB 64474A GB 64474 A GB64474 A GB 64474A GB 1461921 A GB1461921 A GB 1461921A
- Authority
- GB
- United Kingdom
- Prior art keywords
- drum
- substrate
- targets
- sputtering
- arcuate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
- H01J37/32761—Continuous moving
- H01J37/3277—Continuous moving of continuous material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
1461921 Sputtering apparatus COULTER INFORMATION SYSTEMS Inc 7 Jan 1974 [12 Jan 1973] 00644/74 Heading C7F Apparatus for sputtering a coating on an elongate plastics substrate comprises a pressure vessel 112 containing a drum 118, round which the substrate 70 passes during sputtering, feed and takeup reels 132, 142 and arcuate targets 156, 158, 160 (containing material to be sputtered 164) forming a cylinder around the drum, Fig.4. A slotted cylindrical magnetic drum 206 is positionedwithin the drum 118, and together with magnets 214 creates a field which deflects secondary electrons from the substrate. The helical loops of substrate 70 around the drum 118 are shifted axially by a mechanism 87. The targets 156-160 and the drum 118 are cooled, e.g. by water or liquid N2. In another embodiment, Figs.7-9 (not shown) the loops are normal to the drum axis, and are shifted by forming a bight in each loop and feeding the advanced end of the bight into the adjacent position on the drum. The drum 118 may have a heat absorbent coating for cooling purposes, e.g. an Al drum with a black anodized surface or a stainless steel drum with a black Ni coating. A tungsten lamp 184 is provided in the chamber to neutralize the build up of electrons and hence decrease the surface charge on the substrate. The apparatus can be used for D.C., radio frequency, or reactive sputtering, examples of the latter being the deposition of cadmium sulphide or zinc indium sulphide by using targets of Cd or Zn-In in an atmosphere containing S. The targets may be in the form of arcuate plates or strips, or arcuate arrangements of rods, which may be individually cooled. The apparatus shown is for batch processes, but a continuous process is described, Fig.2 (not shown) where the supply and take-up reels are outside the vessel and the substrate passes through pressuretight passageways.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US323133A US3884787A (en) | 1973-01-12 | 1973-01-12 | Sputtering method for thin film deposition on a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1461921A true GB1461921A (en) | 1977-01-19 |
Family
ID=23257860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB64474A Expired GB1461921A (en) | 1973-01-12 | 1974-01-07 | Method and apparatus for thin film deposition on a substrate |
Country Status (15)
Country | Link |
---|---|
US (1) | US3884787A (en) |
JP (1) | JPS5747267B2 (en) |
AT (1) | AT341335B (en) |
BE (1) | BE809464A (en) |
CA (1) | CA1018475A (en) |
CH (1) | CH597622A5 (en) |
DD (1) | DD109035A5 (en) |
DE (1) | DE2400587A1 (en) |
FR (1) | FR2322667A1 (en) |
GB (1) | GB1461921A (en) |
IL (1) | IL43966A (en) |
IT (1) | IT1002650B (en) |
LU (1) | LU69122A1 (en) |
NL (1) | NL7317670A (en) |
SE (1) | SE392919B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2150600A (en) * | 1983-12-05 | 1985-07-03 | Pilkington Brothers Plc | Improvements in or relating to coating apparatus |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3939052A (en) * | 1975-01-15 | 1976-02-17 | Riley Leon H | Depositing optical fibers |
GB2010676B (en) * | 1977-12-27 | 1982-05-19 | Alza Corp | Diffusional drug delivery device with block copolymer as drug carrier |
US4331526A (en) * | 1979-09-24 | 1982-05-25 | Coulter Systems Corporation | Continuous sputtering apparatus and method |
US4290877A (en) * | 1980-09-08 | 1981-09-22 | The United States Of America As Represented By The Secretary Of The Interior | Sputtering apparatus for coating elongated tubes and strips |
US4384532A (en) * | 1980-10-31 | 1983-05-24 | Staff Arthur B | Table extension for the handicapped |
US4343881A (en) * | 1981-07-06 | 1982-08-10 | Savin Corporation | Multilayer photoconductive assembly with intermediate heterojunction |
US4389295A (en) * | 1982-05-06 | 1983-06-21 | Gte Products Corporation | Thin film phosphor sputtering process |
JPS5976571A (en) * | 1982-10-25 | 1984-05-01 | Natl House Ind Co Ltd | Applicator |
NL8602759A (en) * | 1986-10-31 | 1988-05-16 | Bekaert Sa Nv | METHOD AND DEVICE FOR TREATING AN LONG-TERM SUBSTRATE COVERED; AND SUBSTRATES TREATED ACCORDING TO THAT METHOD AND ARTICLES OF POLYMER MATERIAL REINFORCED WITH THESE SUBSTRATES. |
US5219668A (en) * | 1986-10-31 | 1993-06-15 | N.V. Bekaert S.A. | Process and apparatus for the treatment of coated, elongated substrate, as well as substrates thus treated and articles of polymeric material reinforced with these substrates |
US4849087A (en) * | 1988-02-11 | 1989-07-18 | Southwall Technologies | Apparatus for obtaining transverse uniformity during thin film deposition on extended substrate |
DE3886754D1 (en) * | 1988-10-19 | 1994-02-10 | Ibm Deutschland | Device for plasma or reactive ion etching and method for etching poorly heat-conducting substrates. |
DE29600991U1 (en) * | 1996-01-20 | 1997-05-22 | Straemke Siegfried Dr Ing | Plasma reactor |
US5725706A (en) * | 1996-03-12 | 1998-03-10 | The Whitaker Corporation | Laser transfer deposition |
US6066826A (en) * | 1998-03-16 | 2000-05-23 | Yializis; Angelo | Apparatus for plasma treatment of moving webs |
DE60211470T2 (en) * | 2002-03-15 | 2006-11-09 | Vhf Technologies S.A. | Apparatus and method for manufacturing flexible semiconductor devices |
CH696013A5 (en) * | 2002-10-03 | 2006-11-15 | Tetra Laval Holdings & Finance | An apparatus for treating a strip-like material in a plasma-assisted process. |
US6906008B2 (en) * | 2003-06-26 | 2005-06-14 | Superpower, Inc. | Apparatus for consecutive deposition of high-temperature superconducting (HTS) buffer layers |
US7169232B2 (en) * | 2004-06-01 | 2007-01-30 | Eastman Kodak Company | Producing repetitive coatings on a flexible substrate |
CA2586613C (en) * | 2004-12-29 | 2011-11-08 | Sca Hygiene Products Ab | A hands-free paper towel dispenser and dispensing system |
DE102005058869A1 (en) * | 2005-12-09 | 2007-06-14 | Cis Solartechnik Gmbh & Co. Kg | Method and device for coating strips |
KR100750654B1 (en) * | 2006-09-15 | 2007-08-20 | 한국전기연구원 | Long tape deposition apparatus |
KR100928222B1 (en) * | 2007-10-31 | 2009-11-24 | 한국전기연구원 | Joist deposition apparatus with guide roller |
US20090194505A1 (en) * | 2008-01-24 | 2009-08-06 | Microcontinuum, Inc. | Vacuum coating techniques |
EP2113585A1 (en) * | 2008-04-29 | 2009-11-04 | Applied Materials, Inc. | Apparatus and method for coating of a web in vacuum by twisting and guiding the web multiple times along a roller past a processing region |
TW201110831A (en) * | 2009-09-03 | 2011-03-16 | Chunghwa Picture Tubes Ltd | Plasma apparatus and method of fabricating nano-crystalline silicon thin film |
EP2508315B1 (en) | 2011-04-07 | 2013-09-18 | Gedore-Werkzeugfabrik GmbH & Co. KG | Splitting wedge |
EP2909355B1 (en) * | 2012-10-22 | 2018-09-26 | Proportional Technologies, Inc. | Method and apparatus for coating thin foil with a boron coating |
KR20140061808A (en) * | 2012-11-14 | 2014-05-22 | 삼성디스플레이 주식회사 | Apparatus for depositing organic material |
US10112836B2 (en) * | 2012-11-26 | 2018-10-30 | The Regents Of The University Of Michigan | Continuous nanosynthesis apparatus and process |
WO2022040075A1 (en) * | 2020-08-21 | 2022-02-24 | Applied Materials, Inc. | Processing system for processing a flexible substrate and method of measuring at least one of a property of a flexible substrate and a property of one or more coatings on the flexible substrate |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2249710A (en) * | 1935-02-18 | 1941-07-15 | Ind Rayon Corp | Apparatus for continuously processing thread or the like |
NL143409C (en) * | 1947-11-20 | |||
US3068510A (en) * | 1959-12-14 | 1962-12-18 | Radiation Res Corp | Polymerizing method and apparatus |
NL260813A (en) * | 1960-02-03 | |||
US3343207A (en) * | 1963-10-14 | 1967-09-26 | Monsanto Co | Novelty yarn apparatus |
US3272175A (en) * | 1965-05-12 | 1966-09-13 | Heraeus Gmbh W C | Vapor deposition means for strip-coating continuously moving, helically wound ribbon |
US3477902A (en) * | 1965-10-14 | 1969-11-11 | Radiation Res Corp | Process for making tires by exposure to an ionized gas and treatment with resorcinol-formaldehyde/latex composition and the product |
DE1802932B2 (en) * | 1968-10-14 | 1974-11-14 | W.C. Heraeus Gmbh, 6450 Hanau | Method for producing an electrical switch contact |
US3598639A (en) * | 1968-12-09 | 1971-08-10 | Bror Olov Nikolaus Hansson | Method of continuously producing metal wire and profiles |
US3700489A (en) * | 1970-07-30 | 1972-10-24 | Ethicon Inc | Process for applying a thin coating of polytetrafluoroethylene |
-
1973
- 1973-01-12 US US323133A patent/US3884787A/en not_active Expired - Lifetime
- 1973-12-27 NL NL7317670A patent/NL7317670A/xx not_active Application Discontinuation
-
1974
- 1974-01-07 FR FR7400468A patent/FR2322667A1/en active Granted
- 1974-01-07 JP JP49005003A patent/JPS5747267B2/ja not_active Expired
- 1974-01-07 CA CA189,611A patent/CA1018475A/en not_active Expired
- 1974-01-07 GB GB64474A patent/GB1461921A/en not_active Expired
- 1974-01-07 DE DE2400587A patent/DE2400587A1/en not_active Withdrawn
- 1974-01-07 BE BE139580A patent/BE809464A/en not_active IP Right Cessation
- 1974-01-07 LU LU69122A patent/LU69122A1/xx unknown
- 1974-01-07 AT AT9674A patent/AT341335B/en not_active IP Right Cessation
- 1974-01-07 IL IL43966A patent/IL43966A/en unknown
- 1974-01-07 CH CH22474A patent/CH597622A5/xx not_active IP Right Cessation
- 1974-01-10 DD DD175932A patent/DD109035A5/xx unknown
- 1974-01-11 SE SE7400351A patent/SE392919B/en unknown
- 1974-01-14 IT IT47682/74A patent/IT1002650B/en active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2150600A (en) * | 1983-12-05 | 1985-07-03 | Pilkington Brothers Plc | Improvements in or relating to coating apparatus |
Also Published As
Publication number | Publication date |
---|---|
LU69122A1 (en) | 1975-12-09 |
AT341335B (en) | 1978-02-10 |
IL43966A0 (en) | 1974-06-30 |
IT1002650B (en) | 1976-05-20 |
BE809464A (en) | 1974-07-08 |
CH597622A5 (en) | 1978-04-14 |
SE392919B (en) | 1977-04-25 |
JPS5747267B2 (en) | 1982-10-08 |
ATA9674A (en) | 1977-05-15 |
DD109035A5 (en) | 1974-10-12 |
JPS49104972A (en) | 1974-10-04 |
US3884787A (en) | 1975-05-20 |
DE2400587A1 (en) | 1974-07-18 |
IL43966A (en) | 1976-12-31 |
FR2322667A1 (en) | 1977-04-01 |
CA1018475A (en) | 1977-10-04 |
NL7317670A (en) | 1974-07-16 |
FR2322667B1 (en) | 1978-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB1461921A (en) | Method and apparatus for thin film deposition on a substrate | |
GB1462241A (en) | Thin film deposition apparatus using segmented target means | |
EP0105409B1 (en) | Thin film deposition by sputtering | |
US4151064A (en) | Apparatus for sputtering cylinders | |
US4013539A (en) | Thin film deposition apparatus | |
US4434037A (en) | High rate sputtering system and method | |
US3898952A (en) | Apparatus for production of magnetic recording medium | |
EP0273685B1 (en) | Method of producing a thin film by sputtering and an opposed target type sputtering apparatus | |
EP0202645B1 (en) | Method and apparatus for making magnetic recording media | |
MY112448A (en) | Use of multiple anodes in a magnetron for improving the uniformity of its plasma | |
US5215638A (en) | Rotating magnetron cathode and method for the use thereof | |
ES8303552A1 (en) | Magnetron cathode sputtering apparatus. | |
GB1209968A (en) | Rf sputtering method and system | |
US6146509A (en) | Inverted field circular magnetron sputtering device | |
US4394236A (en) | Magnetron cathode sputtering apparatus | |
US4026787A (en) | Thin film deposition apparatus using segmented target means | |
GB1054660A (en) | ||
IE53214B1 (en) | High rate sputtering system and method | |
GB1132867A (en) | Improvements in or relating to apparatus for depositing thin films | |
US3905887A (en) | Thin film deposition method using segmented plasma | |
GB1503301A (en) | Sputtering apparatus | |
GB1147318A (en) | Improvements in r.f. cathodic sputtering systems | |
JPS57200945A (en) | Magnetic recording medium | |
US3399129A (en) | Sputer deposition of nickel-iron-manganese ferromagnetic films | |
JPS60200962A (en) | Planar magnetron sputtering method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |