GB1461127A - Epoxy resins - Google Patents
Epoxy resinsInfo
- Publication number
- GB1461127A GB1461127A GB1096574A GB1096574A GB1461127A GB 1461127 A GB1461127 A GB 1461127A GB 1096574 A GB1096574 A GB 1096574A GB 1096574 A GB1096574 A GB 1096574A GB 1461127 A GB1461127 A GB 1461127A
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resin
- modified
- catalyst
- resin
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 6
- 229920000647 polyepoxide Polymers 0.000 title abstract 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title abstract 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 4
- 239000003054 catalyst Substances 0.000 abstract 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 abstract 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 abstract 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 229920001577 copolymer Polymers 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 239000011347 resin Substances 0.000 abstract 2
- KPYXJTVYNVQZHY-UHFFFAOYSA-N 1-(dichloromethyl)-3-methyl-1,3-diphenylurea Chemical compound ClC(N(C(=O)N(C)C1=CC=CC=C1)C1=CC=CC=C1)Cl KPYXJTVYNVQZHY-UHFFFAOYSA-N 0.000 abstract 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 abstract 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract 1
- 229920000877 Melamine resin Polymers 0.000 abstract 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 abstract 1
- 239000004698 Polyethylene Substances 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000008119 colloidal silica Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 abstract 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 abstract 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 abstract 1
- 239000003607 modifier Substances 0.000 abstract 1
- 125000000896 monocarboxylic acid group Chemical group 0.000 abstract 1
- 150000001451 organic peroxides Chemical class 0.000 abstract 1
- 229920000768 polyamine Polymers 0.000 abstract 1
- -1 polyethylene Polymers 0.000 abstract 1
- 229920000573 polyethylene Polymers 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000000047 product Substances 0.000 abstract 1
- 150000003856 quaternary ammonium compounds Chemical class 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 abstract 1
- 239000010935 stainless steel Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 125000001302 tertiary amino group Chemical group 0.000 abstract 1
- GFZMLBWMGBLIDI-UHFFFAOYSA-M tetrabutylphosphanium;acetate Chemical compound CC([O-])=O.CCCC[P+](CCCC)(CCCC)CCCC GFZMLBWMGBLIDI-UHFFFAOYSA-M 0.000 abstract 1
- 238000004073 vulcanization Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34039273A | 1973-03-12 | 1973-03-12 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1461127A true GB1461127A (en) | 1977-01-13 |
Family
ID=23333172
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1096574A Expired GB1461127A (en) | 1973-03-12 | 1974-03-12 | Epoxy resins |
Country Status (10)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2118558A (en) * | 1982-04-20 | 1983-11-02 | Dunlop Ltd | Adhesive compositions |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5721450A (en) * | 1980-07-11 | 1982-02-04 | Toho Rayon Co Ltd | Epoxy resin composition |
JPS57102919A (en) * | 1980-12-16 | 1982-06-26 | Nitto Electric Ind Co Ltd | Epoxy resin composition |
JPS61228059A (ja) * | 1985-04-03 | 1986-10-11 | Nitto Electric Ind Co Ltd | エポキシ樹脂塗料用組成物 |
US4707518A (en) * | 1986-10-16 | 1987-11-17 | Shah Dilipkumar N | Rubber-modified epoxy adhesives |
EP2751069B1 (de) * | 2011-08-31 | 2017-10-11 | Basf Se | Verfahren zur herstellung von eddn und/oder edmn |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3208980A (en) * | 1960-12-30 | 1965-09-28 | Phillips Petroleum Co | Polymer compositions using liquid carboxy-terminated diene polymer and epoxidized compound |
US3340224A (en) * | 1965-01-21 | 1967-09-05 | Chrysler Corp | Thermosetting, curable elastomeric composition and methods of making the same |
-
1974
- 1974-02-26 CA CA193,539A patent/CA1037188A/en not_active Expired
- 1974-03-08 IT IT4920474A patent/IT1011066B/it active
- 1974-03-08 DE DE19742411064 patent/DE2411064A1/de not_active Withdrawn
- 1974-03-11 NL NL7403221A patent/NL7403221A/xx not_active Application Discontinuation
- 1974-03-11 SE SE7403234A patent/SE409212B/xx unknown
- 1974-03-11 FR FR7408237A patent/FR2221489B1/fr not_active Expired
- 1974-03-11 BR BR183074A patent/BR7401830D0/pt unknown
- 1974-03-12 BE BE141924A patent/BE812200A/xx unknown
- 1974-03-12 GB GB1096574A patent/GB1461127A/en not_active Expired
- 1974-03-12 JP JP2779974A patent/JPS49126798A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2118558A (en) * | 1982-04-20 | 1983-11-02 | Dunlop Ltd | Adhesive compositions |
Also Published As
Publication number | Publication date |
---|---|
IT1011066B (it) | 1977-01-20 |
AU6607574A (en) | 1975-08-28 |
BE812200A (fr) | 1974-09-12 |
FR2221489B1 (enrdf_load_stackoverflow) | 1978-02-10 |
NL7403221A (enrdf_load_stackoverflow) | 1974-09-16 |
DE2411064A1 (de) | 1974-09-19 |
CA1037188A (en) | 1978-08-22 |
SE409212B (sv) | 1979-08-06 |
BR7401830D0 (pt) | 1974-11-19 |
JPS49126798A (enrdf_load_stackoverflow) | 1974-12-04 |
FR2221489A1 (enrdf_load_stackoverflow) | 1974-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |