GB1460849A - Material for printed circuits - Google Patents

Material for printed circuits

Info

Publication number
GB1460849A
GB1460849A GB900474A GB900474A GB1460849A GB 1460849 A GB1460849 A GB 1460849A GB 900474 A GB900474 A GB 900474A GB 900474 A GB900474 A GB 900474A GB 1460849 A GB1460849 A GB 1460849A
Authority
GB
United Kingdom
Prior art keywords
layer
foil
alloy
solution containing
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB900474A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Perstorp AB
Original Assignee
Perstorp AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perstorp AB filed Critical Perstorp AB
Publication of GB1460849A publication Critical patent/GB1460849A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0147Carriers and holders
    • H05K2203/0152Temporary metallic carrier, e.g. for transferring material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703Plating
    • H05K2203/0726Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB900474A 1973-02-28 1974-02-27 Material for printed circuits Expired GB1460849A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7302829A SE443695B (sv) 1973-02-28 1973-02-28 Forfarande for framstellning av material for tryckt ledningsdragning

Publications (1)

Publication Number Publication Date
GB1460849A true GB1460849A (en) 1977-01-06

Family

ID=20316763

Family Applications (1)

Application Number Title Priority Date Filing Date
GB900474A Expired GB1460849A (en) 1973-02-28 1974-02-27 Material for printed circuits

Country Status (5)

Country Link
JP (1) JPS49135167A (enrdf_load_stackoverflow)
CH (1) CH604463A5 (enrdf_load_stackoverflow)
GB (1) GB1460849A (enrdf_load_stackoverflow)
NL (1) NL7402669A (enrdf_load_stackoverflow)
SE (1) SE443695B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003008671A1 (en) * 2001-07-18 2003-01-30 Circuit Foil Luxembourg S.A.R.L. Composite foil and its manufacturing process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004090488A (ja) * 2002-08-30 2004-03-25 Panac Co Ltd 金属層転写シート

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE788117A (fr) * 1971-08-30 1973-02-28 Perstorp Ab Procede de production d'elements pour circuits imprimes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003008671A1 (en) * 2001-07-18 2003-01-30 Circuit Foil Luxembourg S.A.R.L. Composite foil and its manufacturing process
KR100821017B1 (ko) * 2001-07-18 2008-04-10 서키트 호일 룩셈부르크 에스 에이 알 엘 복합 포일 및 그의 제조 방법

Also Published As

Publication number Publication date
JPS49135167A (enrdf_load_stackoverflow) 1974-12-26
CH604463A5 (enrdf_load_stackoverflow) 1978-09-15
SE443695B (sv) 1986-03-03
NL7402669A (enrdf_load_stackoverflow) 1974-08-30

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee