JPS49135167A - - Google Patents

Info

Publication number
JPS49135167A
JPS49135167A JP2372674A JP2372674A JPS49135167A JP S49135167 A JPS49135167 A JP S49135167A JP 2372674 A JP2372674 A JP 2372674A JP 2372674 A JP2372674 A JP 2372674A JP S49135167 A JPS49135167 A JP S49135167A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2372674A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS49135167A publication Critical patent/JPS49135167A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2372674A 1973-02-28 1974-02-27 Pending JPS49135167A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE7302829A SE443695B (sv) 1973-02-28 1973-02-28 Forfarande for framstellning av material for tryckt ledningsdragning

Publications (1)

Publication Number Publication Date
JPS49135167A true JPS49135167A (enrdf_load_stackoverflow) 1974-12-26

Family

ID=20316763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2372674A Pending JPS49135167A (enrdf_load_stackoverflow) 1973-02-28 1974-02-27

Country Status (5)

Country Link
JP (1) JPS49135167A (enrdf_load_stackoverflow)
CH (1) CH604463A5 (enrdf_load_stackoverflow)
GB (1) GB1460849A (enrdf_load_stackoverflow)
NL (1) NL7402669A (enrdf_load_stackoverflow)
SE (1) SE443695B (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004090488A (ja) * 2002-08-30 2004-03-25 Panac Co Ltd 金属層転写シート

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
LU90804B1 (fr) * 2001-07-18 2003-01-20 Circuit Foil Luxembourg Trading Sarl Process for manufacturing a composite foil suitable for manufacturing multi-layer printed circuit boards

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835357A (enrdf_load_stackoverflow) * 1971-08-30 1973-05-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835357A (enrdf_load_stackoverflow) * 1971-08-30 1973-05-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004090488A (ja) * 2002-08-30 2004-03-25 Panac Co Ltd 金属層転写シート

Also Published As

Publication number Publication date
CH604463A5 (enrdf_load_stackoverflow) 1978-09-15
GB1460849A (en) 1977-01-06
SE443695B (sv) 1986-03-03
NL7402669A (enrdf_load_stackoverflow) 1974-08-30

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