GB1459912A - Method of fabricating an insulator part - Google Patents

Method of fabricating an insulator part

Info

Publication number
GB1459912A
GB1459912A GB106275A GB106275A GB1459912A GB 1459912 A GB1459912 A GB 1459912A GB 106275 A GB106275 A GB 106275A GB 106275 A GB106275 A GB 106275A GB 1459912 A GB1459912 A GB 1459912A
Authority
GB
United Kingdom
Prior art keywords
glass
conducting
washers
articles
fabricating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB106275A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kulite Semiconductor Products Inc
Original Assignee
Kulite Semiconductor Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kulite Semiconductor Products Inc filed Critical Kulite Semiconductor Products Inc
Publication of GB1459912A publication Critical patent/GB1459912A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Measuring Fluid Pressure (AREA)
GB106275A 1973-04-02 1974-03-12 Method of fabricating an insulator part Expired GB1459912A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US347226A US3868719A (en) 1973-04-02 1973-04-02 Thin ribbon-like glass backed transducers

Publications (1)

Publication Number Publication Date
GB1459912A true GB1459912A (en) 1976-12-31

Family

ID=23362839

Family Applications (2)

Application Number Title Priority Date Filing Date
GB106275A Expired GB1459912A (en) 1973-04-02 1974-03-12 Method of fabricating an insulator part
GB1088774A Expired GB1459911A (en) 1973-04-02 1974-03-12 Method and apparatus for fabricating transducers

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1088774A Expired GB1459911A (en) 1973-04-02 1974-03-12 Method and apparatus for fabricating transducers

Country Status (4)

Country Link
US (1) US3868719A (https=)
JP (1) JPS5030488A (https=)
CA (1) CA994906A (https=)
GB (2) GB1459912A (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3899695A (en) * 1973-09-24 1975-08-12 Nat Semiconductor Corp Semiconductor pressure transducer employing novel temperature compensation means
US4025942A (en) * 1974-03-18 1977-05-24 Kulite Semiconductor Products, Inc. Low pressure transducers employing large silicon diaphragms having non-critical electrical properties
US4047214A (en) * 1975-09-04 1977-09-06 Westinghouse Electric Corporation Electrostatically bonded dielectric-on-semiconductor device, and a method of making the same
US4400869A (en) * 1981-02-12 1983-08-30 Becton Dickinson And Company Process for producing high temperature pressure transducers and semiconductors
JPS5894218A (ja) * 1981-11-30 1983-06-04 Semiconductor Res Found フオトカツプラ
JPS59141273A (ja) * 1983-02-01 1984-08-13 Anelva Corp 薄膜装置
US4516430A (en) * 1983-12-05 1985-05-14 Kulite Semiconductor Products, Inc. Economical transducer apparatus for use in the medical field
JPS6153167U (https=) * 1984-09-08 1986-04-10
JPH072942U (ja) * 1991-10-18 1995-01-17 日電アネルバ株式会社 薄膜装置
US5973590A (en) * 1998-03-12 1999-10-26 Kulite Semiconductor Products, Inc. Ultra thin surface mount wafer sensor structures and methods for fabricating same
US7595570B2 (en) * 2006-08-30 2009-09-29 Kulite Semiconductor Products, Inc. Solid state pressure switch
US8209857B2 (en) * 2009-06-19 2012-07-03 The Regents Of The University Of Michigan Method of making a thin film device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1541523B1 (de) * 1965-12-21 1970-07-09 Nippon Electric Co Piezoelektrisches elektroakustisches Wandlerelement und Verfahren zu seiner Herstellung
US3609625A (en) * 1966-02-15 1971-09-28 Kyowa Electronic Instruments Semiconductor strain gauge
JPS4418916Y1 (https=) * 1966-10-27 1969-08-14
US3621154A (en) * 1968-04-15 1971-11-16 Shure Bros Strain-sensitive semiconductive thin film electroacoustical transducer
US3624465A (en) * 1968-06-26 1971-11-30 Rca Corp Heterojunction semiconductor transducer having a region which is piezoelectric
GB1281579A (en) * 1968-12-04 1972-07-12 Matsushita Electric Industrial Co Ltd Improvements in and relating to a semi-conductor mechano-electrical transducer
US3749984A (en) * 1969-04-11 1973-07-31 Rca Corp Electroacoustic semiconductor device employing an igfet

Also Published As

Publication number Publication date
JPS5030488A (https=) 1975-03-26
CA994906A (en) 1976-08-10
GB1459911A (en) 1976-12-31
US3868719A (en) 1975-02-25

Similar Documents

Publication Publication Date Title
GB1459912A (en) Method of fabricating an insulator part
JPS5232280A (en) Semiconductor element using electrostatically bonded dielectric ion semiconductor substrate and method of producing same
GB1282603A (en) Bonding an insulator to an insulator
ES282418U (es) Una tira continua de material fotovoltaico
US4643532A (en) Field-assisted bonding method and articles produced thereby
ES450690A1 (es) Dispositivo semiconductor encapsulado y pasivado.
JPS5762539A (en) Mounting method for semiconductor element
EP0193820A3 (en) Method for forming a thin film pattern
GB931757A (en) Encapsulated impedance element and method of making same
GB1320706A (en) Support for electronic devices and method of producing same
GB1179535A (en) Bonding an Insulator to an Insulator
JPS61280660A (ja) 半導体装置の製造方法
JPH02141442A (ja) シリコンウエハとガラス基板の陽極接合法
GB874713A (en) Improvements in or relating to electrical components and processes for the manufacture thereof
CA1000415A (en) Method of manufacturing electrically conductive metal layers on substrates
JPH04148525A (ja) Ｓｏｉ基板およびその製造方法
JPS5469068A (en) Semiconductor device and its manufacture
JPS5588026A (en) Production of optical display cell
JPS556245A (en) Thermister bolometer
GB1086005A (en) Electrical impedance device and method
WO1991010120A3 (en) Semiconductor cavity device with electric lead
JPS6451670A (en) Manufacture of amorphous semiconductor device
JPS6411379A (en) Superconducting film structure
JPS5651830A (en) Glassivating method for bevel-type semiconductor element
JPS56140644A (en) Semiconductor device and manufacture thereof

Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PCNP Patent ceased through non-payment of renewal fee