GB1429705A - Selective metallization of nonconductors - Google Patents

Selective metallization of nonconductors

Info

Publication number
GB1429705A
GB1429705A GB5535273A GB5535273A GB1429705A GB 1429705 A GB1429705 A GB 1429705A GB 5535273 A GB5535273 A GB 5535273A GB 5535273 A GB5535273 A GB 5535273A GB 1429705 A GB1429705 A GB 1429705A
Authority
GB
United Kingdom
Prior art keywords
photo
resist
nonconductors
applying
electroless plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5535273A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Buckbee Mears Co
Original Assignee
Buckbee Mears Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Buckbee Mears Co filed Critical Buckbee Mears Co
Publication of GB1429705A publication Critical patent/GB1429705A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0565—Resist used only for applying catalyst, not for plating itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
GB5535273A 1972-12-20 1973-11-29 Selective metallization of nonconductors Expired GB1429705A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31689272A 1972-12-20 1972-12-20

Publications (1)

Publication Number Publication Date
GB1429705A true GB1429705A (en) 1976-03-24

Family

ID=23231157

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5535273A Expired GB1429705A (en) 1972-12-20 1973-11-29 Selective metallization of nonconductors

Country Status (8)

Country Link
JP (1) JPS4990640A (enrdf_load_stackoverflow)
BE (1) BE804148A (enrdf_load_stackoverflow)
CA (1) CA986772A (enrdf_load_stackoverflow)
DE (1) DE2363099A1 (enrdf_load_stackoverflow)
FR (1) FR2211545B1 (enrdf_load_stackoverflow)
GB (1) GB1429705A (enrdf_load_stackoverflow)
IT (1) IT993485B (enrdf_load_stackoverflow)
NL (1) NL7311039A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2164063A (en) * 1984-09-04 1986-03-12 Kollmorgen Tech Corp Selective electroless deposition on insulating substrates
EP0312551A4 (en) * 1987-04-28 1989-11-27 Macdermid Inc ADDITIVE PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS USING DEVELOPABLE AND PEELABLE AQUEOUS ALKALINE PHOTORESERVES.
GB2384493A (en) * 2002-01-23 2003-07-30 Oxley Dev Co Ltd Selective electroless plating of ceramic substrates for use in capacitors
EP1876876A4 (en) * 2005-04-18 2008-06-11 Seiren Co Ltd TRANSPARENT ELECTRICALLY CONDUCTIVE FILM AND PROCESS FOR ITS MANUFACTURE

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59147430A (ja) * 1983-02-10 1984-08-23 Oki Electric Ind Co Ltd 微細回路の形成方法
JPS62185896A (ja) * 1986-02-10 1987-08-14 Mitsubishi Motors Corp 部分めつき方法
JPS62185895A (ja) * 1986-02-10 1987-08-14 Mitsubishi Motors Corp 部分めつき方法
JPS62185892A (ja) * 1986-02-10 1987-08-14 Kurihara Tokin Kojo:Kk 電気メツキによる立体的模様形成方法
US4971715A (en) * 1988-11-18 1990-11-20 International Business Machines Corporation Phenolic-free stripping composition and use thereof
US6524645B1 (en) * 1994-10-18 2003-02-25 Agere Systems Inc. Process for the electroless deposition of metal on a substrate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI3A (fi) * 1843-11-08 Pressjäst

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2164063A (en) * 1984-09-04 1986-03-12 Kollmorgen Tech Corp Selective electroless deposition on insulating substrates
EP0312551A4 (en) * 1987-04-28 1989-11-27 Macdermid Inc ADDITIVE PROCESS FOR MANUFACTURING PRINTED CIRCUIT BOARDS USING DEVELOPABLE AND PEELABLE AQUEOUS ALKALINE PHOTORESERVES.
GB2384493A (en) * 2002-01-23 2003-07-30 Oxley Dev Co Ltd Selective electroless plating of ceramic substrates for use in capacitors
EP1876876A4 (en) * 2005-04-18 2008-06-11 Seiren Co Ltd TRANSPARENT ELECTRICALLY CONDUCTIVE FILM AND PROCESS FOR ITS MANUFACTURE

Also Published As

Publication number Publication date
NL7311039A (enrdf_load_stackoverflow) 1974-06-24
FR2211545B1 (enrdf_load_stackoverflow) 1977-08-12
DE2363099A1 (de) 1974-07-04
CA986772A (en) 1976-04-06
FR2211545A1 (enrdf_load_stackoverflow) 1974-07-19
JPS4990640A (enrdf_load_stackoverflow) 1974-08-29
IT993485B (it) 1975-09-30
BE804148A (nl) 1973-12-17

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee