NL7311039A - - Google Patents

Info

Publication number
NL7311039A
NL7311039A NL7311039A NL7311039A NL7311039A NL 7311039 A NL7311039 A NL 7311039A NL 7311039 A NL7311039 A NL 7311039A NL 7311039 A NL7311039 A NL 7311039A NL 7311039 A NL7311039 A NL 7311039A
Authority
NL
Netherlands
Application number
NL7311039A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of NL7311039A publication Critical patent/NL7311039A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0565—Resist used only for applying catalyst, not for plating itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
NL7311039A 1972-12-20 1973-08-09 NL7311039A (enrdf_load_stackoverflow)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US31689272A 1972-12-20 1972-12-20

Publications (1)

Publication Number Publication Date
NL7311039A true NL7311039A (enrdf_load_stackoverflow) 1974-06-24

Family

ID=23231157

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7311039A NL7311039A (enrdf_load_stackoverflow) 1972-12-20 1973-08-09

Country Status (8)

Country Link
JP (1) JPS4990640A (enrdf_load_stackoverflow)
BE (1) BE804148A (enrdf_load_stackoverflow)
CA (1) CA986772A (enrdf_load_stackoverflow)
DE (1) DE2363099A1 (enrdf_load_stackoverflow)
FR (1) FR2211545B1 (enrdf_load_stackoverflow)
GB (1) GB1429705A (enrdf_load_stackoverflow)
IT (1) IT993485B (enrdf_load_stackoverflow)
NL (1) NL7311039A (enrdf_load_stackoverflow)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59147430A (ja) * 1983-02-10 1984-08-23 Oki Electric Ind Co Ltd 微細回路の形成方法
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
JPS62185896A (ja) * 1986-02-10 1987-08-14 Mitsubishi Motors Corp 部分めつき方法
JPS62185895A (ja) * 1986-02-10 1987-08-14 Mitsubishi Motors Corp 部分めつき方法
JPS62185892A (ja) * 1986-02-10 1987-08-14 Kurihara Tokin Kojo:Kk 電気メツキによる立体的模様形成方法
US4782007A (en) * 1987-04-28 1988-11-01 Macdermid, Incorporated Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
US4971715A (en) * 1988-11-18 1990-11-20 International Business Machines Corporation Phenolic-free stripping composition and use thereof
US6524645B1 (en) * 1994-10-18 2003-02-25 Agere Systems Inc. Process for the electroless deposition of metal on a substrate
GB2384493A (en) * 2002-01-23 2003-07-30 Oxley Dev Co Ltd Selective electroless plating of ceramic substrates for use in capacitors
JP5046495B2 (ja) * 2005-04-18 2012-10-10 セーレン株式会社 透明導電性フィルムとその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI3A (fi) * 1843-11-08 Pressjäst

Also Published As

Publication number Publication date
FR2211545B1 (enrdf_load_stackoverflow) 1977-08-12
DE2363099A1 (de) 1974-07-04
GB1429705A (en) 1976-03-24
CA986772A (en) 1976-04-06
FR2211545A1 (enrdf_load_stackoverflow) 1974-07-19
JPS4990640A (enrdf_load_stackoverflow) 1974-08-29
IT993485B (it) 1975-09-30
BE804148A (nl) 1973-12-17

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Legal Events

Date Code Title Description
BA A request for search or an international-type search has been filed
BV The patent application has lapsed